MiRLE 盟立集團 (Mirle Group) (2464) 2024Q3 法說會簡報
Company Overview
關於盟立 (About Mirle)
- 公司名稱: 盟立自動化股份有限公司 (Mirle Automation Corporation)
- 成立日期: 1989年2月 (February 1989)
- 董事長兼總裁: 孫弘 博士 (Dr. Houng Sun)
- 執行長: 林世東 (Shih-Tung Lin)
- 總公司地址: 新竹科學工業園區研發二路三號 (No. 3, Yanfa 2nd Rd., Hsinchu Science Park)
- 資本額: 約 20.5 億 (Approx. NTD 2.05 billion)
- 集團員工人數: 約 1400 名 (Approx. 1400 people)
- 公司股票上市 (代號): 2464 (Stock Code: 2464)
品牌核心 (Brand Core)
以AI智能科技給予全面且符合效益的方案,滿足客戶整廠自動化的需求 (Providing comprehensive and effective solutions with AI intelligent technology to meet customer needs for whole-plant automation).
價值主張 (Value Proposition)
以穩定可靠的整廠自動化能力,有效提升客戶競爭力 (Enhancing customer competitiveness with stable and reliable whole-plant automation capabilities).
關係 (Relationship)
共同成長且可靠的專業夥伴 (Growing together as reliable professional partners).
主要客戶 (Key Customers)
- 半導體 (Semiconductor)
- 物流 (Logistics)
- 面板 (Panel)
- 資訊 (Information)
- 機械 (Machinery)
- 食品 (Food)
- 汽車零件 (Automotive Parts)
- 觸控面板 (Touch Panel)
Financial Highlights
年營收及毛利 Revenue & Gross Profit by Year
| Year | 合併營收 Revenue | 營業毛利 Gross profit | 營業毛利率 GP % |
|---|---|---|---|
| 2020 | 8,909 | 1,883 | 21.1% |
| 2021 | 9,861 | 2,045 | 20.7% |
| 2022 | 10,769 | 1,877 | 17.4% |
| 2023 | 8,813 | 1,450 | 16.5% |
| 2024Q3 | 5,360 | 1,003 | 18.7% |
年度產品別營收 Revenue by Product Category
| Product Category | 2020 | 2021 | 2022 | 2023 | 2024Q3 |
|---|---|---|---|---|---|
| 智能自動化系統 (Intelligent Automation System) | 18% | 24% | 20% | 26% | 17% |
| 半導體設備系統 (Semiconductor System) | 34% | 12% | 19% | 38% | 44% |
| 光電面板自動化系統 (FPD Automation System) | 4% | 36% | 40% | 16% | 23% |
| 數位科技 (Digital Technology) | 34% | 21% | 11% | 10% | 6% |
| 其他自動化產品 (Other Niche Key Product) | 9% | 7% | 10% | 10% | 11% |
合併季營收 Revenue by Quarter
- 2023 3Q: 2,404
- 2023 4Q: 2,064
- 2024 1Q: 1,431
- 2024 2Q: 1,744
- 2024 3Q: 2,185
營業費用 Operating Expenses
| Year | 2020 | 2021 | 2022 | 2023 | 2024 3Q |
|---|---|---|---|---|---|
| 佔營收比 (Operating Expense Ratio to Revenue) | 13.6% | 13.7% | 14.1% | 16.4% | 18.6% |
| 研發費用 R&D | 423 | 396 | 499 | 504 | 376 |
| 管理費用 General & administrative | 433 | 510 | 536 | 558 | 346 |
| 銷售費用 Sales & marketing | 360 | 447 | 481 | 382 | 276 |
綜合損益表 Statements of Comprehensive Income (YTD)
| Metric | 2024Q1~Q3 | 2023Q1~Q3 | 2023 |
|---|---|---|---|
| 營業收入淨額 Net Revenue | 5,359,922 | 6,748,408 | 8,812,743 |
| 營業毛利率 Gross Margin | 18.71% | 14.86% | 16.46% |
| 營業費用 Operating Expense | 998,460 | 1,082,115 | 1,443,827 |
| 營業費用率 Operating Expense Ratio | 18.63% | 16.04% | 16.38% |
| 營業淨利 Operating Margin (NTD) | 3,300 | 31,374 | 13,357 |
| 營業淨利率 Operating Margin (%) | 0.06% | 0.46% | 0.15% |
| 營業外收入及支出 Non-Operating Items | 40,992 | 21,072 | 230,673 |
| 本期淨利 Net Income | 51,091 | 31,979 | 182,762 |
| 每股盈餘(元) EPS(NT Dollar) | 0.23 | 0.14 | 0.89 |
綜合損益表 Statements of Comprehensive Income (Quarterly & Change)
| Metric | 3Q/2024 | 2Q/2024 | 3Q/2023 | 季變化 (QoQ Change) | 年變化 (YoY Change) |
|---|---|---|---|---|---|
| 營業收入淨額 Net Revenue | 2,185,324 | 1,743,603 | 2,404,189 | 25.3% | -9.1% |
| 營業毛利率 Gross Margin | 20.4% | 19.8% | 15.3% | 0.6% | 5.1% |
| 營業費用 Operating Expense | 385,212 | 352,169 | 366,185 | 9.4% | 5.2% |
| 營業費用率 Operating Expense Ratio | 17.6% | 20.2% | 15.2% | -2.6% | 2.4% |
| 營業淨利 Operating Margin (NTD) | 60,492 | (7,398) | 846 | NA | 7050.4% |
| 營業淨利率 Operating Margin (%) | 2.8% | -0.4% | 0.0% | 3.2% | 2.7% |
| 營業外收入及支出 Non-Operating Items | (42,464) | 27,900 | 19,820 | -252.2% | -314.2% |
| 本期淨利 Net Income | 21,501 | 14,683 | 4,176 | 46.4% | 414.9% |
| 每股盈餘(元) EPS(NT Dollar) | 0.10 | 0.07 | 0.02 | 0.03 | 0.08 |
Business Segments
在手訂單 Order in Hand (by Product Category)
- 半導體設備系統 (Semiconductor System): 48%
- 智能自動化系統 (Intelligent Automation System): 18%
- 光電面板自動化系統 (FPD Automation System): 18%
- 其他自動化產品 (Other Niche Key Product): 10%
- 數位科技 (Digital Technology): 6%
機器人應用 (Robotics Applications)
- Products/Technologies: OHT (Overhead Hoist Transport), EFEM (Equipment Front End Module), AMR (Autonomous Mobile Robot), Stocker (For Semi & FPD).
