台灣特品化學股份有限公司 (4772) 法說會簡報
Company Overview
Disclaimer (免責聲明) This presentation has been prepared by Taiwan Speciality Chemicals Corporation. (The "Company"). This presentation and the materials provided herewith do not constitute an offer to sell or issue or the solicitation of an offer to buy or acquire securities of the Company in any jurisdiction or an inducement to enter into investment activity, nor may it or any part of it form the basis of or be relied on in connection with any contract or commitment whatsoever. Any decision to purchase securities in a proposed offering should be made solely on the basis of the information contained in the offering circular published in relation to such proposed offering, if any.
The information contained in this presentation has not been independently verified. No representation, warranty or undertaking, express or implied, is made as to, and no reliance should be placed on, the fairness, accuracy, completeness or correctness of the information or the opinions contained herein. The information contained in this document should be considered in the context of the circumstances prevailing at the time and has not been, and will not be, updated to reflect material developments which may occur after the date of the presentation. None of the Company nor any of its affiliates, advisors or representatives will be liable (in negligence or otherwise) for any loss howsoever arising from any use of this presentation or its contents or otherwise arising in connection with the presentation.
Core Values (企業文化)
- 正直 (Integrity)
- 誠信 (Sincerity)
- 務實 (Pragmatic)
- 創新 (Innovation)
- Vision: 尖端電晶體製造全方位解決方案提供商 (A total solution provider for cutting-edge dice fabrication)
Group Profile (集團簡介)
TSC集團 (TSC Group)
- 董事長 (Chairman): 徐秀蘭
- 副董事長 (Vice Chairman): 陳振乾
台灣特品化學 (Taiwan Speciality Chemicals)
- 成立時間 (Establishment Date): 2013年3月27日
- 實收資本額 (Paid-in Capital): 新台幣14.77億元
- 公司位置 (Location): 彰化縣線西鄉彰濱西三路1號 (彰濱工業區線西區)
- 總經理 (General Manager): 張雄飛
- 員工人數 (Employees): 115+人
- Description: 特氣與特化研發總部與生產工廠皆設置在彰化縣彰濱工業區，交通便捷機能健全。彰濱工業區近年來產業聚集效果逐漸形成，為區域精密化學品製造中心。
- 主要產品服務 (Main Products/Services): SEG 特殊氣體 / SEC 特用化學品 (Specialty Gases / Specialty Chemicals)
弘潔科技 (HJT Technology)
- 成立時間 (Establishment Date): 台灣-2008年5月 / 南京-2016年9月
- 實收資本額 (Paid-in Capital): 新台幣1.53億元 (台灣) / 美金7.0佰萬元 (南京)
- 公司位置 (Location):
- 新竹縣湖口鄉光復南路39號 (湖口工業區)
- 台南市安南區工業三路58號 (安南工業區)
- 江蘇省南京市浦口區橋林街道百合路紫峰創業園6棟
- 總經理 (General Manager): 王廷君
- 員工人數 (Employees): 450+人
- Description: 半導體設備零組件清洗與精密加工服務據點分別設置於新竹湖口工業區、台南安南工業區，與大陸南京紫峰創業園區，貼近先進半導體客戶擴產需求，貼近客戶，以求提供迅速服務。
- 主要產品服務 (Main Products/Services): 先進製程高階半導體零件清洗/精密加工/新品 (Advanced process high-end semiconductor parts cleaning/precision processing/new products)
Group Summary
- 四大營運據點 (Four Operating Locations): 彰濱工業區, 湖口工業區, 台南安南工業區, 南京紫峰創業園
- 專業團隊 (Professional Team): 570+ 經驗豐富技術人才 (Experienced technical talent)
- 集團資本實力 (Group Capital Strength):
- 母公司資本額新台幣14.77E (Parent company capital NT$1.477 billion)
- 子公司資本額新台幣3.63E (Subsidiary capital NT$0.363 billion)
- 展現雄厚財務基礎 (Demonstrates strong financial foundation)
Milestones (發展歷程)
- 2013 Mar: 公司設立 (Company Establishment)
- 2015 Mar: 生產技術獲得台灣專利 (Production Technology obtained Taiwan Patent)
- 2015 Jun: OHSAS 18001認證 (OHSAS 18001 Certification)
- 2015 Sep: ISO 9001認證 (ISO 9001 Certification)
- 2018 Jun: 中美矽晶集團投資 (Investment by Sino-American Silicon Products Group)
- 2019 Nov: ISO 14001, ISO 45001 認證 (ISO 14001, ISO 45001 Certification)
- 2019 Dec: 榮獲全球半導體製造大廠-優良供應商獎 (Awarded "Excellent Supplier" by global semiconductor manufacturer)
- 2020 Mar: 實驗室品質管理系統認證通過 (Laboratory Quality Management System Certified)
- 2022 Mar: 股票公開發行 (Public Offering of Shares)
- 2022 Sep: 股票興櫃 (Stock Listing on Emerging Stock Board)
- 2023 Nov: 電子級甲類特殊氣體倉庫正式啟用 (Specialty Gas Warehouse Officially Opened)
- 2024 Jun: 蝕刻氣體產線完成 (Etching Gas Production Line Completed)
- 2024 Sep: 股票上櫃 (Stock Listing on OTC Market)
- 2025 Aug: 取得弘潔科主要股權 (Acquisition of HJT Technology's major stake)
Corporate Governance (公司治理)
- 台特化公司治理符合上市上櫃公司規範 (TSC's corporate governance complies with listed and OTC company regulations).
