CHIPBOND 2025Q4 法說會簡報
Company Overview
- CHIPBOND
- Time: 2025Q4
Products & Technologies
封測產業 (OSAT Industry)
The semiconductor packaging and testing industry utilizes various interconnecting methods:
| Method | Share | Description | Key Players/Applications |
|---|---|---|---|
| 打線 (Wire Bonding) | > 70% | Primary interconnecting method | Most IC (ASE, SPIL, Amkor) |
| 凸塊 (Bumping) | Advanced interconnect method | ||
| ↳ Solder Bumps | CPU and Graphic (Intel and TSMC) | ||
| ↳ Au (Gold Bump) | LCD Driver IC, RFID (Chipbond, Nepes) |
金凸塊 (Gold Bump)
- Element: Au
- Applications:
- Display Driver IC
- RF Front End
- Smart Card
- Finger Print Sensor
GOLD BUMPING
- Function: Interconnect between IC and Substrate
- Requirement: Has to be gold for driver IC
生產流程 (Production Flow)
- Bumping
- Testing
- Output/Assembly:
- Chip on Glass (COG)
- Chip on Film (COF) (Requires Film input)
Assembly Methods
- CHIP ON FILM (COF)
- Diagram shows the IC (Glass) connected to the PCB board via flexible film strips (COF).
- Example film strips shown: J01XFUEBB-X001, J01XFUEBB-X01.
- CHIP ON GLASS (COG)
- Diagram shows the IC (Glass) directly connected to the PCB board.
Advanced Interconnect Diagrams
(Illustrating potential integration methods involving Electronic and Photonic ICs)
| Diagram | EIC | PIC | Substrate Connection |
|---|---|---|---|
| 1 | EIC | PIC | Wire Bonding |
| 2 | EIC | PIC | Bumping (Flip Chip) |
| 3 | EIC (Bottom) | PIC (Top) | Stacking (3D Integration via Bumps) |
- EIC: Electronic IC
- PIC: Photonic IC
Clients & Markets
Market/Process Matrix
| Process/Market | TV | Phone | NB/PC | RF |
|---|---|---|---|---|
| Bumping | 8" | 12" | 8" | 8" |
| Testing | V | V | V | V |
| Chip on Glass | V | V | ||
| Chip on Film | V | V | ||
| Film | V | V |
APPLICATIONS (Product Mix)
- 驅動IC (Driver IC)
- 非驅動IC (Non-Driver IC)
(Visual representation shows Driver IC making up the majority share, approximately 70-75%)
Additional Data
SELLTHROUGH (Market Volume in Millions, units implied)
| Product | 2022 | 2023 | 2024 | 2025(F) | Source |
|---|---|---|---|---|---|
| TV | 180 | 195 | 200 | 200 | Samsung / Omdia |
| NB | 180 | 160 | 165 | 180 | IDC |
| SP (Smart Phone) | 1217 | 1200 | 1200 | 1200 | GfK |
產能利用率 (Capacity Utilization Rate)
- Trend: Utilization peaked around 100% in 2022, dropped sharply through 2023 and early 2024 (low point around 55-60%), and shows a recovery trend starting in 2024.
- 2025 Projection: Projected utilization rate is trending upwards, estimated around 68-70% (indicated by dashed line).
| Year | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
|---|---|---|---|---|---|---|
| Utilization | ~70-78% | ~90-100% | ~100% | ~65-70% | ~55-65% | ~68-70% (F) |