宜鼎國際 (5289) 2026Q1 法說會簡報
Company Overview
General Information
- Company Name: 宜鼎國際 (Innodisk Corporation)
- Stock Code: 5289
- Event: 業績說明會 (Earnings Call/Investor Conference)
- Presenter: 董事長 簡川勝 (Chairman Randy Chang)
- Date: 2026.3.30
- Copyright: COPYRIGHT INNODISK CORPORATION
Company Profile (2025 Data)
- 營業額 (Revenue): NT$143億元 (NT$14.3 billion)
- 資本額 (Capital Stock): NT$9.6億 (NT$0.96 billion)
- EPS: NT$21.72
- 專利數 (Number of Patents): 203 (+8)
- 客戶數 (Number of Clients): 4,000+
Global Operations Layout (全球營運佈局)
- 營業地區 (Operating Regions): 25
- 全球員工 (Global Employees): 1,164 (台灣: 1,019 / 海外: 145)
- Key Locations:
- 北美: 加州 (California), 紐澤西 (New Jersey), 波士頓 (Boston), 德州 (Texas)
- 歐洲: 法國 (France), 波蘭 (Poland), 德國 (Germany), 荷蘭 (Netherlands)
- 亞洲: 深圳 (Shenzhen), 北京 (Beijing), 成都 (Chengdu), 濟南 (Jinan), 杭州 (Hangzhou), 蘇州 (Suzhou), 上海 (Shanghai), 韓國 (Korea), 廣州 (Guangzhou), 越南 (Vietnam), 臺灣 (Taiwan), 東京 (Tokyo)
- 全球營運總部 (Global Operations Headquarters) (臺灣):
- 研發製造中心 (R&D and Manufacturing Center)
- 韌體研發中心 (Firmware R&D Center)
宜蘭研發製造中心 (Yilan R&D and Manufacturing Center)
- 基地面積 (Base Area): 27,000 平方米 (sqm)
- 建築面積 (Building Area):
- 一廠 (Phase 1): 12,000 平方米 (sqm)
- 二廠 (Phase 2): 15,000 平方米 (sqm)
- 2026 產能 (2026 Production Capacity) (SMT x 6): 1,080K
- 最大產能 (Maximum Production Capacity) (SMT x 8): 1,440K
- Focus Products:
- Edge AI 系統與解決方案 (Edge AI Systems and Solutions)
- Edge AI 嵌入式周邊模組 (Edge AI Embedded Peripheral Modules)
- Edge AI 嵌入式相機模組 (Edge AI Embedded Camera Modules)
汐止 全球營運總部 (Xizhi Global Operations Headquarters)
- 廠辦空間 (Office & Factory Space): 合計 5,900 坪 (Total 5,900 ping)
- Floor Breakdown:
- 17F: 500 坪 (安提 / Aetina)
- 16F: 1,000 坪 (研發中心與運動交誼中心 / R&D Center & Sports Lounge)
- 7F: 1,000 坪 (安提 200 坪 / Aetina 200 ping)
- 5F: 1,000 坪 (x3 sections)
- 2F: 400 坪 (安提 200 坪 / Aetina 200 ping)
Core Production Manufacturing Philosophy (核心生產製造理念): 品質、永續 (Quality, Sustainability)
- 產能 (Production Capacity): 1,440K / 最大產能 (SMT x 8)
- 認證 (Certifications):
- ISO9001
- ISO14001
- ISO45001
- QC080000
- ISO14064-1
- ISO27001
- IEC62443-4-1 (Industrial Cyber Security Capability)
- 廠區 (Factory Locations): 新北市 (New Taipei City) / 宜蘭縣 (Yilan County)
Financial Highlights
過去5年營收與毛利率 (Past 5 Years Revenue and Gross Profit Margin)
| Year | Revenue (NT$: K) | GPM (%) |
|---|---|---|
| 2021 | 10,195,658 | 30.3 |
| 2022 | 10,303,229 | 33.6 |
| 2023 | 8,313,778 | 34.2 |
| 2024 | 8,915,642 | 31.7 |
| 2025 | 14,261,262 | 31.1 |
過去5年淨利與 EPS (Past 5 Years Net Profit and EPS)
| Year | Net Profit (NT$: K) | EPS (NT$) |
|---|---|---|
| 2021 | 1,560,888 | 18.94 |
| 2022 | 1,850,189 | 21.46 |
| 2023 | 1,147,616 | 12.98 |
| 2024 | 1,104,544 | 12.20 |
| 2025 | 2,021,262 | 21.72 |
過去3年損益表 (Past 3 Years Income Statement) (Amounts in NT$ Thousands)
| Item | 2023 | 2024 | 2025 | YoY (2025) |
|---|---|---|---|---|
| 營業收入 (Revenue) | 8,313,778 | 8,915,642 | 14,261,262 | 60.0% |
| 營業成本 (Cost of Revenue) | 5,467,866 | 6,090,393 | 9,829,334 | 61.4% |
