惠特科技 (6706) 2025年第三季法人說明會簡報
Company Overview
公司名稱: 惠特科技股份有限公司 (FitTech Co., Ltd.) 股票代號: 6706 法人說明會日期: 114.11.25 (2025.11.25) 核心定位: 系統整合X設備研發製造商 (System Integration X Equipment R&D Manufacturer) 專業領域: Professional Corporation of Developing Automatic Equipment and System Integration 專注開發: 光電半導體 | 半導體 矽光子 PCB 產業製程相關應用設備
公司沿革 (Milestone):
- Established: 2004
- Employees: Over 500
- Publicly Traded: Since 2019
- 2005: 成功開發(首創) 【整合型LED晶粒/晶圓點測機】 (Successfully developed (first of its kind) [Integrated LED Die/Wafer Prober]).
- 2012: 成立雷射微細加工事業單位 (Established Laser Micro-machining business unit).
- 2015: 跨足代工產業 提供測試及分選服務 (Entered Foundry industry, providing testing and sorting services).
- 2017: 投入智慧製造 開發自動化無人工廠系統 (Invested in Smart Manufacturing, developed automated unmanned factory systems).
- 2022: 收購兆翔光電與芯荃通科技 擴展光通信技術版圖 (Acquired Zhaoxiang Optoelectronics and Xintong Technology, expanded optical communication technology portfolio).
- 2024: 推出首台矽光子設備 投入矽光子產業 (Launched first Silicon Photonics equipment, invested in Silicon Photonics industry).
企業總部大樓 (New Headquarters):
- 落成啟用: 於 2025/9 落成啟用 (Scheduled for completion and activation in September 2025).
- 認證: “銀級” 綠建築認證 (Silver level Green Building certification).
- 規模: 超過 55,000 m² (B2F - 7F).
- 參與計畫: 參與都市更新計畫 - 低碳城市 (Participating in urban renewal plan - Low Carbon City).
- 環保特色: 能源再生與節能, 低碳交通, 資源回收, 環境綠化.
Financial Highlights
綜合損益表 (Consolidated Income Statement)
單位: 仟元; %
| 項目 | 3Q25 (累計) | 3Q24 (累計) | 年變化 | 3Q25 (單季) | 2Q25 (單季) | 3Q24 (單季) | 季變化 (單季) | 年變化 (單季) |
|---|---|---|---|---|---|---|---|---|
| 營業收入淨額 | 778,316 | 561,741 | 38.6% | 108,142 | 249,876 | 212,980 | -56.7% | -49.2% |
| 營業毛利率 | 16.8% | 8.9% | 7.9% | 36.9% | 10.7% | 14.8% | 26.2% | 22.1% |
| 營業費用 | (372,665) | (476,451) | -21.8% | (117,765) | (120,649) | (127,036) | -2.4% | -7.3% |
| 營業淨利(損) | (241,741) | (426,429) | -43.3% | (77,866) | (93,946) | (95,551) | -17.1% | -18.5% |
| 營業淨利率 | -31.1% | -75.9% | 44.9% | -72.0% | -37.6% | -44.9% | -34.4% | -27.1% |
| 營業外收入及支出 | (68,785) | 107,608 | -163.9% | 71,503 | (191,468) | (18,252) | -137.3% | -491.8% |
| 歸屬予母公司業主之本期淨利(損) | (289,605) | (294,953) | -1.8% | (21,969) | (251,511) | (100,162) | -91.3% | -78.1% |
| 純益率 | -37.2% | -52.5% | 15.3% | -20.3% | -100.7% | -47.0% | 80.3% | 26.7% |
| 每股盈餘(新台幣元) | -3.69 | -4.01 | -8.0% | (0.28) | (3.20) | (1.36) | -91.3% | -79.4% |
| 股東權益報酬率 | -9.7% | -11.2% | 1.5% | -2.3% | -25.4% | -13.6% | 23.1% | 11.3% |
資產負債表及重要財務指標 (Balance Sheet & Key Financial Indicators)
單位: 仟元; %
| 項目 | 3Q25 金額 | 3Q25 % | 2Q25 金額 | 2Q25 % | 3Q24 金額 | 3Q24 % |
|---|---|---|---|---|---|---|
| 現金及有價金融商品投資 | 1,687,497 | 23.4% | 1,631,847 | 23.6% | 2,184,880 | 33.2% |
| 應收帳款 | 426,898 | 5.9% | 565,736 | 8.2% | 22,756 | 0.3% |
| 存貨 | 977,023 | 13.6% | 901,174 | 13.0% | 1,071,935 | 16.3% |
| 長期投資 | 67,427 | 0.9% | 72,765 | 1.1% | 61,107 | 0.9% |
| 不動產、廠房及設備 | 3,026,598 | 42.0% | 2,786,641 | 40.3% | 2,060,358 | 31.3% |
| 資產總計 | 7,202,927 | 100.0% | 6,921,125 | 100% | 6,575,169 | 100% |
| 流動負債 | 1,176,801 | 16.3% | 1,143,827 | 16.5% | 1,827,823 | 27.8% |
| 長期計息負債 | 2,100,484 | 29.2% | 1,848,956 | 26.7% | 1,289,934 | 19.6% |
| 負債總計 | 3,373,380 | 46.8% | 3,090,976 | 44.7% | 3,170,937 | 48.2% |
| 股東權益總計 | 3,829,547 | 53.2% | 3,830,149 | 55.3% | 3,404,232 | 51.8% |
重要財務指標 (Key Financial Indicators):
| 指標 | 3Q25 | 2Q25 | 3Q24 |
|---|---|---|---|
| 平均收現日數 (Days Sales Outstanding) | 188 | 188 | 204 |
| 平均銷貨日數 (Days Inventory Outstanding) | 663 | 663 | 545 |
| 流動比率 (倍) (Current Ratio) | 2.9 | 2.9 | 2.1 |
Recent Performance and Results
2025年前三季銷售 (2025 Q1-Q3 YTD Sales)
單位: 仟元; %
| 產品別 | 3Q25 (累計) 銷貨收入 | 3Q25 (累計) 銷貨收入百分比 | 3Q24 (累計) 銷貨收入 | 3Q24 (累計) 銷貨收入百分比 | 差異金額 |
|---|---|---|---|---|---|
| 設備 (Equipment) | 453,615 | 58.28% | 159,724 | 28.43% | 293,891 |
| 代工 (Foundry) | 276,629 | 35.54% | 326,760 | 58.17% | (50,131) |
