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友通 2025Q2 法人說明會
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法人說明會
友通 2025Q2 法說會簡報重點與營運摘要

DFI (友通) [DFI] 2025 Q1 法說會簡報

Company Overview

Date: 2025年5月28日

Agenda

  • 2025第一季財務結果及業務摘要
  • 營運展望
  • Q & A

Disclaimer

本次法說會提供之簡報包含前瞻性陳述, 內容包含本公司財務狀況、未來擴張計劃及公司策略等訊息。前瞻性聲明涉及風險及不確定性,實際結果可能與預期存在重大差異。


Financial Highlights

Consolidated Income Statement Summary

單位: 新台幣千元 (Unit: NT$ Thousand)

項目 (Item)2024年第四季 (2024 Q4)2025年第一季 (2025 Q1)2024年第一季 (2024 Q1)
銷貨淨額 (Net Sales)2,985,126 (100.0%)2,598,900 (100.0%)1,906,186 (100.0%)
營業成本 (Cost of Goods Sold)(2,120,265)(1,859,949)(1,380,731)
營業毛利 (Gross Profit)864,861 (29.0%)738,951 (28.4%)525,455 (27.6%)
營業費用 (Operating Expenses)(585,097) (-19.6%)(539,546) (-20.8%)(451,199) (-23.7%)
營業淨利 (Operating Income)279,764 (9.4%)199,405 (7.7%)74,256 (3.9%)
營業外收支及費用 (Non-operating Income and Expenses)26,496(19,716)680
稅前淨利 (Income Before Tax)306,260 (10.3%)179,689 (6.9%)74,936 (3.9%)
本期淨利 (Net Income for the Period)237,389 (8.0%)138,713 (5.3%)54,831 (2.9%)
本期淨利歸屬於母公司業主 (Net Income Attributable to Owners of the Parent)179,744 (6.0%)106,558 (4.1%)51,950 (2.7%)
基本每股盈餘(NT$)(a) (Basic EPS (NT$)(a))$1.57$0.93$0.45

Revenue Composition Analysis

總營收 (Total Revenue):

  • 2025年第一季: 2,599 NT$M
  • 2024年第一季: 1,906 NT$M

2025 應用 (2025 Application)

  • Automation: 43%
  • Embedded: 38%
  • Security: 19%

2025 區域 (2025 Region)

  • Asia Pacific: 48%
  • America: 28%
  • EMEA: 24%

2025 產品 (2025 Product)

  • OT Service: 43%
  • Computer on Module: 26%
  • AI Security: 19%
  • Computer in Box: 8%
  • Computer with Panel: 4%

2024 應用 (2024 Application)

  • Embedded: 41%
  • Automation: 37%
  • Security: 22%

2024 區域 (2024 Region)

  • Asia Pacific: 59%
  • EMEA: 22%
  • America: 19%

2024 產品 (2024 Product)

  • OT Service: 37%
  • Computer on Module: 26%
  • AI Security: 22%
  • Computer in Box: 14%
  • Computer with Panel: 1%

Consolidated Balance Sheet Summary

單位: 新台幣千元 (Unit: NT$ Thousand)

項目 (Item)2025.03.312024.12.312024.03.31
現金及約當現金 (Cash and Cash Equivalents)2,243,515 (19%)2,512,850 (21%)1,544,646 (17%)
應收票據及帳款(含關係人) (Notes and Accounts Receivable (incl. related parties))2,142,787 (18%)2,391,984 (19%)1,878,919 (22%)
存貨 (Inventories)2,285,510 (19%)2,079,464 (17%)1,755,982 (20%)
不動產、廠房及設備 (Property, Plant and Equipment)2,275,844 (19%)2,287,843 (19%)2,351,456 (26%)
總資產 (Total Assets)11,975,167 (100%)12,338,424 (100%)8,940,746 (100%)
流動負債 (Current Liabilities)4,314,384 (36%)4,224,426 (34%)3,075,562 (34%)
非流動負債 (Non-current Liabilities)2,077,067 (17%)2,276,771 (19%)1,171,443 (13%)
權益總計 (Total Equity)5,583,716 (47%)5,837,227 (47%)4,693,741 (53%)
每股淨值 (NT$) (Net Asset Value per Share (NT$))28.5230.6725.24

Important Financial Indicators

項目 (Item)2025.03.312024.12.312024.03.31
應收帳款週轉天數 (Days Sales Outstanding (DSO))808491
存貨週轉天數 (Days Inventory Outstanding (DIO))107125120
應付帳款週轉天數 (Days Payables Outstanding (DPO))776962
營運資金週轉天數 (Cash Conversion Cycle (CCC))110140149
權益報酬率(年化)(a) (Return on Equity (Annualized)(a))9.7%9.1%4.5%
流動比率 (Current Ratio)159%170%173%
金融負債比率 (b) (Financial Debt Ratio (b))25%27%20%

Footnotes:

  • (a) 採年化稅後損益/平均權益總額
  • (b) 金融負債包含長短期借款

Business Segments

Operational Outlook

友通邊緣 AIoT 一站式產品&服務

  • 驅動專業技術×產業協作,迎向邊緣AI應用新浪潮

AI夥伴共構全方位邊緣解決方案

  • Full Edge AI portfolios
  • Key verticals: smart factory, defense, entertainment, medical, smart city...
  • 3-in-1 solutions powered by global AI partners (HW+SW+Service)

創新研發實力

  • 40+ yrs of experience for power, signal, thermal, FW/BIOS/OS customization on x86 & ARM platforms
  • Value-added Technology (e.g., OOB)

全球在地化服務

  • Integrated supply chain
  • Local manufacturing & service
  • Non-China key components

快速客製,彈性擴充

  • 70% custom builds start from standard platforms
  • Agile, market-tuned development
  • Scalable AI via DFM & flexible form factors

公司規模與經驗

  • 員工數: 1,400+ WORLD EMPLOYEES
  • 全球據點: 40+ WORLDWIDE SITES
  • 產業經驗:
    • 20+ YEARS Networking
    • 30+ YEARS Industrial Automation
    • 40+ YEARS Embedded

全球佈局與能力

  • AMERICA: Sacramento DFI: Sales, Technical Support, RMA, Manufacturing
  • EUROPE: ROTTERDAM DFI: Sales, Technical Support, RMA, Manufacturing (CM)
  • KOREA: SEOUL DFI AEWIN: Sales
  • JAPAN: TOKYO DFI: R&D, Sales, Technical Support, RMA
  • CHINA: Multiple locations including Suzhou, Shenzhen, Beijing, Tianjin
  • INDIA: HARTANA DFI: Sales, Technical Support, RMA, Manufacturing (CM)
  • VIETNAM: HA NAM Qisda: Manufacturing (BenQ)
  • TAIWAN: TAIPEI (HQ) DFI: R&D, Sales, Technical Support, RMA, Logistics, Manufacturing (DFI)

DFI 邊緣 AIoT 關鍵產品線

  • 混合雲架構 (Hybrid Cloud Architecture)
  • Global Market CAGR% (2025~2030):
    • 雲端AI (Cloud AI): 39.7%
    • 邊緣AI (Edge AI): 21.7%

近邊緣運算層 (near edge)

  • Hardware: Edge Server
  • DFI邊緣輕型伺服器產品線
    • RM645-SO630 (Processor: AMD EPYC)
    • RM646-ERX810 (Processor: Intel XEON, # Dual CPUs)

遠邊緣運算層 (far edge)

  • Hardware: Edge Device
  • DFI邊緣AI系統產品線
    • Heterogeneous Computing
    • X6-ORN (Processor: NVIDIA JETSON)

Q & A

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