| 營業毛利 (Gross Profit) | 2,845,912 | 2,825,249 | 4,431,928 | 56.9% |
| 營業費用 (Operating Expenses) | 1,465,884 | 1,646,753 | 2,042,500 | 24.0% |
| 營業利益 (Operating Income) | 1,380,028 | 1,178,496 | 2,389,428 | 102.8% |
| 營業外收入及支出 (Non-Operating Income & Expenses) | 51,060 | 170,643 | 67,884 | -60.2% |
| 稅前淨利 (Income Before Tax) | 1,431,088 | 1,349,139 | 2,457,312 | 82.1% |
| 所得稅費用 (Income Tax Expense) | 286,921 | 244,595 | 436,050 | 78.3% |
| 本期淨利 (Net Income) | 1,144,167 | 1,104,544 | 2,021,262 | 83.0% |
| 非控制權益利益 (Non-Controlling Interests) | -3,449 | -1,628 | -14,381 | |
| 歸屬母公司淨利 (Net Income Attributable to Parent Company) | 1,147,616 | 1,106,172 | 2,035,643 | 84.0% |
| 基本每股盈餘 (Basic EPS) | 12.98 | 12.20 | 21.72 | |
| 毛利率 (Gross Profit Margin) | 34.2% | 31.7% | 31.1% | |
| 營業利益率 (Operating Income Margin) | 16.6% | 13.2% | 16.8% | |
| 淨利率 (Net Profit Margin) | 13.8% | 12.4% | 14.2% |
Business Segments
產品營收佔比變化 (Product Revenue Mix Change)
| Segment | 2023 | 2024 | 2025 |
|---|---|---|---|
| DRAM | 37% | 39% | 37% |
| FLASH | 54% | 51% | 55% |
| AI Solutions | 2% | 3% | 2% |
| Others | 7% | 7% | 6% |
營收依區佔比 (Revenue by Region)
| Region | 2023 | 2024 | 2025 |
|---|---|---|---|
| Taiwan | 32% | 30% | 26% |
| Europe | 23% | 21% | 17% |
| America | 14% | 19% | 19% |
| China | 17% | 15% | 22% |
| Asia | 12% | 14% | 15% |
| Others | 2% | 1% | 1% |
Products & Technologies
Market Trends & Product Strategy: Cloud and Edge AI Dual Revolution (雲端與邊緣 AI 雙重革命)
- 雲端與網路通訊 (Cloud & Network Communication):
- 1G to 5G → 雲端 & AI (Cloud & AI)
- 頻寬成長 / 超低延遲與 AI 基礎建設 / 雲端服務與 AI 訓練 (Bandwidth growth / Ultra-low latency & AI infrastructure / Cloud services & AI training)
- Edge Computing & Device:
- PLC → IPC → IIoT → AIoT
- 自動化 / 工業應用 / 垂直市場 / 智慧互聯 (Automation / Industrial applications / Vertical markets / Smart connectivity)
- 產業型邊緣 AI (Industrial Edge AI):
- 專注於萬物互聯 (Focus on IoT)
- 強固與耐用 (Robust & Durable)
- 即時與全天候運行 (Real-time & 24/7 operation)
- 企業型邊緣 AI (Enterprise Edge AI):
- 專注於 IT 架構 (Focus on IT architecture)
- 流程優化與可擴展性 (Process optimization & Scalability)
- 資訊安全與隱私 (Information security & Privacy)
- Key Edge AI characteristics: -Privacy, -Latency, -Bandwidth
- Open Sources: SLM, Neural Network: CNN, RNN
- Large Language Model
Application Upgrade: Fully Advancing Edge AI Application Market (應用升級 全面推進邊緣AI應用市場)
- AI 基礎建設 (AI Infrastructure):
- GPU 伺服器 / 網路交換器 / 路由器 (GPU Servers / Network Switches / Routers)
- 人形機器人 / 無人機 / 無人自動化 (Humanoid Robots / Drones / Unmanned Automation)
- 高附加價值 工控解決方案供應商 (High Value-added Industrial Control Solution Provider):
- 製造產業 / 零售物流 / 智慧能源 / 醫療保健 / 網路通訊 / 航空航太 / 媒體娛樂 / 企業級應用 (Manufacturing / Retail & Logistics / Smart Energy / Healthcare / Network Communication / Aerospace / Media & Entertainment / Enterprise Applications)
- 高附加價值及客製化服務 (High value-added & Customized services)
- 長期供貨與技術支持 (Long-term supply & Technical support)
EDGE AI STACK: ARCHITECT INTELLIGENT (邊緣運算技術堆疊)
- Stack 5: 軟體層 (Software)
- Stack 4: 感測與傳輸層 (Sensing & Comm.)
