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Taiwan Semiconductor Earnings

Fositek (6805.TW) · call date 2026-03-05

Fositek (6805.TW) Q4 2025 Earnings Call: server mix 36%, a claimed main QD seat on NVIDIA GB200/GB300 Switch

FY2025 revenue NT$12.41bn, gross margin 26.34%, EPS NT$31. Server products jumped to 36.3% of sales. Management claims a main QD supplier seat on NVIDIA GB200/GB300 Switch; B/R cold-plate QDs are NVIDIA-decided. The call never said 800 V.

At a glance. Server products — slides and liquid-cooling QDs — went from 5.3% to 36.3% of the company in one year. FY2025 EPS NT$31. Management claims it is a main quick-disconnect supplier on NVIDIA GB200 / GB300 Switch, and that Blackwell / Rubin cold-plate QDs are NVIDIA-decided. 2026 capacity targets: slides 350,000 sets a month, QDs 3 million pcs a month. The call never said 800 V.

What changed this quarter

The mix flipped. Foldable-phone hinges are still more than half of sales, but they are no longer the growth engine. Server revenue was NT$4.505bn, +936%, 36.3% of the group. Q4 gross margin 29.05% is what that mix looks like in a single quarter.

The QD claim was put on NVIDIA by name. GB200 / GB300 Switch QDs: main supplier, high share. B/R (Blackwell / Rubin) water-plate QDs: the supplier is chosen by NVIDIA. AWS and Google TPU QDs were still in qualification.

2026 was called a foldable-phone first year as well as an AI year. Apple is expected to launch a foldable; Huawei keeps up/down, left/right, outward-fold and a tri-fold. That is a second story. It is not the cooling story.

The numbers

FY 2025ValueChange
RevenueNT$12.414bn (~US$394m)+51.61% YoY
Gross profitNT$3.27bn (~US$104m)+78.98% YoY
Gross margin26.34%+4.03pp vs 22.31% in 2024
Net incomeNT$2.125bn (~US$67.5m)+73.19% YoY
EPSNT$31 (~US$0.98)
Q4 2025ValueChange
RevenueNT$3.976bn (~US$126m)+43.54% YoY, +11.5% QoQ
Gross margin29.05%+9.85pp YoY
Net incomeNT$752m (~US$23.9m)+82.08% YoY
EPSNT$10.96 (~US$0.35)

Year-end cash NT$7.446bn (~US$237m). Current ratio 197.47%. Liability ratio 51%. Operating cash inflow NT$1.97bn (~US$62.5m). Investing outflow was described as capacity and tool replacement.

NVIDIA 800V read-through

No 800 V. Fositek is a quick-disconnect and slide name on the same liquid-cooled cabinet NVIDIA's 800 V architecture still has to keep at 45°C.

What this call actually adds to that file:

  • Switch QDs. Company-stated main-supplier seat on NVIDIA GB200 / GB300 Switch, with a high share.
  • Cold-plate QDs on B/R. Asked whether the Blackwell / Rubin water-plate QD supplier is NVIDIA-decided, management said yes.
  • ASIC QDs. AWS and Google TPU fittings were in qualification. Vietnam automation is the production plan. QDs are a second-tier part: price and allocation are set by the end customer. Some volume goes through the chassis parent; some is customer-directed.
  • Why QDs multiply. In a heavy, crowded AI chassis, modules have to come apart for service. Welding is "not practical." As liquid penetration rises, QD count per tray rises. UQD (chassis-to-rack, including floating joints) and MQD (smaller, inside the box) are different slots, not a single winner.
  • Two-phase. Phase-change raises internal pressure, so the fitting needs more structural strength and is harder to mate. A new QD is being designed with the group.
  • Slides are the other server dollar: higher load from the GB series, stronger materials into B/R, segmented travel because the chassis is packed. CSP ASIC slides (Amazon named) were still qualifying, with 2026 shipment if they pass.

Price: many QD vendors exist, but few pass large-account qualification. Besides Western names, Fositek said it is the main one shipping, capacity is tight, and price is holding.

Segments that moved

LineFY 2025 shareNotes
Foldable-phone hinges56.4%From 82.6% in 2024; absolute dollar still up. Huawei share described as unchanged
Server (slides + QDs)36.3%NT$4.505bn, from NT$435m; +936%
Notebook hinges6.4%From 10.9%

Stated gross-margin order: server > phone hinge > PC hinge. 2026 mix is expected to keep moving that way.

Guidance

  • 2026. Optimistic. Under normal shipment, revenue, gross margin and profit are all expected to grow "a lot" versus 2025. Server is the engine; GB300, Blackwell, Rubin and CSP ASIC programmes are named. Capacity is described as severely short; customers keep asking for more.
  • Capacity targets for 2026: slides 350,000 sets/month, QDs 3 million pcs/month. Vietnam automation is being installed.
  • Phones. 2026 labelled a foldable-phone first year on an expected Apple launch. Huawei: up/down, left/right, outward-fold and tri-fold. Average hinge price seen flat versus 2025; MIM mix is the margin defence.
  • Payout. Ratio expected similar to prior years, subject to the board. Capex is automation and tool replacement.
  • No quarterly NT$ figures were given for 2026.

Management Q&A

Q: What is the 2026 Q1, Q2 and full-year view on revenue, profit and gross margin?

A: Global data-center build-out continues and liquid-cooling penetration is rising, so the company is constructive on 2026. Under normal shipment, revenue, gross margin and profit are all expected to grow a lot versus last year. Capacity is severely insufficient, and customers keep asking it to expand.