- 董事會之獨立性 (Independence of the Board of Directors): 獨立董事逾董事席次1/3 (Independent directors exceed 1/3 of board seats).
- 重視性別平等 (Emphasis on Gender Equality): 女性董事逾董事席次1/3 (Female directors exceed 1/3 of board seats).
- 內控稽核 (Internal Control and Audit): 持續評估內控有效性,促進企業健全經營 (Continuously evaluates the effectiveness of internal controls, promoting sound corporate operations).
- 吹哨者制度 (Whistleblower System): 檢舉不法侵害,保障吹哨者權益 (Reports illegal infringements, protects whistleblower rights).
Financial Highlights
Financial Summary: 2025Q3 vs. 2025Q2 vs. 2024Q3 (新台幣千元, 除每股盈餘)
| Metric (項目) | 2025年第三季 | 2025年第二季 | 2024年第三季 | 季成長 (QoQ Growth) | 年成長 (YoY Growth) |
|---|---|---|---|---|---|
| 營業收入 (Revenue) | 639,514 | 262,750 | 213,974 | 143% | 199% |
| 營業毛利% (Gross Profit Margin %) | 54.16% | 58.32% | 58.67% | -4.16% | -4.51% |
| 營業淨利 (Operating Profit) | 272,741 | 130,472 | 98,625 | 109% | 177% |
| 營業淨利% (Operating Profit Margin %) | 42.65% | 49.66% | 46.09% | -7.01% | -3.44% |
| 本期淨利 (Net Profit for the Period) | 231,923 | 116,683 | 99,557 | 99% | 133% |
| 本期淨利% (Net Profit Margin for the Period %) | 36.27% | 44.41% | 46.53% | -8.14% | -10.26% |
| 每股盈餘 (EPS) (註1) | NT$1.21 | NT$ 0.79 | NT$ 0.71 | NT$0.42 | NT$0.50 |
| 股東權益報酬率/ROE (annualized) (註2) | 25.5% | 14.6% | 16.4% | 10.9% | 9.1% |
| 資產報酬率/ROA (annualized) (註3) | 17.7% | 13.4% | 15.8% | 4.3% | 1.9% |
Footnotes:
- 每股盈餘 = 歸屬於本公司普通股權益持有人之淨利 / 普通股加權平均流通在外股數 (EPS = Net profit attributable to owners of the parent / Weighted average number of shares outstanding).
- ROE = 本期淨利 / 股東平均權益 (ROE = Net profit for the period / Average shareholders' equity).
- ROA = ((本期淨利 + 利息費用* (1 - 有效稅率)) / 平均資產 (ROA = ((Net profit for the period + Interest expense * (1 - Effective tax rate)) / Average assets).
Revenue (營業收入)
- Context: 台特化於2025年6月27日以近新台幣30億元收購弘潔科技65.22%股權，並自8月起併入合併報表，帶動營收明顯攀升。累計1至9月營收達11.22億元，較去年全年8.74億元顯著成長，展現整合綜效。(TSC acquired 65.22% stake in HJT Technology for approximately NT$3 billion on June 27, 2025. HJT's financials were consolidated starting August, leading to a significant increase in revenue. Cumulative revenue for Jan-Sep reached NT$1.122 billion, a substantial growth from last year's full-year NT$874 million, demonstrating integration synergy.)