- Stack 3: 儲存層 (Storage)
- Stack 2: 記憶體層 (Memory)
- Stack 1: 算力層 (Compute)
Stack 1: 算力層 (Compute Layer)
- COMPUTING INTELLIGENCE, APPLIED INTELLIGENCE
- TOPS @ INT8 (Tera Operations Per Second at 8-bit integer precision)
- 10,000 TOPS (先進 AI 推論與模型訓練):
- NVIDIA: APEX-S100
- 1,000 TOPS (高精度資料分析與大規模 AI 推論):
- NVIDIA: APEX-X100, APEX-X200, AIB-THOR-ES, APEX-P100, APEX-X100-Q, AIE-PX11/12/21/22
- 100 TOPS (中高效能影像與語音分析):
- Qualcomm: APEX-P200
- Intel: APEX-A100
- AI ASIC: APEX-E100
- 低功耗邊緣推論 (Low-power Edge Inference)
Stack 2: 記憶體層 (Memory Layer)
- DATA INTELLIGENCE
- EMPOWERING EDGE AI COMPUTING:
- DDR5 7200MT/s 邊緣 AI 超高速運算引擎 (Ultra-high Speed Computing Engine for Edge AI)
- 目標市場: 邊緣 AI 和高速網通頻寬需求 (Edge AI & High-speed Network Bandwidth Demands)
- 效能展現: 超低延遲和卓越的穩定性 (Ultra-low latency & Excellent stability)
- 應用領域: 即時邊緣推理和海量資料處理 (Real-time Edge Inference & Mass Data Processing)
- DDR5 7200MT/s 邊緣 AI 超高速運算引擎 (Ultra-high Speed Computing Engine for Edge AI)
- BREAKING AI ARCHITECTURE BOTTLENECKS:
- CXL AIC (ADD-IN-CARD) 打破邊緣運算的記憶體牆瓶頸 (Breaking the Memory Wall Bottleneck for Edge Computing)
- 目標市場: 突破次世代 AI 的「記憶體牆」瓶頸 (Breaking the "Memory Wall" bottleneck for next-gen AI)
- 關鍵特點: 無縫、大規模記憶體擴充 (Seamless, large-scale memory expansion)
- 技術優勢: 優化超大規模資料中心和 AI 訓練的整體擁有成本 (Optimizing TCO for hyperscale data centers & AI training)
- CXL AIC (ADD-IN-CARD) 打破邊緣運算的記憶體牆瓶頸 (Breaking the Memory Wall Bottleneck for Edge Computing)
- DRAM Module Portfolio:
- AI Memory, Embedded Memory, Server Memory, Wide Temp. Memory, Customized Memory
- 規格尺寸 (Form Factors): CAMM2 / CUDIMM / CSODIMM / SODIMM / RDIMM / VLP / ......