Q: How should 2026 product growth be ranked, and will revenue rise quarter by quarter?

A: The main engine is still server products. As GB300, Blackwell, Rubin and the various ASIC programmes go into production, operations should keep improving, and full-year revenue is expected to grow a lot versus last year.

Q: What is the phone-business growth target this year, and which foldables will Huawei launch?

A: Apple is expected to launch a foldable this year, which should bring a replacement cycle, so management treats 2026 as the foldable-phone first year and is constructive. Huawei's 2026 foldable range includes up/down, left/right, outward-fold and the distinctive tri-fold.

Q: Is Fositek still Huawei's largest hinge supplier, and how should long-term allocation be read?

A: Its supply share at Huawei has stayed fixed; Huawei adjusts the competitors. The set has gone from a US rival, to Taiwan and China names, and now — on harder products such as the tri-fold — back toward US firms. Fositek's own ratio, it said, has not been cut.

Q: How do phone-hinge price and gross margin change this year?

A: Average price is expected to be about the same as last year. The company will keep improving process, including a higher MIM share, and hopes gross margin can hold prior levels.

Q: Besides Huawei and Motorola, are there new phone customers?

A: The company is well known in the industry and keeps being asked to co-develop new programmes. No new name was given.

Q: What is the slide-revenue outlook this year?

A: AI demand is very strong. Management is very optimistic that server products will grow by a multiple.

Q: How do NVIDIA GB and B/R (Blackwell / Rubin) slides differ in load rating and design?

A: From the GB series onward, slide load ratings already went up. Into B/R, the company also changed materials to add strength. Because the AI chassis is crowded, the design adds segmented travel.

Q: What is the shipment progress on Amazon (AWS) ASIC slides?

A: Several CSP slide programmes are still in qualification. If they go smoothly, shipment is expected to start this year.

Q: What is Fositek's slide edge versus King Slide, Nan Juen and other peers?

A: Design is shared with its chassis-maker parent, so new ideas show up and overlap with other makers' designs is much lower. It also joins new programmes from the first pass, which lowers development difficulty.

Q: What will GB and ASIC QDs contribute this year, and what is the mix?

A: Same as slides: AI demand is very good, so server products are expected to grow by a multiple. No split between GB and ASIC QDs was given.

Q: How do GB and B/R QDs differ in design and usage?

A: The QD design lets cooling modules be modular and easier to service. As AI-server liquid-cooling penetration keeps rising, the number of QDs used will keep rising.

Q: What is the shipment progress on Amazon (AWS) and Google TPU QDs?

A: Both products are still in qualification. The Vietnam plant is installing automation and is expected to produce and ship smoothly this year.

Q: Is the B/R cold-plate QD supplier decided by NVIDIA?

A: Yes. The B/R QD supplier is indeed decided by NVIDIA.

Q: For AWS and Google ASIC QDs, is the part customer-specified or AB-source?

A: QDs are a second-tier qualified part. Price and supplier allocation are set by the end customer. Besides shipping to the parent, some volume is customer-directed.

Q: What is the QD price trend?

A: There are many suppliers, but few pass large-customer qualification. Besides Western vendors, Fositek is the main one shipping. Capacity is tight, so price is holding stable.

Q: How do QDs compare with welding, and will multi-QD designs become the mainstream?

A: In a complex, heavy AI chassis, connections between modules have to go through QDs; pure welding is not practical. Future designs will use more QDs, not fewer.

Q: What is liquid-cooling penetration on CSP ASICs?

A: CSPs are investing very actively in their own ASIC chips, and Fositek said it has those programmes. No penetration percentage was given.

Q: Please update QD and slide capacity plans in China and Vietnam.

A: This year's expansion targets: slides to 350,000 sets a month, QDs to 3 million pcs a month.

Q: What is the progress on other precision parts, such as reducers and gears?

A: The company is developing a differential planetary ball screw, has filed related patents, and is signing NDAs with Chinese and US customers.

Q: What are the payout ratio and capex plans?

A: The payout ratio is expected to be similar to prior years, subject to the board. This year's capex is mainly automation and replacing tools.

Q: How do UQD and MQD differ, and which becomes the mainstream?

A: UQD is mainly the connection between chassis and rack, including floating joints. MQD is smaller and fits inside a space-limited chassis. They are different use cases.

Q: What is the progress on micro QDs?

A: Several programmes are already sampling with customers, and related patents have been filed.

Q: How does a two-phase liquid-cooling QD differ from single-phase?

A: Two-phase cooling removes heat by boiling the fluid, which raises pressure inside the system. That demands higher structural strength from the QD, and mating / unmating is harder. Fositek is developing a new cooling system with the group to deal with those issues.

Q: What is the gross-margin ranking by product, and what is this year's margin and operating-margin outlook?

A: The order is server > phone hinge > PC hinge. As the server share rises and mix improves, overall margin is expected to be better than last year.

Q: How are hinges placed on foldable tablets and foldable notebooks?

A: Flexible displays are spreading, and applications are moving toward larger sizes. The company will keep developing new form-factors with customers.

Disclaimer

English notes on Fositek's investor conference of 5 March 2026, covering Q4 and full-year 2025. Figures are as presented by management and have not been independently verified. USD equivalents are approximate at about NT$31.5 to the dollar. Later 2026 calls in this archive failed transcription. For reference only; not investment advice.

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