| Period (期間) | 營業收入 (NT$ 千元) |
|---|---|
| 2021年 (Full Year) | 515,666 |
| 2022年 (Full Year) | 532,279 |
| 2023年 (Full Year) | 553,523 |
| 2024年 (Full Year) | 873,964 |
| 2024年前三季 (Jan-Sep) | 618,636 |
| 2025年前三季 (Jan-Sep) | 1,121,883 |
Financial Summary: 2025 Jan-Sep vs. 2024 Jan-Sep (新台幣千元, 除每股盈餘)
| Metric (項目) | 2025年前三季 | 2024年前三季 | 年成長 (YoY Growth) |
|---|---|---|---|
| 營業收入 (Revenue) | 1,121,883 | 618,636 | 81.35% |
| 營業費用% (Operating Expenses %) | 10.28% | 11.12% | -0.84% |
| 營業淨利 (Operating Profit) | 512,074 | 245,471 | 108.61% |
| 營業淨利% (Operating Profit Margin %) | 45.64% | 39.68% | 5.96% |
| 本期淨利 (Net Profit for the Period) | 451,338 | 255,596 | 76.58% |
| 本期淨利% (Net Profit Margin for the Period %) | 40.23% | 41.32% | -1.09% |
| 每股盈餘 (EPS) (註1) | NT$2.69 | NT$1.84 | NT$0.85 |
| 股東權益報酬率/ROE (annualized) (註2) | 16.5% | 14.0% | 2.5% |
| 資產報酬率/ROA (annualized) (註3) | 11.6% | 13.5% | -1.9% |
Net Income & EPS (淨利及EPS)
| Period (期間) | 稅前淨利 (Pre-tax Net Profit, NT$ 千元) | 本期淨利 (Net Profit for the Period, NT$ 千元) | 每股盈餘 (EPS, NT$) |
|---|---|---|---|
| 2021年 (Full Year) | 194,445 | 194,445 | 1.41 |
| 2022年 (Full Year) | 187,470 | 207,974 | 1.50 |
| 2023年 (Full Year) | 139,199 | 155,653 | 1.13 |
| 2024年 (Full Year) | 385,593 | 385,593 | 2.74 |
| 2024年前三季 (Jan-Sep) | 255,596 | 255,596 | 1.84 |
| 2025年前三季 (合併) (Jan-Sep, Consolidated) | 527,059 | 451,338 | 2.69 |
- 2025年前三季歸屬於母公司 (Net profit attributable to parent company for Jan-Sep 2025): 397,640千元
Income Statement (損益表) (新台幣千元, 除每股盈餘)
| Metric (項目) | 2021全年度 | 2022全年度 | 2023全年度 | 2024全年度 | 2024年前三季 | 2025年前三季 |
|---|---|---|---|---|---|---|
| 營業收入 (Revenue) | 515,666 | 532,279 | 553,523 | 873,964 | 618,636 | 1,121,883 |
| 成長率% (Growth Rate %) | 24% | 3% | 4% | 58% | 70% | 81% |
| 營業毛利 (Gross Profit) | 261,166 | 263,867 | 210,233 | 462,755 | 314,278 | 627,409 |
| 營業毛利% (Gross Profit %) | 51% | 50% | 38% | 53% | 51% | 56% |
| 營業淨利 (Operating Profit) | 195,312 | 180,648 | 137,798 | 364,674 | 245,471 | 512,074 |
| 營業淨利% (Operating Profit %) | 38% | 34% | 25% | 42% | 40% | 45% |
| 稅前淨利 (Pre-tax Net Profit) | 194,445 | 187,470 | 139,199 | 385,593 | 255,596 | 527,059 |
| 稅前淨利% (Pre-tax Net Profit %) | 38% | 35% | 25% | 44% | 42% | 47% |
| 稅後淨利 (Net Profit After Tax) | 194,445 | 207,974 | 155,653 | 385,593 | 255,596 | 451,338 |
| 稅後淨利% (Net Profit After Tax %) | 38% | 39% | 28% | 44% | 42% | 40% |
| 每股盈餘 (EPS) | NT$ 1.41 | NT$ 1.50 | NT$ 1.13 | NT$ 2.74 | NT$1.84 | NT$ 2.69 |
Balance Sheet (資產負債表) (新台幣千元)
| Metric (項目) | 2021全年度 | 2022全年度 | 2023全年度 | 2024全年度 | 2025第三季 |
|---|---|---|---|---|---|
| 資產 (Assets) | |||||
| 現金及約當現金 (Cash and Cash Equivalents) | 57,784 | 114,600 | 154,770 | 725,590 | 1,055,987 |
| 應收帳款 (Accounts Receivable) | 71,118 | 71,716 | 120,612 | 136,752 | 452,024 |
| 存貨 (Inventory) | 134,747 | 165,963 | 138,682 | 154,472 | 245,368 |
| 不動產、廠房、設備 (Property, Plant and Equipment) | 1,426,310 | 1,419,447 | 1,376,941 | 1,311,884 | 2,011,427 |
| 無形資產 (Intangible Assets) | - | - | - | 904 | 2,240,419 |
