返回搜尋
翔名 2025Q2 法人說明會
8091上櫃
法人說明會
翔名 2025Q2 法說會簡報重點與營運摘要

翔名科技股份有限公司 (Feedback Technology Corp.) 2025Q1 法說會簡報

Company Overview

  • Company Name: 翔名科技股份有限公司 (Feedback Technology Corp.)
  • Event: 法人說明會 (Investor Conference)
  • Date: 2025.05.28
  • Chairman: 吳宗豐 (Wu Tsung-Feng)
  • Slogan: Challenge Infinity
  • Established Date: December 27, 1991
  • Capital: NT$ 528 million
  • Employee Count: 402 (Group: 457)
  • Main Business Scope: 半導體、光電、航太、醫療 (Semiconductor, Optoelectronics, Aerospace, Medical)
  • Operating Locations: Hsinchu, Taichung, Tainan, Nanjing, Shanghai
  • Production Locations: Hsinchu, Nanjing, Japan
  • Main Products: 半導體設備關鍵零組件 (Key components for semiconductor equipment)

Financial Highlights

2.1 Consolidated Income Statement (新台幣仟元 - NT$ Thousands)

Metric1Q254Q241Q24QoQYoY
營業收入 (Revenue)472,163486,850482,447(3%)(2%)
營業毛利 (Gross Profit)152,540153,664170,898(1%)(11%)
營業毛利率 (Gross Margin)32.3%31.6%35.4%0.7ppts-3.1ppts
營業費用 (Operating Expenses)88,12293,95979,168(6%)11%
營業利益 (Operating Income)64,41859,70591,7308%(30%)
營業利益率 (Operating Margin)13.6%12.3%19.0%1.3ppts-5.4ppts
營業外收入及支出 (Non-operating Income/Expenses)20,84942,94130,493(51%)(32%)
所得稅費用 (Income Tax Expense)22,47114,33818,08757%24%
本期淨利 (Net Income)62,79688,308104,136(29%)(40%)
淨利率 (Net Profit Margin)13.3%18.1%18.0%-4.8ppts-4.7ppts
基本每股盈餘 (Basic EPS)1.201.662.17-28%-45%

2.2 Consolidated Balance Sheet (新台幣仟元 - NT$ Thousands)

Item1Q25 Amount1Q25 %4Q24 Amount4Q24 %1Q24 Amount1Q24 %
現金及約當現金 (Cash & Cash Equivalents)2,211,00742%2,127,15941%1,138,17026%
透過損益按公允價值衡量之金融資產 - 流動 (FVTPL Financial Assets - Current)00%00%91,3132%
應收票據及應收帳款 (Notes & Accounts Receivable)357,2057%360,9157%350,6988%
存貨 (Inventories)599,39811%581,77911%576,97513%
流動資產 (Current Assets)3,205,36661%3,116,85860%2,387,97854%
不動產、廠房及設備 (Property, Plant & Equipment)1,790,63034%1,794,91935%1,759,80340%
資產總計 (Total Assets)5,256,643100%5,163,748100%4,394,596100%
一年內到期之長期借款 (Current Portion of Long-term Borrowings)94,6842%94,6842%259,2296%
應付帳款 (Accounts Payable)171,1043%185,4244%192,0594%
流動負債 (Current Liabilities)1,010,37419%550,42911%989,15523%
應付公司債 (Bonds Payable)523,49410%520,78110%--
長期借款 (Long-term Borrowings)208,4354%231,7134%429,25410%
權益總計 (Total Equity)3,499,54967%3,845,24074%2,963,96367%

2.3 Sales Analysis by Industry (銷售分析-產業別)

Year/QuarterSemi-MFGServiceLED&LCD
202071%20%9%
202169%23%9%
202274%20%6%
202373%22%4%
202472%23%5%
2025Q173%19%8%

2.4 Net Profit Margin & EPS Trend (淨利率與EPS趨勢)

Year/QuarterEPS淨利率 (Net Profit Margin)
20204.0013%
20215.9216%
20229.8322%
20235.9816%
20247.5019%
2025Q11.2013%

