Ta Liang Technology Co., Ltd. (3167) 2025Q2 法說會簡報
Company Overview
- Company Name: Ta Liang Technology Co., Ltd. (大量科技股份有限公司)
- Stock Code: 3167
- Capital: NTD 883,617,870
- Chairman: Laurie Wang
- General Manager: Jackie Chien
- Headquarters: No. 68, Fengtian Rd., Bade Dist. Taoyuan City, Taiwan (R.O.C.)
- Factories: Bade, Nanjing, Lianshui
Business Scope
- PCB Business Unit (PCB BU)
- Standard & High-end PCB Drilling Machine
- Standard & High-end PCB Routing Machine
- Automation
- Others
- Semiconductor Business Unit (Semiconductor BU)
- Metrology Series
- AOI Series
- Automation Series
- TL Technology Team
- R&D, Purchasing, Production, Sales, Service, Management
Production & Service Base
- Factories:
- Nanjing
- Lianshui
- Bade
- Service/Agents:
- Dongguan (Service)
- India (Service/Agent)
- Thailand (Service)
- Malaysia (Service/Agent)
- Kunshan/Wuxi (Service)
- Vietnam (Service/Agent)
- Korea (Agent)
- Japan (Agent)
- China (Agent)
- H.Q. & R&D Center: Bade
Client List
- TSMC (台灣積體電路製造股份有限公司)
- VIS (世界先進)
- ASE GROUP (日月光集團)
- SPIL (矽品精密)
- Powertech (PTI Technology Inc.)
- WNC (Wistron NeWeb Corp.)
- KYEC
- LINGSEN
- igiant
Financial Highlights
Income Statement
(單位：新台幣千元 NTD Thousand)
| Metric | 2025Q2 | % | 2024Q2 | % | 2025Q1-Q2 | % | 2024Q1-Q2 | % |
|---|---|---|---|---|---|---|---|---|
| Operating Revenue | 1,270,527 | 100.00 | 490,178 | 100.00 | 2,114,283 | 100.00 | 888,989 | 100.00 |
| Operating Costs | 776,851 | 61.14 | 350,405 | 71.49 | 1,331,372 | 62.97 | 682,378 | 76.76 |
| Gross Profit | 493,676 | 38.86 | 139,773 | 28.51 | 782,911 | 37.03 | 206,611 | 23.24 |
| Selling and Marketing Expenses | 91,804 | 7.23 | 50,742 | 10.35 | 165,868 | 7.85 | 95,568 | 10.75 |
| General and Administrative Expenses | 49,885 | 3.93 | 34,090 | 6.95 | 94,584 | 4.47 | 69,651 | 7.83 |
| Research and Development Expenses | 82,525 | 6.50 | 45,199 | 9.22 | 137,464 | 6.50 | 83,365 | 9.38 |
| Expected Credit Impairment Losses (Gains) | 22,560 | 1.78 | 1,195 | 0.24 | 41,813 | 1.98 | 6,969 | 0.78 |
| Operating Expenses | 246,774 | 19.42 | 131,226 | 26.77 | 439,729 | 20.80 | 255,553 | 28.75 |
| Operating Profit (Losses) | 246,902 | 19.43 | 8,547 | 1.74 | 343,182 | 16.23 | (48,942) | (5.51) |
| Non-Operating Income and Expenses | (3,902) | (0.31) | 14,469 | 2.95 | 18,417 | 0.87 | 50,892 | 5.72 |
| Profit Before Income Tax | 243,000 | 19.13 | 23,016 | 4.70 | 361,599 | 17.10 | 1,950 | 0.22 |
| Net Profit for the Period | 175,085 | 13.78 | 25,561 | 5.21 | 265,041 | 12.54 | 9,508 | 1.07 |
| Basic Earnings Per Share (NTD) | 1.99 | 0.31 | 3.01 | 0.12 |
Recent Performance & Achievements
-
High-end Machine with CCD Shipments:
- 2024: Shipped 158 units
- 2025:
- Shipped 139 units
- Confirmed orders: 240 units
- Ongoing: 157 units
-
Machine Revenue Composition:
- Total Revenue Composition:
- PCB: 90%
- Semiconductor: 10%
- PCB Revenue Composition:
- Back Drilling: 89%
- Routing: 11%
- High-end Revenue Composition:
- Normal: 50%
- High-end: 45%
- Glass Coater: 5%
- Total Revenue Composition:
-
PCB Inner Layer Thickness Metrology Capability:
- Unique in achieving remaining copper thickness close to 0 mil.
- Required Precision:
- PTH and Backdrill Hole Center Alignment Accuracy: D+10mil, D+8mil, D+6mil
- Residual copper length at designated backdrill layer: 7±5 mil, 6±4mil, 6±3mil, 5+3(-2)mil
- TL Capability:
- D+4mil
- 2±2mil, Cpk > 1.67
Outlook & Strategy
- Disclaimer:
- Forecasted information in this presentation is from internal and external sources. Actual results may vary due to market competition and global economic conditions.
Strategic Measures & Plans
- Built for Semiconductor Advanced Packaging:
- What we do:
- High-performance metrology and AOI solutions
- Solutions designed for advanced packaging
- Embedded Across Foundry's Leading Technologies:
- InFO: Out-going AOI solution
- CoWoS: Wafer-form AOI & OS process
- SoIC: Edge trim & 3D packaging metrology
- Panel-Level Packaging
- Scalable Business Model:
- Deployed in foundries and OSATs
- What we do:
Key Charts, Graphs & Data Points
- High-end Machine with CCD Shipments Chart:
- Shows shipments, confirmed orders, and ongoing quantities for 2024 and 2025.
- Machine Revenue Composition Pie Charts:
- Proportions of PCB vs. Semiconductor in total revenue.
- Proportions of back drilling vs. routing in PCB revenue.
- Proportions of normal, high-end, and glass coater in high-end revenue.
- PCB Inner Layer Thickness Metrology Capability Data:
- Lists required precision and TL capabilities.
- Shows images and measurement data proving high precision.
Products, Services & Technologies
PCB Business Unit Products
- Drilling Machine:
- Standard
- CCD Series
- PCB Inner Layer Solution
- PCB Router:
- Standard
- CCD Series
- Depth Control
- Edge Coater:
- 1 Station
- Multi Stations
- Functions: Coating Glass Substrate-edge protection
- PCB Inner Layer Thickness Metrology:
- TM2:
- Patent: (TW)I768701 / M627729 / I792823 / M622593; (CN) 6252475 / 16503982 / 16861153 / 9180563 / 15164943
- Features: Designed for high-precision depth control.
- TM3: Similar patents and capabilities as TM2.
- TM4: Multiple Axis High-Efficiency Inner Layer Metrology for industrial-grade capacity.
- Patents Granted/Pending: Listing of various patents related to PCB thickness measurement technologies.
- TM2:
Semiconductor Business Unit Products
- Product Line-Up:
- Front end process: Wafer clean, Probe test, Lithography, Etch, Implant
- Middle end process: Singulation, Die stacking, Bump placement, Redistribution
- Back end process: Singulation, Wire bond, Die attach, Overmold/Underfill/Encapsulation
- Semiconductor Product Categories:
- CMP Pad Metrology
- Metrology Series
- AOI Series
- Automation Series
- Specific Products & Technologies: Listing of various specific products related to metrology, AOI, 3D IC solutions and different packaging structures.