EZconn 法說會簡報

Company Overview

Overview

• Company Name: EZconn
• Slogan: Innovating for a sustainable future
• Established: 1977
• Employees: 1400+ employees
• Listing Information: Listed on Taiwan stock market in 2015 (Stock symbol: 6442.TW)
• Headquarters: Taiwan
• Oversea presence: USA, the Philippines, the Czech Republic, the People Republic of China

Disclaimer

本次法說會所提供之簡報內容包括對於未來狀況之預測及評估，這些關於未來狀況之陳述乃基於公司目前可得資料所做的預測，涉及風險及不確定性，並可能發生實際結果與預期狀況有重大差異的情形，提醒各位不要過度依賴這些資訊，另除非法律要求，本公司將不負責更新或公告這些預測的結果。

Global Sites

• Trutnov, Czech Republic
  • Research and Development
  • ISO 9001, ISO-14001
  • Wafer Level Packaging
• New Taipei City, Taiwan
  • Headquarters
  • ISO-9001, ISO-14001
  • Low-volume Production
• Ningbo, China
  • Research and Development
  • ISO-9001, ISO-14001
  • High-volume Production
• Lipa, Philippines
  • Research and Development
  • ISO-9001, ISO-14001
  • High-volume Production
• Unspecified Location (Image shows another site, likely in Taiwan/China)
  • Research and Development
  • ISO-9001, ISO-14001
  • High-volume Production

Core Competency

• Customized Design: Customized designs of optical, mechanical, and electronic packaging.
• Precision Machinery: Maintaining micro level precision machining capabilities in mass production.
• Miniaturization: Experienced in miniaturizing modules/components in various applications.
• Quality Production: Attained quality recognition from 1st tier customers.
• Intellectual Property: With over 180+ active issued patents and thousands of interconnect designs in its library.

Financial Highlights

Recent Performance and Results (單位:新台幣仟元;%)

Financial Analysis (單位:%)

Outlook & Strategy

Future Outlook and Guidance

• 2025 revenue: US$ 300+ million
• 2026 revenue: expected to continue to grow.
• AI infrastructure – Hyperscalers (large-scale data centers):
  • Scale-up: active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026).
  • *CPO-ELS stands for "co-packaging optics with external laser source” - essential chip packaging for AI processing at server level in data centers.

Business Segments

Market Sectors

• Broadband Networks – Access (Last-Mile)
  • Optical engines for “Fiber to the Home" (FTTH) for Telcos
  • RF interconnects for cable service providers
• AI infrastructure – Hyperscalers (large-scale data centers)
  • Scale-out: high-density fiber deployment connecting data centers' physical structures
  • Scale-up: active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026)
• Biomedical & Scientific
  • Miniaturized optical units for testing and probing instruments using OCT, PCR, Raman technologies, and for quantum-computing testing
• Aerospace & Defense
  • Replacement components for fighter jets
  • High-frequency RF interconnects

Products & Technologies

Product Portfolio

• CATV Connector / Components
  • F Connector
  • BNC Connector
  • IEC Connector
  • Hardline Connector
  • Filter/Attenuator/Isolator
  • Surge Arrester
  • Cable Assembly
• Microwave Connector / Dipole Antenna
  • SMA Connector
  • SMB Connector
  • MCX Connector
  • Dipole Antenna
  • EP & Cable Assembly
• Automobile Connection System
  • HDMI-E
  • FAKRA-Connector
• Active Components (OSA)
  • TOSA / ROSA / TRI-DI
  • GPON / EPON BOSA
  • 10G / 25G BOSA
  • Combo ONU/OLT BOSA
  • Special Application BOSA
• Passive Components
  • SC/LC/MU Series
  • MPO Series
  • MT-RJ Series
  • FC/ST Series
  • Torpedo Cable Series
  • Patch Panel Series
• MEMS / Aerospace
  • MEMS Scanning Module
  • AOC cable
• Base Station Connector / Arrester
  • N Connector
  • 7/16 Connector
  • Surge Arrester
  • Low PIM series
• LAB Adaptor
  • 50 OHM / 75 OHM Adaptor
• Transceiver
  • Dual Mode TRX
  • SFP/SFP+/XFP
  • XGS PON Stick
  • XGS-PON Triplexes
  • XGS-PON OLT Combo /TRX
• Medical
  • Intravenous laser module
  • OCT Laser Module
  • 3D inspection module
  • Skin-OCT

