CHIPBOND 頎邦 (6147) 2025Q2 法說會簡報

Company Overview

• Company Name: CHIPBOND
• Presentation Period: 2025Q2

Financial Highlights

• Capacity Utilization Rate (產能利用率):
  • 2020: Started around 65%, peaked near 78%, ended around 75%.
  • 2021: Rose from ~75% to ~90%, then to ~100%.
  • 2022: Maintained ~100% for Q1/Q2, then sharply dropped to ~70%.
  • 2023: Fluctuated between ~65% and ~70%.
  • 2024: Dropped from ~65% to ~55%, then rose to ~65%, ending around 60%.
  • 2025 (Forecast): Expected to rise from ~60% to ~65%.

Business Segments

• Application Segments (Implied Market Share/Revenue Distribution):
  • Phones
  • TV
  • Non Driver
  • IT
  • Auto

Products, Services & Technology

• Industry: 封測產業 (Packaging and Testing Industry)
• Primary Interconnecting Method:
  • 打線 (Wire Bonding): Accounts for > 70% of the market.
    • Typical ICs: Most IC
    • Key Players: ASE, SPIL, Amkor
• Bumping Technology (凸塊):
  • Solder Bumps:
    • Applications: CPU and Graphic Processors
    • Key Players: Intel and TSMC
  • Gold Bump (金凸塊 / Au):
    • Applications:
      • LCD Driver IC
      • RFID
      • Display Driver IC
      • RF Front End
      • Smart Card
      • Finger Print Sensor
    • Key Players: Chipbond, Nepes
    • Requirement: Gold is essential for driver IC interconnects.
    • Technical Specifications (from SEM images):
      • Image 1: SE 25-May-01, WD32.8mm 15.0kv x1.2k 25um
      • Image 2: SE 25-May-01, WD33.9mm 15.0kv x1.2k 25um
• Production Process (生產流程):
  1. Bumping: Initial process step.
  2. Testing: Follows bumping.
  3. Assembly/Integration Options (from Testing):
     • Chip on Glass
     • Chip on Film (requires "Film" input)
• Assembly Technologies:
  • CHIP ON FILM:
    • Components: PCB, Glass, PCB board, Film (e.g., J01XFUEBB-X001, J01XFUEBB-X001)
  • CHIP ON GLASS:
    • Components: Glass, PCB board
• Service Offerings & Capabilities by Application:

Key Charts, Graphs, and Data Points

• SELLTHROUGH Data (Units likely in millions):

Future Outlook and Guidance

• Future Challenges (未來挑戰):
  • 關稅 (Tariffs)
  • 匯率 (Exchange Rate)
  • 金價 (Gold Price)