金像電子 (GCE) 2025 Q3 法說會簡報
Company Overview
公司基本資料 (Company Basic Information)
| 項目 | 內容 |
|---|---|
| 公司名稱 | 金像電子股份有限公司 (Gold Circuit Electronics) |
| 成立日期 | 民國70年 (1981) |
| 股票上市日期 | 民國87年3月9日 (March 9, 1998) |
| 股本 | 台幣49.2億 |
| 產品技術 | 高階線路板, 厚銅板及背板 HDI |
| 生產基地 | 台灣中壢、大陸蘇州、大陸常熟、泰國巴真 |
全球服務據點 (Global Service Locations)
- 生產基地 (Plant): 台灣 (Taiwan, likely中壢), 蘇州 (Suzhou), 常熟 I (ChangShu I), 常熟 II (ChangShu II), 深圳 (ShenZhen), 泰國 (Thailand, likely巴真), 馬來西亞 (Malaysia)。
- 服務據點 (Service Office): West USA, East USA, South USA, Europe, Korea, Japan, Thailand, Malaysia。
Financial Highlights
歷年合併營收 (Historical Consolidated Revenue)
單位: 台幣億元
| 年度 | 合併營收 (NT$ 100M) |
|---|---|
| 2015 | 191 |
| 2016 | 192 |
| 2017 | 192 |
| 2018 | 206 |
| 2019 | 190 |
| 2020 | 234 |
| 2021 | 266 |
| 2022 | 328 |
| 2023 | 301 |
| 2024 | 389 |
| 2025 Oct (預估/累計) | 492 |
Recent Performance and Results
2025 Q1Q3 合併損益表 (2025 Q1Q3 Consolidated Income Statement)
單位: 台幣億元
| 項目 | 2025 Q1~Q3 | 2024 Q1~Q3 | 與去年同期比較 (YoY) |
|---|---|---|---|
| 營業收入 (Operating Revenue) | 435.96 | 290.96 | 50% |
| 營業成本 (Operating Cost) | 294.37 | 202.57 | - |
| 營業毛利 (Gross Profit) | 141.59 | 88.39 | 60% |
| 毛利率 (%) (Gross Margin %) | 32.5% | 30.4% | 2.1% (增加2.1個百分點) |
| 營業費用 (Operating Expenses) | 40.82 | 23.94 | - |
| 其他收益及費損 (Other Income & Expenses) | (0.21) | (0.14) | - |
| 營業淨利 (Operating Income) | 100.57 | 64.31 | 56% |
| 營業外收支 (Non-operating Income/Expenses) | (1.65) | 0.62 | - |
| 稅前淨利 (PBT) | 98.91 | 64.94 | 52% |
| 稅後淨利 (Net Income After Tax) | 66.76 | 43.33 | - |
| EPS | 13.61 | 8.90 | 4.71 (差異) |
2025/2024 每季淨利 (2025/2024 Quarterly Net Profit)
單位: 台幣億元 Y2024
| 項目 | Q1 | Q2 | Q3 | Q4 |
|---|---|---|---|---|
| 營收 (Revenue) | 90.7 | 95.7 | 104.6 | 98.5 |
| 毛利率 (Gross Margin) | 26.9% | 31.6% | 32.3% | 25.9% |
| 稅前淨利 (PBT) | 18.4 | 23 | 23.5 | 20 |
Y2025
| 項目 | Q1 | Q2 | Q3 |
|---|---|---|---|
| 營收 (Revenue) | 120.6 | 138.5 | 176.8 |
| 毛利率 (Gross Margin) | 31.3% | 29.6% | 35.60% |
| 稅前淨利 (PBT) | 26.5 | 25.1 | 47.3 |
| 營收成長% (Revenue Growth % YoY) | 33% | 45% | 69% |
Products & Technologies
公司製程能力 (Company Process Capability)
全方位的技術能力 (Comprehensive Technical Capability)
| 技術能力 (Technology Capability) | 層別 (Layers) | 應用產品 (Applications) |
|---|---|---|
| MLB (Multi-Layer Board) | 56L+ | IC Testing, Adv. Server & Networking |
| 30L | Telecom Server, NB, LEO, Automotive | |
| HDI (High Density Interconnect) | 30L | Server, Telecom |
| 10L | Smart Home, Tablet/ NB, Smart Phone, Automotive | |
| Heavy Cu (Heavy Copper) | 10L | Power, Telecom, Automotive |
產品應用別 (Product Application Breakdown)
產品營收佔比 (%)
| 類別 | Y2019 | Y2020 | Y2021 | Y2022 | Y2023 | Y2024 | Y2025 Q3 |
|---|---|---|---|---|---|---|---|
| Server | 49% | 51% | 50% | 60% | 64% | 68% | 80% |
| Networking | 22% | 21% | 19% | 20% | 17% | 15% | 10% |
| NB | 22% | 20% | 22% | 13% | 14% | 10% | 7% |
| Others | 7% | 8% | 9% | 7% | 5% | 7% | 3% |
Additional Data
免責聲明 (Disclaimer)
本次簡報中若包含有財務資訊的預測及未來市場及產品的趨勢。這些說明乃基於目前可以取得及目前相信是合理性的資料,但這些說明亦牽涉風險及不確定性。本公司之實際營運成果可能會與上述說明有不同的結果。簡報中屬預測性的資料並非本公司未來履行的保證,宜注意其隨時有變更的可能及風險。 (The presentation contains projections & estimates of financial information as well as market and product developments for future periods. These projections & estimates are based on information currently available which we believe to be reliable, but they involve risks & uncertainties. Our actual results of operations & financial condition may differ significantly from those contained in projections & estimates. The projections & estimates should not be interpreted as legally binding commitments, but rather as flexible information subject to change occasionally.)