2.5 Recent Dividends (近年股利)

Year現金股利 (Cash Dividend)股利配發率 (Dividend Payout Ratio)
20202.5865%
20213.9166%
20227.0071%
20236.00100%
20248.00107%

Business Segments

1.5 Business Segments & Capabilities

  • 代理 (Agency):

    • Establishment of cooperative relationships with semiconductor clients.
    • Entered the supply chain for key semiconductor consumables - ion implanters.
    • Sales and after-sales service for international brand turbo pumps.
    • Agency for other semiconductor equipment accessories such as graphite products.
  • 製造 (Manufacturing):

    • Established independent production lines.
    • Established product traceability and quality management systems.
    • Obtained certifications from five international semiconductor equipment manufacturers.
    • Achieved various international management system certifications (ISO 9001, ISO 45001, ISO 14001, AS9100, ISO 13485).
  • 研發 (R&D):

    • Development of key special processing technologies.
    • Taiwan's first electroless nickel production line certified by OEM.
    • Continuous investment in R&D and patented technologies.
  • 擴展 (Expansion):

    • Conducted upstream and downstream integration and strategic alliances.
    • Expanded technology applications to non-semiconductor fields such as server cooling systems.

Products & Technologies

5.1 Manufacturing Technology & Production Lines

  • Products & Services:
    • 精密加工 (Precision Machining)
    • 光學鍍膜 (Optical Coating)
    • 陽極 (Anodizing)
    • 無電解鎳 (Electroless Nickel)
    • 自動清洗 (Automated Cleaning)
    • 設備組裝 (Equipment Assembly)
    • 抗微粒處理 (Anti-particle Treatment)
    • 雷射融覆 (Laser Cladding)
    • 電子束焊接 (Electron Beam Welding)
    • 特殊焊接 (Special Welding)

5.5 New Revenue Drivers - Custom Equipment (新的營收動力-客製化設備)

  • Current Status: Currently, self-designed and developed equipment is mainly for internal factory use.
  • Equipment Under Development:
    • Automated equipment for non-semiconductor applications.
    • Special ceramic component cleaning equipment for semiconductor fabs.

Clients & Markets

1.6 Recent Awards

  • 2019: 第五屆潛力中堅企業 (5th Potential Taiwan Mittelstand Award) - Awarded by Ministry of Economic Affairs.
  • 2023: 第20屆國家品牌玉山獎 傑出企業類-全國首獎 (20th National Brand Yushan Award - Outstanding Enterprise Category - National First Prize).

Outlook & Strategy

4.1 Industry Overview & Outlook

  • SEMI Forecast: 18 new fab constructions expected in 2025.
  • Global Semiconductor Capacity Outlook: Taiwan's fab capacity share projected to increase.

4.3 Future Industry & Market Layout

  • Global Semiconductor Market Forecast: Expected to grow by 15% in 2025, with AI as a key driver.
  • Feedback Technology's Industry Layout: Focus on advanced semiconductor process R&D and diversification.

Additional Data

1.5 Development Milestones

  • 1991: 創立 (Founded)
  • 2004: 上櫃 (Listed on OTC)
  • 2025: 嘉義馬稠後擴廠計畫啟動 (Chiayi Machouhou expansion project initiated)

3.1 Overview

  • 1Q25 vs 4Q24 (QoQ): Revenue decreased by 3%, Gross Profit decreased by 1%, Net Income decreased by 29%.
  • 1Q25 vs 1Q24 (YoY): Revenue decreased by 2%, Gross Profit decreased by 11%, Net Income decreased by 40%.

🤖 FinmoAI

BETA
AI 驅動 • 法說會分析
法說會逐字稿
生成重點摘要和投資要點
挖掘潛在投資機會
體驗 AI 智能分析

📱 即時通知服務

加入我們的 Telegram 機器人 @diveinvest_bot,每晚 8 點自動推送最新法說會簡報。

加入 Telegram 通知