Broadband Networks – Access (Last-Mile)

• FTTH (Fiber to the Home)
  • Central Office (OLT)
  • ONT (Optical Network Terminal)
  • 10G BOSA (Bi-directional optical sub-assemblies)
  • BOSA Combo (1G, 10G, 25G)
  • Optical Transceivers
• Cable Network
  • Picking antenna
  • Coaxial cable
  • Head end
  • Amplifier
  • Drop cable
  • Splitter
  • Tap
• 5G mmWave (40 GHz~65 GHz)
  • SMP Connector
  • SMPM Connector
  • 1.85mm Connector
  • 2.4mm Connector
  • Dimensions: 3.95mm, 3.15mm, 2.85mm
  • Applications: Satellite communications, Between base stations (Introducing millimeter wave band), LTE, Mobile base stations, Wireless Communications

AI infrastructure: Scale-out

• High density optical fiber interconnects linking data center structures or rooms for AI infrastructure.
• Torpedo cable: contains up to 6912 fiber cores.
• Components: Remote extension, Fire resistant device (EZ Path), Busways, UPS & STS solutions, High power busbars, Cast Resin transformers, Switchgears, Overhead cable management, Server rooms, Cassette, LC Cassette.

AI infrastructure: Scale-up

• CPO ELS modules (expected 2026)
  • Components: CPO substrate, External laser sources, Switch IC, CPO optical modules, XSR AUI, XSR CZM interface, XSR DSP, TIA/DRV, Optics, Switch DIE XSR, Optics PKG, Package substrate, Host PCB, Fiber, Socket.

Bio Medical & Scientific: OCT and PCR

• Provides optical components for PCR (Polymerase chain reaction) machines.
• Used as light source module in OCT (Optical Coherence Tomography) products examining under-skin, eyes, teeth, etc.
• Size of light source module: 11 x 6 x 4.5 cm

Bio Medical: Miniaturized Raman Spectrometers

• Application: Currently mainly used by the law enforcement to detect drugs and medicines.
• Components: Laser Beam Path, Raman Signal Path, Focusing Lens, Image Sensor.

Biomedical & Scientific: Quantum-computing testing

• Superconducting Nanowire Single-Photon Detector
  • Photon counting in detective mode with very low dark count.
  • Working Temp: 4°K (-269°C)
  • Components: Silicide nanowire, Silicon Dioxide, Silicon, Gold Contact, Super conductor, Non super conductor.

Aerospace & Defense

• Replacement components for fighter jets
  • High frequency jumper for aerospace (BMA SEMI-RIGID)
  • RF relays for aerospace
  • Micro-D to HDMI for aerospace
• High-frequency RF interconnects
  • 5G mmWave (40 GHz~65 GHz)
  • SMP Connector
  • SMPM Connector
  • 1.85mm Connector
  • 2.4mm Connector
  • Dimensions: 3.95mm, 3.15mm, 2.85mm
  • Applications: Satellite communications, Between base stations (Introducing millimeter wave band), LTE, Mobile base stations, Wireless Communications

Additional Data

Patents overview

• Total Patents: 179
• Patents by year:
  • 2014: 10
  • 2015: 9
  • 2016: 13
  • 2017: 13
  • 2018: 13
  • 2019: 10
  • 2020: 22
  • 2021: 18
  • 2022~2024: 51

Presentation Date

• April 2025