Who Actron is
Actron Technology (8255.TW) is a 25-year automotive power-semiconductor house whose original product is the diode inside an alternator. That heritage is the point it now sells into industrial electronics: auto-grade reliability, applied to power modules rather than to commodity diodes.
It is not on NVIDIA's published 800 VDC list. It is here because it published a dated three-stage AI-power roadmap that puts HVDC 800V in 2027–2030, and because it said custom HVDC modules for a domestic customer are exclusive to Actron, already in sampling and small volume.
Chip supply is a virtual IDM rather than a full IDM: Anjet (nearly 50% owned, consolidated from 2025Q3) designs SiC; X-Fab in the US and Mosel Vitelic run the wafers; GlobalWafers supplies substrates. Design through packaging is kept inside that group.
Business mix
Still a car-parts company on the reported numbers, with the mix being steered away from the legacy diode:
- Conventional diodes — falling, guided from 29% of 2025 revenue to 18% in 2026.
- High-efficiency diodes (LLD/ULLD) — still the growth engine inside the auto book, guided +25% to 30% in 2026. Together with conventional diodes, about 50% of sales.
- xEV, including 48 V — guided from 22% to 32% of 2026 revenue.
- Industrial electronics — a new division aimed at five sockets: AI data-center HVDC/SST, energy storage, EV chargers, motor drives, and UPS. Discrete SiC/GaN (TO-247, TOLL, QDPAK) is in customer sampling; 650 V to 3300 V SiC modules are the product Actron considers its strength. AI-related industrial modules have started shipping in small volume.
On auto IGBT, Chinese price competition has pushed Actron off its own brand and onto foundry service. Industrial AI is the opposite: own-brand modules, with less mainland supply-chain interference because of geopolitics.
Where it sits in the NVIDIA 800 VDC stack
In the power module that sits inside the conversion stages — the shelf, the rack, and eventually the solid-state transformer above the rack — rather than in the PSU brand on the front of the box.
Management's own calendar:
| Stage | Window | Architecture |
|---|---|---|
| 1 | 2024–2026 | Low-voltage distributed; silicon MOSFET/diode |
| 2 | 2027–2030 | Centralised HVDC 800V; SiC and GaN |
| 3 | 2031–2035 | HVDC plus SST; high-voltage SiC/GaN modules |
It has developed 1700 V and 3300 V SiC chips with SST and grid applications in mind. Custom HVDC modules for a domestic customer are exclusive; standard and custom modules are in small production, with the industrial catalogue guided to 70–80% complete by end-2026. Discrete parts are still sampling.
The customer is unnamed — NDAs, and previously reported identities were not confirmed. 2026 industrial-module revenue is guided at tens of millions of NT dollars, with a real contribution from 2027. Treat this as a dated exclusive socket at sampling, not as 2026 earnings.