| 其他資產 (Other Assets) | 6,657 | 29,102 | 49,340 | 1,055,793 | 1,137,766 |
| 資產總計 (Total Assets) | 1,696,616 | 1,800,828 | 1,840,345 | 3,385,395 | 7,142,991 |
| 負債 (Liabilities) | |||||
| 短期借款 (Short-term Loans) | - | - | - | - | 2,370,000 |
| 應付帳款 (Accounts Payable) | 10,903 | 13,775 | 21,558 | 74,668 | 124,691 |
| 長期借款 (Long-term Loans) | 60,000 | - | - | - | 166,627 |
| 其他負債 (Other Liabilities) | 48,903 | 92,123 | 62,205 | 78,559 | 428,152 |
| 負債總計 (Total Liabilities) | 119,806 | 105,898 | 83,763 | 153,227 | 3,089,470 |
| 權益總計 (Total Equity) | 1,576,810 | 1,694,930 | 1,756,582 | 3,232,168 | 4,053,521 |
| 負債比率 (Debt Ratio) | 7.06% | 5.88% | 4.55% | 4.53% | 43.25% |
| 流動比率 (Current Ratio) | 450.37% | 336.56% | 503.78% | 1,328.47% | 95.93% |
Footnote:
- 2024
2025年第三季其他資產包含三個月以上定存1,000,000千元。銀行擔保借款2,525,383千元。(包含子公司) (Other assets for 20242025 Q3 include time deposits over three months of NT$1,000,000 thousand. Bank secured loans of NT$2,525,383 thousand (including subsidiaries)).
Business Segments
Semiconductor Front-End Materials Ecosystem (半導體產業前段材料生態鏈)
- 製程 (Processes):
- 薄膜製程 (Thin Film Process)
- 微影製程 (Lithography Process)
- 蝕刻/清洗 (Etching/Cleaning)
- 化學機器研磨 (Chemical Mechanical Planarization, CMP)
- 晶圓保護 (Wafer Protection)
- 產業需求項目 (Industry Demand Items):
- 高純度碳化矽材料/晶圓 (High Purity SiC Materials/Wafers)
- 化學沉積特氣 (Chemical Vapor Deposition Specialty Gases)
- 原子層沉積材料 (Atomic Layer Deposition Materials)
- 光阻週邊材料 (Photoresist Ancillaries)
- 乾式蝕刻氣體 (Dry Etching Gases)
- 化學研磨材料 (CMP Materials)
- 晶圓用絕緣保護材 (Wafer Protection Materials)
Product Category (產品類別)
- 自製產品 (Self-produced products):
- 矽乙烷 (Disilane, Si2H6)
- 矽丙烷 (Trisilane, Si3H8)
- 無水氟化氫 (AHF, Anhydrous Hydrogen Fluoride)
- 國內代理產品 (Domestic agency products):
- 矽甲烷 (Silane, SiH4)
- 海外代理服務 (Overseas agency services):
- 各式特殊氣體 (Various specialty gases)
- UHP半導體零件技術服務 (UHP semiconductor parts technical services):
- 設備零件清洗 (Equipment parts cleaning)
- 設備零件鍍膜 (Equipment parts coating)
- 設備零件維修 (Equipment parts maintenance)
Products & Technologies
Product Specifications (產品特色)
- General Strengths:
- 具有完整合成、純化、灌充、檢驗矽烷類氣體生產技術 (Complete synthesis, purification, filling, and testing technology for silane gases).
- 全球四家可量產半導體級高純度矽乙烷工廠之一 (One of four global factories capable of mass-producing semiconductor-grade high-purity disilane).
- 矽乙烷生產工廠為全球單一產線最大產能 (Disilane production plant has the largest single-line capacity globally).
- 矽丙烷產品為全球惟二具有合成製造矽丙烷氣體技術量產廠之一 (Trisilane products are one of only two global mass production plants with synthetic manufacturing technology for trisilane gas).
- 無水氟化氫氣體為外商壟斷之產品 (Anhydrous hydrogen fluoride gas is a product monopolized by foreign companies).
- Specific Products:
- 矽甲烷 (SiH4, Silane, 甲硅烷):
- 常溫氣體蒸氣壓力 (Vapor pressure at room temperature): >50 kg/cm²(a)
- 用途: 光學面板製造產業中的矽化合物薄膜沉積原料, 亦應用於半導體成熟製程做矽基化合物薄膜外延沉積原料 (Raw material for silicon compound thin film deposition in optical panel manufacturing; also used in mature semiconductor processes for silicon-based compound thin film epitaxial deposition).