- 技術與世代 (Technology & Generations): CXL / DDR5 / DDR4 / DDR3 / DDR2
Stack 3: 儲存層 (Storage Layer)
- DATA INTELLIGENCE
- 產業型邊緣 AI (Industrial Edge AI):
- On-device SSD: 工控垂直應用市場 (Industrial control vertical application market)
- 企業型邊緣 AI (Enterprise Edge AI):
- On-prem edge AI SSD: 企業私有 AI 伺服器 (KV cache SSD) (Enterprise private AI servers (KV cache SSD))
- Central Cloud: AI 伺服器 (CSP) 資料儲存 (AI servers (CSP) data storage)
- Applications: Inference and Training
- MAXIMIZING SYSTEM BOOT RELIABILITY:
- 資料中心 SSD | 開機碟 (Data Center SSD | Boot Drive)
- SATA III and PCIe Gen 4 / U.2, M.2, 2.5", E1.S
- 優化啟動: 高速啟動和高速作業系統載入 (Fast boot & OS loading)
- 可靠性: 高耐久性,可承受頻繁的資料寫入 (High endurance, withstands frequent data writes)
- 資料中心 SSD | 開機碟 (Data Center SSD | Boot Drive)
- ACCELERATING LARGE-SCALE DATA THROUGHPUT:
- 資料中心 SSD | 資料碟 (Data Center SSD | Data Drive)
- PCIe Gen5 / U.2, EDSFF (E3.S, E3.L and E1.S)
- 高吞吐量: 專為大規模資料處理設計,展現高效能與穩定性 (Designed for large-scale data processing, high performance & stability)
- 低延遲: 高擴展性,滿足繁重的資料處理和儲存需求 (High scalability, meets demanding data processing & storage needs)
- 資料中心 SSD | 資料碟 (Data Center SSD | Data Drive)
- Flash Storage (SSD) Portfolio:
- PCIe (e.g., M.2 4TG2-P), SD (e.g., 256GB), SATA (e.g., 2.5" 31E6-P, SATA Slim, SATADOM), USB (e.g., USB EDC), PATA (e.g., CF Card 1ME2)
- 規格尺寸與技術 (Form Factors & Technologies): M.2 / U.2 / CFexpress / EDSFF / 2.5" / 1.8" / SATA Slim / SATADOM / mSATA / CFast / nanoSSD / CompactFlash Card / SD Card & MicroSD Card / USB / USB EDC
Stack 4: 感測與傳輸層 (Sensing & Comm. Layer)
- CONNECTING INTELLIGENCE
- REVOLUTIONIZING COMPACT SYSTEM BOOTING:
- 高速網路擴充卡 (High-speed Network Expansion Card)
- M.2 to Dual 10GbE SFP+ LAN Module, M.2 2280 Dual 10GbE LAN Module
- 節省空間: 全球首款適用於小型機殼的 M.2 SFP+ 網路模組 (World's first M.2 SFP+ network module for small chassis)
- 優化啟動: 高速穩定的資料傳輸,顯著縮短啟動時間 (Fast & stable data transmission, significantly reduced boot time)
- 高速網路擴充卡 (High-speed Network Expansion Card)
- ENHANCING HIGH-EFFICIENCY DATA EXCHANGE:
- CAN FD 系列 (CAN FD Series)
- 快速通訊: 為複雜系統提供快速可靠的資料交換 (Provides fast & reliable data exchange for complex systems)
- 卓越效能: 更高的單一訊息傳輸資料量,效能顯著提升 (Higher single message data volume, significantly improved performance)
- CAN FD 系列 (CAN FD Series)
- Intelligent Peripheral Solution Portfolio:
- LAN, CAN Bus & CAN FD, CAN + GNSS, Serial, Wi-Fi
- SENSING INTELLIGENCE
- RUGGEDIZED LONG-RANGE VISION & CLARITY:
- GMSL2 相機模組系列 (GMSL2 Camera Module Series)
- 高頻寬、長距離、低延遲 (High bandwidth, long distance, low latency)
- IP67/IP69K 防護等級: 最高等級的防水防塵 (Highest level of waterproof & dustproof)
- 15 公尺超長傳輸距離: 遠距離傳輸性能穩定 (Stable long-distance transmission performance)
- 板載 ISP (Onboard ISP): 卓越的影像品質和專業控制 (Excellent image quality & professional control)
- 支援 NVIDIA Jetson 和 RPi: 相容於主流 AI 平台 (Compatible with mainstream AI platforms)
- GMSL2 相機模組系列 (GMSL2 Camera Module Series)
- REDEFINING EDGE AI VISION STANDARDS:
- MIPI OVER TYPE-C 相機模組 (MIPI OVER TYPE-C Camera Module)
- 800萬畫素定焦相機模組 (8-megapixel fixed-focus camera module)
- 獲獎肯定: 取得專利技術,並獲得台灣精品獎肯定 (Patented technology, awarded Taiwan Excellence)
- MIPI 擴充: 高速訊號,專為邊緣 AI 設計 (High-speed signal, designed for Edge AI)
