EZconn (6442.TW) [time:2025Q2] 法說會簡報
免責聲明
本次法說會所提供之簡報內容包括對於未來狀況之預測及評估，這些關於未來狀況之陳述乃基於公司目前可得資料所做的預測，涉及風險及不確定性，並可能發生實際結果與預期狀況有重大差異的情形，提醒各位不要過度依賴這些資訊，另除非法律要求，本公司將不負責更新或公告這些預測的結果。
Company Overview
- 公司名稱: EZconn
- 標語: Innovating for a sustainable future
- 成立時間: Established in 1977
- 股票上市: Listed on Taiwan stock market in 2015 (Stock symbol: 6442.TW)
- 員工人數: 1400+ employees
- 總部: Taiwan
- 海外據點: USA, the Philippines, the Czech Republic, the People Republic of China
Financial Highlights
經營績效-營收與獲利 (單位: 新台幣仟元; %)
| 項目 | 112年度 | 113年度 | 114年度 |
|---|---|---|---|
| 營業收入 | 2,617,385 | 6,410,405 | 10,527,227 |
| 稅前利益 | 247,753 | 1,422,286 | 2,378,298 |
| 每股盈餘(元) | 2.53 | 14.30 | 23.46 |
| 毛利率(%) | 35.55% | 55.62% | 57.74% |
經營績效-114年度營運狀況 (單位: 新台幣仟元; %)
| 項目 | 113年度 | 114年度 |
|---|---|---|
| 營業收入 | 6,410,405 | 10,527,227 |
| 稅前淨利 | 1,422,286 | 2,378,298 |
| 毛利率(%) | 55.62 | 57.74% |
| 營業淨利 | 1,294,608 | 2,538,981 |
| 每股盈餘(元) | 14.30 | 23.46 |
經營績效-財務分析
| 項 目 | 2024.12.31 | 2025.12.31 |
|---|---|---|
| 財務結構 | ||
| 負債占資產比率(%) | 47.41 | 49.04 |
| 償債能力 | ||
| 流動比率(%) | 231.45 | 268.62 |
| 獲利能力 | ||
| 權益報酬率(%) | 36.81 | 33.76 |
| 每股淨值(元) | 48.63 | 87.90 |
Outlook & Strategy
- 2025年營收: US$ 300+ million
- 2026年營收: Expected to continue to grow.
- AI基礎設施 - Scale-up: Active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026).
- * CPO-ELS stands for "co-packaging optics with external laser source” - essential chip packaging for AI processing at server level in data centers.
Business Segments
Market Sectors
- Broadband Networks – Access (Last-Mile)
- Optical engines for “Fiber to the Home" (FTTH) for Telcos
- RF interconnects for cable service providers
- AI infrastructure – Hyperscalers (large-scale data centers)
- Scale-out: High-density fiber deployment connecting data centers' physical structures.
- Scale-up: Active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026).
- Biomedical & Scientific
- Miniaturized optical units for testing and probing instruments using OCT, PCR, Raman technologies, and for quantum-computing testing.
- Aerospace & Defense
- Replacement components for fighter jets.
- High-frequency RF interconnects.
Products & Technologies
Product Portfolio
- CATV Connector /Components
- F Connector, BNC Connector, IEC Connector, Hardline Connector, Filter/Attenuator /Isolator, Surge Arrester, Cable Assembly
- Microwave Connector / Dipole Antenna
- SMA Connector, SMB Connector, MCX Connector, Dipole Antenna, EP & Cable Assembly
- Automobile Connection System
- HDMI-E, FAKRA-Connector
- Active Components
- OSA (Optical Sub-Assembly): TOSA/ROSA/ TRI-DI, GPON/EPON BOSA, 10G/25G BOSA, Combo ONU/OLT BOSA, Special Application BOSA
- Transceiver: Dual Mode TRX, SFP/SFP+/XFP, XGS PON Stick, XGS-PON Triplexes, XGS-PON OLT Combo /TRX
- Passive Components
- SC/LC/MU Series, MPO Series, MT-RJ Series, FC/ST Series, Torpedo Cable Series, Patch Panel Series
- MEMS /Aerospace
- MEMS Scanning Module, AOC cable
- Medical
- Intravenous laser module, OCT Laser Module, 3D inspection module, Skin-OCT
- Base Station Connector / Arrester
- N Connector, 7/16 Connector, Surge Arrester, Low PIM series
- LAB Adaptor
- 50 OHM/75 OHM Adaptor
Key Technologies & Concepts
- FTTH (Fiber to the Home): Optical engines for Telcos.
- Components: OLT (Optical Line Terminal), ONT (Optical Network Terminal), Splitter.
- Products: 10G BOSA (Bi-directional optical sub-assemblies), BOSA Combo (1G, 10G, 25G), Optical Transceivers.
- Cable Network: RF connectors, amplifiers, filters, cables, etc.
- 5G mmWave (40 GHz~65 GHz):
- Connectors: SMP, SMPM, 1.85mm, 2.4mm.
- Miniaturized components: Dimensions 3.95mm, 3.15mm, 2.85mm.
- AI infrastructure: Scale-out: High-density optical fiber interconnects for data centers.
- Products: Torpedo cable (contains up to 6912 fiber cores), Cassette, LC Cassette.
- AI infrastructure: Scale-up: CPO ELS modules for AI processing at server level.
- Components: CPO substrate, External laser sources, CPO optical modules, Switch IC, XSR AUI, XSR CZM interface, XSR DSP, TIA/DRV, Optics, Switch DIE XSR, Package substrate, Host PCB, Optics PKG, Fiber, Socket.
- Bio Medical & Scientific:
- OCT (Optical Coherence Tomography): Light source modules for examining under-skin, eyes, teeth, etc. (Size: 11x 6 x 4.5 cm).
- PCR (Polymerase Chain Reaction): Optical components for PCR machines.
- Miniaturized Raman Spectrometers: Used by law enforcement to detect drugs and medicines.
- Quantum-computing testing: Superconducting Nanowire Single-Photon Detector (Working Temp: 4°K (-269°C)).
- Aerospace & Defense:
- High frequency jumper for aerospace: BMA SEMI-RIGID.
- RF relays for aerospace.
- Micro-D to HDMI for aerospace.
- High-frequency RF interconnects: Same 5G mmWave connectors (SMP, SMPM, 1.85mm, 2.4mm) and miniaturized components (3.95mm, 3.15mm, 2.85mm) as in Broadband Networks.
Global Sites and Capabilities
- Trutnov, Czech Republic: Research and Development, ISO 9001, ISO-14001, Wafer Level Packaging.
- New Taipei City, Taiwan: Headquarters, ISO-9001, ISO-14001, Low-volume Production, Research and Development, High-volume Production.
- Ningbo, China: Research and Development, ISO-9001, ISO-14001, High-volume Production.
- Lipa, Philippines: Research and Development, ISO-9001, ISO-14001, High-volume Production.
Core Competency
- Customized Design: Customized designs of optical, mechanical, and electronic packaging.
- Precision Machinery: Maintaining micro level precision machining capabilities in mass production.
- Miniaturization: Experienced in miniaturizing modules/components in various applications.
- Quality Production: Attained quality recognition from 1st tier customers.
- Intellectual Property: With over 180+ active issued patents and thousands of interconnect designs in its library.
Additional Data
Patents Overview
- Total Patents: 179
- Patents by Year:
- 2014: 10
- 2015: 9
- 2016: 13
- 2017: 13
- 2018: 13
- 2019: 10
- 2020: 22
- 2021: 18
- 2022~2024: 51