- 矽乙烷 (Si2H6, Disilane, 乙硅烷):
- 常溫氣體蒸氣壓力 (Vapor pressure at room temperature): 約3.5 kg/cm²(a)
- 用途: 先進半導體製程的電子電路介電矽化合物薄膜的氣相沉積製程 (Used in advanced semiconductor processes for vapor phase deposition of dielectric silicon compound thin films for electronic circuits).
- 特性: 較矽甲烷優越的材料特性-薄膜緻密度、平滑度、沉積速率與應用熱預算 (Superior material properties compared to silane - film density, smoothness, deposition rate, and thermal budget for applications).
- 矽丙烷 (Si3H8, Trisilane, 丙硅烷):
- 特性與應用與低階矽烷相同 (Properties and applications similar to lower silanes).
- 更優越的應用材料特性,被視為次世代關鍵矽基化合物薄膜的原料 (Superior application material properties, considered a key silicon-based compound thin film material for next-generation).
- 現有國際一級大廠生產應用實績 (Existing production and application track record with leading international manufacturers).
- 無水氟化氫 (AHF, Anhydrous Hydrogen Fluoride):
- 20℃ 氣體蒸氣壓力 (Vapor pressure at 20℃): 約1.07 kg/cm²(a)
- 用途: 先進半導體製程中非常重要的乾式蝕刻與清潔特氣原料, 主要應用於晶圓沉積薄膜蝕刻與機台設備內矽類殘留晶體的清潔移除 (Crucial dry etching and cleaning specialty gas material in advanced semiconductor processes; primarily used for etching deposited films on wafers and removing silicon-based residues from equipment).
- 特性: 具有優異的選擇率及向性可應用於更先進的製程 (Excellent selectivity and directionality, applicable to more advanced processes).
- 矽甲烷 (SiH4, Silane, 甲硅烷):
UHP Cleaning and Coating Introduction (超高潔淨清洗與表面鍍膜簡介)
- Problem: Etching reactions occur simultaneously on workpieces, causing surface corrosion and accumulation of by-products, leading to process instability and defects.
- Etching Gases (蝕刻氣體): CF4, C4F8, CHF3, CI2, SF6, BCI3, O2, Ar, aHF...
- Solution 1: 超高潔淨清洗 (UHP Cleaning)
- Process Steps (1st Cleaning - Class 10,000): IQC, Chemical dipping, CO2 blast, High temp. (~1,200℃), HPW (High Pressure Water), Auto polish.
- Cleaning Performance: Effectively removes polyimide and contamination, no damage to substrate, best cleaning environment (Class 10,000 ~ 10).
- Process Flow (Physical Cleaning): CO2 → Wipe; Polish → Soak; Sandpaper → Chemical Polish; Organic → Organic.
- Process Flow (Post-cleaning): Ultrasonic oscillation, Baking, Inspection, Packaging.
- Solution 2: 抗電漿層鍍膜 (Anti-plasma coating)
- Process Steps (Plasma Spray Coating): IQC, Masking, Sand Blast, Plasma Coating.
- Coating Procedure: Good Melting on Surface / Low porosity / High Hardness, Good Adhesion with substrate, Real Time Monitoring (Plasma Temperature, Powder Velocity, Power distribution).
- Anti-Plasma Bombardment (耐電漿轟擊): High plasma density, High bias.
- Chemical Resistance (耐化學反應): High fluorine reaction.
- Coating Materials (噴塗鍍膜材料):
- Y2O3 (氧化釔 - Yttrium Oxide)
- YAG (釔鋁石榴石 - Yttrium Aluminum Garnet)
- YF3/YOF (氟化釔/氧氟化釔 - Yttrium Fluoride/Oxyfluoride)
- Coating Methods (噴塗鍍膜工法):
- APS (大氣電漿噴塗 - Atmospheric Plasma Spray)
- HDPS (高密度電漿噴塗 - High Density Plasma Spray)
- SPS (懸浮式電漿噴塗 - Suspension Plasma Spray)
- SHD (超高密度 - Super High Density)
- ALD (原子層沉積 - Atomic Layer Deposition) (開發中 - under development)
- VPS (真空電漿噴塗 - Vacuum Plasma Spray) (評估中 - under evaluation)
Professional Competitiveness (特氣專業核心競爭能力)
- 核心技術具有完善的專利保護 (Core technology with comprehensive patent protection): 美國、中國、韓國及台灣共多張專利 (Multiple patents in US, China, Korea, and Taiwan).