- 板載ISP (Onboard ISP): 整合晶片,實現卓越的影像控制 (Integrated chip, achieves excellent image control)
- 多平台相容: 支援 NVIDIA Jetson、Intel 和 Raspberry Pi (Supports NVIDIA Jetson, Intel & Raspberry Pi)
- MIPI OVER TYPE-C 相機模組 (MIPI OVER TYPE-C Camera Module)
- Camera Module Portfolio:
- USB 2.0, MIPI CSI-2, GMSL2, MIPI over Type-C, Capture Card
Stack 5: 軟體層 (Software Layer)
- MANAGEMENT INTELLIGENCE, MACHINE LEARNING INTELLIGENCE
- Key Offerings:
- 建構Agentic AI (代理式 AI) (Building Agentic AI)
- 模型訓練與推論工具套件 (Model Training & Inference Toolkits)
- API & SDK 開發套件 (API & SDK Development Kits)
- 設備管理 (Device Management)
- OS / Driver 底層驅動 (OS / Driver Low-level Drivers)
- 堅強軟體研發實力,創造邊緣AI 附加價值 (Strong Software R&D Capabilities, Creating Edge AI Added Value)
- Software Architecture Layers:
- Business Logic Layer: ICAP, iVIT, innoPPE, AccelBrain (for Retail Intelligence, Surveillance Intelligence, Enterprise & Building Intelligence, Industrial Automation Intelligence)
- Inter – Service Communication Layer: HTTP, MQTT, CoAP, MCP
- Service API Endpoint Layer: Device Management, AI Engine, Multi-Streaming, Agentic AI Layer, MCP Server
- Runtime Environment Layer: HAL API
- HW Module Adapter Layer: eAPI, CANBus Utility, SSD SMART Utility, SPD Code R/W
- Specific Software/Tools: AccelBrain_Agent
INNODISK EDGE AI BUILDING BLOCKS (INNODISK 邊緣AI 解決方案架構)
- SOFTWARE / FIRMWARE:
- Cloud AI Platform: iCAP (Remote Management / OOB / OTA / Recovery / Security / Diagnosis)
- AI-Stack Tool / SDK: iVIT, AccelBrain, AccelTune (AccelBrain(RAG) / AccelTune / iVIT-Training / iVIT-Inference)
- Software Tools: iSMART / iTracker / iOPAL / iRAID
- Operating System: x86 / Arm, Window / Linux
- AI ACCELERATOR: NVIDIA, Intel, Qualcomm, AI ASIC
- AI PLATFORM:
- x86: Atom_X7000, 12th Gen Core-i, 13/14th Gen Core-i, Core Ultra Series 1, Core Ultra Series 2, Core Ultra Series 3, Xeon 6
- Arm: NVIDIA Jetson, Qualcomm, AMD Xilinx, NXP i.MX 8M Plus
- EMBEDDED PERIPHERAL: Flash, DRAM, Display, Storage, LAN, CAN Bus / CAN FD, GNSS, Wireless
- SENSOR: Embedded Camera Module, Air & Gas Sensor
Clients & Markets
全球夥伴與市場認可 (Global Partners and Market Recognition)
- 合作夥伴 (Partners):
- Intel 官方合作夥伴 (Official Partner): Gold Partner
- NVIDIA: Elite Partner (安提 / Aetina), MGX Partner (安提 / Aetina)
- Qualcomm IoT 官方合作夥伴 (Official Partner)
- Azure Sphere 官方合作夥伴 (Official Partner)
- AI ASIC & NPU 合作夥伴 (Partners): AXELERA, MEDIATEK, Rockchip, NXP
- 經營成果 (Business Achievements):
- Gartner: 全球工業級固態硬碟 市佔第一 (Global Industrial-grade SSD Market Share No.1)
- TRENDFORCE: 全球前十大 DRAM 模組供應商 (Top 10 Global DRAM Module Supplier)
- Interbrand: 台灣國際品牌 TOP 40 (Taiwan International Brand Top 40)
- Forbes: 前 200 大 亞洲中小型企業 (Top 200 Asia SMEs)
- 全球 垂直應用領導品牌 (Global Vertical Application Leading Brands):
- 醫療保健 / 5G / 安防監控 / 媒體娛樂 / 自動化 (Healthcare / 5G / Security Surveillance / Media & Entertainment / Automation)
- Tier-1 市場領導品牌 (Tier-1 Market Leading Brands)
全球 AI IN ACTION 商務拓展 (Global AI IN ACTION Business Expansion)
- Presence at major industry events:
- EMBEDDED WORLD 2026 @德國 紐倫堡 (Germany Nuremberg)
- NVIDIA GTC 2026 @美國 聖荷西 (USA San Jose)
- Smart City Expo World Congress