| 其他 (Other) | 48,072 | 6.18% | 75,257 | 13.40% | (27,185) |
| 合計 | 778,316 | 100.00% | 561,741 | 100.00% | 216,575 |
2025第三季 (單季) 銷售 (2025 Q3 Quarterly Sales)
單位: 仟元; %
| 產品別 | 3Q25 (單季) 銷貨收入 | 3Q25 (單季) 銷貨收入百分比 | 2Q25 (單季) 銷貨收入 | 2Q25 (單季) 銷貨收入百分比 | 3Q24 (單季) 銷貨收入 | 3Q24 (單季) 銷貨收入百分比 | 季變化 銷貨收入差異比率 | 年變化 銷貨收入差異比率 |
|---|---|---|---|---|---|---|---|---|
| 設備 | 14,343 | 13.26% | 133,105 | 53.27% | 90,940 | 42.70% | -89.22% | -84.23% |
| 代工 | 83,435 | 77.15% | 87,634 | 35.07% | 114,418 | 53.72% | -4.79% | -27.08% |
| 其他 | 10,364 | 9.58% | 29,137 | 11.66% | 7,622 | 3.58% | -64.43% | 35.97% |
| 合計 | 108,142 | 100.00% | 249,876 | 100.00% | 212,980 | 100.00% | -56.72% | -49.22% |
Products, Services & Technology
產品解決方案發展與應用領域 (Product Solutions Development and Application Fields)
- 次世代顯示技術 (Next-generation Display Technology)
- 3D 感測 (3D Sensing)
- 光纖通訊 (Fiber Optics Communication)
- 電動車 (Electric Vehicles)
- AI 人工智慧 (AI Artificial Intelligence)
- 高效運算/大數據中心 (High Performance Computing/Big Data Center)
事業單位產品介紹 (Business Unit Product Introduction)
- LED 測試及分選解決方案: LED | Mini LED | Micro LED
- 光電半導體測試解決方案及設備: VCSEL | EEL | Photo Diode
- 矽光子解決方案: Silicon Photonics
- 雷射微細加工解決方案: Cutting | Drilling | Scribing | Marking | Cleaning
- 設備製造中心: Equipment Manufacturing Center
- 測試及分選代工服務: LED | VCSEL | EEL | Photo Diode
Outlook & Strategy
發展重點 - 光通訊 & CPO (Key Developments - Optical Communication & CPO)
戰略目標:
- 光通訊系列設備 (Optical Communication series equipment)
- CPO/MPO, 矽光子系列設備 (CPO/MPO, Silicon Photonics series equipment)
- 擴大 DFB、EEL 代工業務 (Expanding DFB, EEL foundry services)
產品名稱與技術規格:
| 系列 | 產品名稱 (中文) | 產品名稱 (英文) | 技術規格/功能 |
|---|---|---|---|
| FAS series | 矽光子元件貼合機 | Photonic Device Assembly System | Bond FAU on V-Groove chip; Cycle time for one set FAU <130 sec; Support dispensing adhesives and UV curing; Able to test FAU function after bonding. |
| FOT series | 矽光子單晶點測機 | Photonic Device Testing System | Applicable for Grating & Edge Coupling; Power consumption measurement; With 6-axis precision alignment platform; Probe card auto alignment; Coupling test after fine-tune. |
| FAI series | 光纖陣列外觀檢測 | FAU Automated Optical Inspection System | Critical dimensions measurement; Optical fiber inspection; Fiber length and length deviation; Fiber particle/defect inspection; Fiber slow axis angle for each channel; Fiber core diameter measurement; Pitch of each channel; MT connector inspection. |
| FAT series | 光纖陣列功能測試 | FAU Function Testing System | Fiber function & power test; Accuracy: 1 µm; Active alignment; Vision Accuracy: Sub-pixel. |
| MFR series | 光纖陣列移除 | FAU Remove System | Remove failed fiber array units (FAUs) adhesive materials from defective packaged products, enabling the chip to undergo repackaging; Axis precision: 3um. |
發展重點 - 雷射清潔設備 (Key Developments - Laser Cleaning Equipment)
應用領域:
- Pogo Pin
- Probe Card 功能展示: Tip cleaning, Load board In & out.
發展重點 - 精密光學設備 (Key Developments - Precision Optics Equipment)
戰略產品:
- AI 眼鏡精密生產系列設備 (AI Glasses precision production series equipment)
Additional Data
Disclaimer
This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. You should consider these forward-looking statements carefully because such statements are only our expectations or projections about future events, and actual results may differ materially from those contained in the forward-looking statements.
The forward-looking statements in this presentation include, but are not limited to, growth rates for various markets estimated by third party sources, future products and technology development, future revenue growth and profitability. You should be cautioned that the forward-looking statements are no guarantee of our future performance. The forward-looking statements contained in this presentation are made only as of the date of this. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.