- 全球矽乙烷產品單一產線最大產能 (Largest single-line production capacity for disilane products globally): 超高純度矽乙烷年產量30噸 (30 tons/year of ultra-high purity disilane).
- 優勢聯產製程工藝技術 (Advantageous co-production process technology): 單一製程可同時產出矽乙烷、矽丙烷 (Single process can simultaneously produce disilane and trisilane).
- 氟源蝕刻特氣容器12N潔淨鍍層技術 (Fluorine source etching specialty gas container with 12N clean coating technology): 皮可(pico)級金屬離子析出管制 (Pico-level metal ion precipitation control).
- 矽基(Si-based)特用氣體,生產技術累積建立之Operational Know-How (Si-based specialty gas production technology with accumulated operational Know-How): 全球唯一具有全矽烷類特氣生產技術之工廠 (The only factory globally with full silane-type specialty gas production technology).
- 通過多家國際一級半導體客戶認證 (Certified by multiple international Tier-1 semiconductor customers): 已通過多家全球排名前10大之晶片製造公司之認證 (Certified by multiple top 10 global wafer manufacturing companies).
- 環保及節能的生產工藝 (Environmentally friendly and energy-efficient production processes): 已建構碳中和時代的國際競爭力 (Built international competitiveness for the carbon-neutral era).
- Domestic鹵素蝕刻特氣生產供應 (Domestic production and supply of halogen etching specialty gases): 具備在地化合作氟化氫管制特氣生產製程技術與供應服務 (Possesses localized cooperative HF-controlled specialty gas production process technology and supply services).
HJT's Competitive Advantages (超純製程,一站式解決方案)
- 2處台灣服務據點 (2 Taiwan service locations): 新竹 (Hsinchu), 台南 (Tainan).
- 清潔 (多元儀器設備服務) (Cleaning - Multi-tool equipment services): Serving Customers A, B, C, D, E.
- 大氣電漿噴塗鍍膜 (APS Coating) (Atmospheric Plasma Spray Coating): Localized/Customized.
- 懸浮式電漿噴塗 (SPS Coating) (Suspension Plasma Spray Coating): Localized/Customized.
- 鍍膜/靜電吸盤/噴淋頭一站式服務(清潔/再生/更新) (Coating/ESC/Showerhead One-stop service): Customizable, Self-developed.
- 全方位精準量測與分析 (Total Solution for Precision Measurement and Analysis): Acoustic scanning (internal cracks/damage), 3D Laser Scan auto platform, White Light Interferometer, Raman Spectrometer, Laser Induced Breakdown Spectroscopy (LIBS), analysis of metal bodies/coatings and non-metal bodies/coatings.
- 標準自動化 & 超高潔淨超純清洗 (Standardized Automation & UHP Cleaning): Auto Robot CO2 Clean, Auto Robot Polish, Clean-lines (3 in Hsinchu / 4+1 in Tainan).
- 先進創新技術服務產品開發 (Advanced Innovation Technology Development): AI Factory.
- 精密多元抗電漿防護噴塗 (Precision Multi-Protection Coating): APS Coating (Y2O3, YF3, YOF, YAG), SPS Coating (YOF, YAG, Y2O3), SHD (Y2O3), 1+1 APS/SPS in Tainan.
- 專業一站式工件維修 (One-Stop Workpiece Maintenance): ESC Repair, Showerhead Repair.
- HJT Technology Advantage: 弘潔技術可提供多家機台商與多類型工件再生能力,且具備兩個在地化工廠(新竹/台南)優勢 (HJT technology can provide regeneration capabilities for multiple tool vendors and various types of workpieces, and has the advantage of two local chemical plants (Hsinchu/Tainan)).
Clients & Markets
Specialty Gases Market Size (特殊氣體市場規模)
- Specialty Gases Global Market Report 2025 (The Business Research Company):
- 2024: $12.77 billion
- 2025: $13.84 billion
- 2029: $19.27 billion
- CAGR: 8.6%
- Growth Drivers (成長動能):
- 提高市占率 (Increase market share)
- 持續開發新品項 (Continuously develop new products)
- 提升產品純度 (Improve product purity)
- 擴充產能 (Expand production capacity)
Wafer Fabrication Materials Market Growth (晶圓製造材料市場成長)
- Global Wafer Fabrication Materials Market Forecast (2022-2026): Overall market shows positive growth, indicating sustained expansion of semiconductor demand.