- Utilizes Mirle's self-developed industrial robot technology.
- Beyond robot bodies and harmonic reducers, drive components, vision systems, and robot peripheral system integration have been applied to the semiconductor and other industries.
- Initiating humanoid robot application layout.
- Through invested companies in Taiwan and mainland China, product development and strategic industrial collaborations are underway for critical robot components such as:
- 諧波減速機 (harmonic reducers)
- 關節模組 (joint modules)
- 靈巧手 (dexterous hands)
- 一體輪 (integrated wheels)
- 移動式底盤關鍵模組 (mobile chassis key modules)
- Actively entering the supply chain system for key development stages of humanoid robots.
- Outlook: Starting in 2025, Mirle will promote the application of humanoid/human-like robots in semiconductor, logistics, and EMS industries for lights-out factories and other fields.
半導體 (Semiconductor)
- Products/Technologies: Key self-manufactured equipment includes OHT, EFEM, Stocker, AGV, and AI automation control software such as MCS (Manufacturing Control System), WMS (Warehouse Management System), DCS (Distributed Control System), etc., focusing on whole-plant automation system integration.
- Outlook:
- Rising demand for high-end packaging (e.g., GPU, HBM). Orders received in Q3, and capital investment driven by high-end packaging and related applications is expected to continue until 2027.
- Mirle has years of experience with complete FOPLP (Fan-Out Panel Level Packaging) automation systems and is the company with the most automation system application experience in Taiwan.
- In response to rapid future market demand, planning related to target customers has begun.
- Continuing to jointly develop next-generation equipment based on Glass-core technology with international equipment manufacturers.
- Initiating humanoid robot application projects in the semiconductor industry, providing more complete system integration solutions.
- Orders in Taiwan, Southeast Asia (Malaysia, Singapore, Thailand, etc.), and China markets are expected to continue growing in 2025.
新能源應用 (New Energy Applications)
- Products/Technologies: Immersion Cooling automation system.
- Outlook:
- Immersion Cooling automation system development and integration has received orders from semiconductor target customers.
- Currently undergoing various system validations and data collection.
- Cooperation areas for related systems include (1) production manufacturers and (2) server users.
- Customer demand for cooling systems will gradually become clearer, and full application results are expected to be established in 2025.
AI (Artificial Intelligence / Metaverse)
- Strategic Initiatives:
- Collaborating with Nvidia to use the Omniverse platform to build virtual factories.
- Integrating equipment 3D models, physical simulation, Building Information Modeling (BIM) for factory buildings, heat transfer and airflow simulation, structural analysis, and production management systems.
- Achieving cyber-physical integration (虛實整合) and digital twin (數位孿生) technology through AI deep learning.
- Focusing on optimizing the operational efficiency of automation systems, creating higher value for automation systems built for semiconductor customers.
- Developing digital twins (數位分身) for each piece of equipment, combining OT (Operational Technology) and IT (Information Technology) technologies to build cyber-physical integration systems for smart factories.
- Becoming an optimal platform for internal technology and external customer validation, significantly shortening the time and cost for automation system setup and capacity expansion.
智能自動化物流 (Intelligent Automation Logistics)
- Products/Technologies: Shuttle Cart, AGV, humanoid robots as core equipment.
- Paired with self-developed logistics control systems, war room systems, and cyber-physical integration technologies to help customers achieve whole-plant intelligent logistics.
- Outlook: Due to changes in customer production manufacturing and related supply chain global layouts, demand for logistics centers and whole-plant intelligent automation in EMS in Europe, America, Middle East, and Southeast Asian markets (Vietnam, Thailand, Malaysia, etc.) will increase.
光電面板 (FPD Panel)
- Outlook:
- Demand for new large-scale automation system projects is unclear in the short term.
- Demand for equipment updates and production line upgrades in Taiwan and mainland China markets will still exist.
- Potential demand for new panel factories in emerging Asian markets in 2025-2026, which will help increase orders.
Additional Data
免責聲明 (Disclaimer)
- The information contained in this presentation and its accompanying announcements, including content relating to business outlooks, financial operations, is based on information derived from internal corporate data and external economic developments as a whole.
- The company's finance, business and Q&A made in this presentation could be different from the future actual results. This may be due to various factors, including but not limited to market demands, changes in policies and regulations and overall economic conditions, and other factors or risks beyond the Company's control.
- The Company is not responsible for updating or amending changes or adjustments made to the contents of this presentation, if such changes or adjustments should occur in the future.