- Key Material Categories (2025 vs 2026):
- 矽晶圓 (Wafers): 2025: $13.2B, 2026: $14.3B (Gradual recovery, largest share)
- 濕式化學品 (Wet Chemicals): 2025: $3.7B, 2026: $4.1B (Approx. 16% growth, strong demand)
- 光罩材料 (Photomasks): 2025: $5.9B, 2026: $6.2B (Stable increase, high resilience)
- CMP 材料 (CMP Materials): 2025: $3.5B, 2026: $3.9B (Stable increase, advanced processes)
- 特殊氣體及大宗氣體 (Specialty Gases & Bulk Gases): 2025: $6.4B, 2026: $6.8B (Approx. 7% growth, sustained growth)
- Source: SEMI, Materials Market Data Subscription (MMDS), July 2025
UHP Cleaning and Coating Market Analysis (半導體設備零組件超高潔淨清洗(UHP, Ultra High Purity)及表面精密加工(COATING)市場分析)
- Global UHP Market Size (US$ Billion):
- 2025 forecast: $1.69 billion
- 2030 forecast: $2.32 billion
- 2033 forecast: $2.82 billion
- CAGR: 6.5%
- HJT 2024 Revenue Forecast: Approximately NT$1.54 billion from parts cleaning and surface precision processing.
- HJT 2024 Market Share Forecast: Approximately 3.5% of the global UHP market.
- Future Outlook for HJT: Continuous growth by increasing market share and developing new products.
- Source: Data Insights Market
Sales Network (產品銷售網)
- 產品及服務涵蓋全球主要半導體重鎮 (Products and services cover major global semiconductor hubs), including US, Europe, Taiwan, China, Korea, Japan.
ESG / Sustainability
Environmental Protection (環境保護)
- Focus: 關注節能減碳永續發展之議題 (Focus on Energy Saving, Carbon Reduction, and Sustainable Development).
- 太陽光電系統 (Solar Photovoltaic System):
- 第一期 (Phase 1): Completed and connected to grid in July 2021.
- 第二期 (Phase 2): Completed and connected to grid in September 2022.
- 第三期 (Phase 3): To be completed and connected to grid in December 2024.
- Green Power Output:
- 台特化綠電產出已達公司總用電量76% (TSC green power output has reached 76% of the company's total electricity consumption).
- 弘潔科綠電產出已達公司總用電量21% (HJT Technology green power output has reached 21% of the company's total electricity consumption).
Social Responsibility (社會責任)
- Commitment: 台特化成立永續發展推行小組,並制定年度永續發展之目標:取之於社會、用之於社會 (TSC established a sustainable development task force and set annual sustainable development goals: give back to society, use for society).
- 資源再生 (Resource Regeneration): 利用廚餘自製堆肥栽種百合花及各類蜜源花卉,年減廚餘量1800公斤 (Uses kitchen waste to make compost for growing lilies and various nectar-producing flowers, reducing kitchen waste by 1800 kg annually).
- 弱勢關懷 (Care for the Disadvantaged): 自製防疫物資捐助喜樂保育院,為防疫盡心力 (Donates self-produced epidemic prevention supplies to Joyful Home, contributing to epidemic prevention efforts).
- 環保淨灘 (Environmental Beach Cleanup): 推動淨灘活動,保護自然生態 (Promotes beach cleanup activities to protect natural ecosystems).
- 弘潔科發揮公司影響力,落實企業社會責任 (HJT Technology leverages its influence to implement corporate social responsibility).
- 公益義賣 (Charity Sale): 公司發起中秋節,聖誕節義賣活動,鼓勵同仁參與愛心捐贈 (Company organizes Mid-Autumn Festival and Christmas charity sales, encouraging employees to participate in charitable donations).
- 捐助物資 (Donation of Supplies): 捐贈物資,助花蓮馬太鞍溪堰塞湖災後重建 (Donates supplies to aid post-disaster reconstruction in Hualien's Mata'an River landslide area).
Outlook & Strategy
Group Development Strategy (集團發展策略)
- Overall Strategy: 掌握先進製程契機,創造股東長期價值 (Seize advanced process opportunities, create long-term shareholder value).
- Strategic Pillars:
- 提升資本運用效率 (Improve capital utilization efficiency): 擴大營運規模並提升股東長期價值 (Expand operational scale and enhance long-term shareholder value).
- 掌握製程優勢 (Master process advantages): 利用台灣的先進製造尋找新機會 (Leverage Taiwan's advanced manufacturing to find new opportunities).
- 優化通路效能 (Optimize channel efficiency): 利用「台灣+1」策略提升市場覆蓋以實現快速成長 (Utilize "Taiwan+1" strategy to increase market coverage for rapid growth).
- 共享技術平台 (Share technology platform): 利用集團的先進技術,特別是在檢驗和潔淨能源方面 (Leverage the group's advanced technology, especially in inspection and clean energy).
- 複製成長模式 (Replicate growth model): 複製成功策略以實現綜效和放大價值 (Replicate successful strategies to achieve synergy and amplified value).
- Challenges & Opportunities in Advanced Process Supply Chain (先進製程供應鏈的挑戰與機會):
- 超高純度 (Ultra high purity): 確保材料和製程的最高純度 (Ensure the highest purity of materials and processes).
- 極致精度 (Ultimate precision): 實現製造過程中的精確度 (Achieve precision in manufacturing processes).
- 無比潔淨度 (Extreme cleanliness): 維護無污染的環境 (Maintain a contamination-free environment).
- 恆定穩定性 (Utmost stability): 確保一致的性能和可靠性 (Ensure consistent performance and reliability).
- Key Differentiators:
- 技術差異化 (Technological differentiation)
- 長期客戶關係 (Long-term customer relationships)
- 市場地位鞏固 (Consolidated market position)
Unique Advantages (台特化發展獨特優勢)
- 中美矽晶集團完整的全球銷售網絡 (Complete global sales network of Sino-American Silicon Products Group).
- 位處全球半導體先進製程發展的中心點 (Located at the center of global semiconductor advanced process development).
- 堅實的自研精密特氣及精密加工開發生產技術 (Robust self-developed precision specialty gas and precision processing development and production technology).
- 具有各種危化特氣全球運輸物流操作Know-How (Possesses Know-How for global transportation and logistics operations of various hazardous specialty gases).
- 可供發展之工業土地面積充沛 (Ample industrial land available for development).
- 具有多家全球一級半導體客戶Vendor資格,可快速導入新產品及服務 (Holds vendor qualifications for multiple global Tier-1 semiconductor customers, enabling rapid introduction of new products and services).
Localization Advantages (在地化優勢)
- 在地供應 (Local Supply):
- 台特化位於世界半導體製造中心(台灣)的核心位置(彰化) (TSC is located in the core of the world's semiconductor manufacturing center (Taiwan) (Changhua)).
- 地理位置優越,與北中南的半導體聚落(科學園區)距離相近,提供客戶產品與密切服務 (Excellent geographical location, close to semiconductor clusters (science parks) in northern, central, and southern Taiwan, providing products and close services to customers).
- 在地供應能有效避免地緣政治及氣候變遷帶來的風險,是客戶營運持續計畫(BCP)的首選 (Local supply effectively avoids risks from geopolitical and climate change, making it the preferred choice for customer business continuity plans (BCP)).
- 相較進口特殊氣體,台特化產品可減少碳足跡、碳關稅,進而創造成本優勢 (Compared to imported specialty gases, TSC products reduce carbon footprint and carbon tariffs, creating a cost advantage).
- 距台中港30分鐘,距科學園區車程皆2小時內抵達 (30 minutes to Taichung Port, 2 hours drive to science parks).
Additional Data
Semiconductor Front-End Materials Ecosystem (Materials List)
- 薄膜製程 (Thin Film Process):
- 高純度碳化矽材料/晶圓 (High Purity SiC Materials/Wafers)
- 離子佈植材料 (Ion Implantation Materials)
- 化學沉積特氣 (Chemical Vapor Deposition Specialty Gases)
- 原子層沉積材料 (Atomic Layer Deposition Materials)
- 金屬沉積材料 (Metal Deposition Materials)
- 微影製程 (Lithography Process):
- 光阻劑 (Photoresist)
- EUV光阻 (EUV Photoresist)
- DUV光阻 (DUV Photoresist)
- UV光阻 (UV Photoresist)
- 光阻週邊材料 (Photoresist Ancillaries)
- 蝕刻/清洗 (Etching/Cleaning):
- 顯影劑 去光阻劑 (Developer Stripper)
- 濕式製程化學品 (Wet Process Chemicals)
- 乾式蝕刻氣體 (Dry Etching Gases)
- 化學機器研磨 (CMP):
- 研磨漿料 (Slurry)
- 研磨墊 (Pad)
- 鑽石碟 (Diamond Disc)
- 研磨後清洗劑 (Post-CMP Cleaner)
- 晶圓保護 (Wafer Protection):
- 晶圓用絕緣保護材 (Wafer Protection Materials)
- 非氟化合物 (Non-Fluorine Compounds)
- 聚硫亞胺與單體 (Polyimide & Monomers)