- Edge Tech+ @Japan
- Smart Factory & Automation @Korea
- ICE 2026 @Spain
ESG / Sustainability
2025 永續亮點 (2025 Sustainability Highlights)
- 公司治理評鑑名列 6~20% 等級 (Corporate Governance Evaluation ranked 6-20%)
- 通過董事會核准淨零排放路徑目標,積極邁向淨零轉型的長程方向 (Board approved Net-Zero Emissions Roadmap, actively moving towards Net-Zero transformation)
- 成立「永續發展暨資安委員會」,強化公司在環境、社會、治理與資訊安全面向的整合管理與效率 (Established "Sustainability and Cybersecurity Committee", strengthening integrated management and efficiency in environmental, social, governance, and information security aspects)
- 榮獲國際 EcoVadis 銅級及天下永續公民獎、天下人才永續獎、親子天下友善家庭職場獎等多項殊榮,展現宜鼎在永續治理的全方位成果 (Awarded international EcoVadis Bronze, CommonWealth Magazine's Corporate Citizenship Award, Talent Sustainability Award, and Family-Friendly Workplace Award, demonstrating Innodisk's comprehensive achievements in sustainable governance)
- Community Initiatives: @宜蘭縣 無尾港 生態復育 / 候鳥棲地保育 / 防風林植樹 / 社區創生共榮 (Wuweigang, Yilan County: Ecological restoration / Migratory bird habitat conservation / Windbreak tree planting / Community co-creation and prosperity)
- Community Initiatives: @新北市 翡翠灣 海洋保育 / 海洋教育 / 企業親子淨灘活動 (Feicuiwan, New Taipei City: Marine conservation / Marine education / Corporate family beach cleanup event)
Outlook & Strategy
2026 發展目標 (2026 Development Goals)
- 持續推進再生能源提升與能源管理導入,實現減碳行動成效 (Continue to promote renewable energy adoption and energy management, achieving carbon reduction effectiveness)
- 推動員工參與及社會共融計畫,深耕生物多樣性計畫以擴大永續影響力 (Promote employee engagement and social inclusion programs, deepening biodiversity initiatives to expand sustainability impact)
- 完善永續治理架構與資訊揭露,強化與國際標準IFRS接軌 (Improve sustainable governance framework and information disclosure, strengthening alignment with international IFRS standards)
Strategic Initiatives and Plans
- 全面推進邊緣AI應用市場 (Fully Advancing Edge AI Application Market): Focusing on AI infrastructure, vertical application leadership, and high value-added industrial control solutions.
- EDGE AI STACK: ARCHITECT INTELLIGENT (邊緣運算技術堆疊): Comprehensive strategy across Compute, Memory, Storage, Sensing & Comm., and Software layers.
- 堅強軟體研發實力,創造邊緣AI 附加價值 (Strong Software R&D Capabilities, Creating Edge AI Added Value): Emphasizing software development for Agentic AI, toolkits, APIs, SDKs, and device management.
- 全球 AI IN ACTION 商務拓展 (Global AI IN ACTION Business Expansion): Active participation in global exhibitions and events to expand edge AI solutions.
Additional Data
產品創新 (Product Innovations)
- TAIWAN EXCELLENCE Awards:
- 2026 E3.L PCIe Gen5 資料中心固態硬碟 (Data Center SSD)
- 2026 LPDDR5X LPCAMM2 記憶體模組 (Memory Module)
- 2026 MIPI over Type-C 8MP 定焦相機模組 (Fixed-focus Camera Module)
- 2026 邊緣 AI 系統 (Edge AI System) (APEX-P200)
- 2026 AI 代理人邊緣運算工作站 (AI Agent Edge Computing Workstation) (AIP-FR68S)
- 2026 多加速卡邊緣 AI 推論系統 (Multi-accelerator Edge AI Inference System) (AIP-MURE)
- BEST IN SHOW Embedded WINNER Awards:
- 2026 高速網路擴充卡 (High-speed Network Expansion Card)
- 2025 MIPI over Type-C 相機模組 (Camera Module)
- 2025 E3.L 5QS-P 資料中心固態硬碟 (Data Center SSD)
- 2024 E1.S 4TG2-P 固態硬碟 (SSD)
- 2023 nanoSSD 微型固態硬碟 (Micro SSD)
- MEMORY SUMMIT Most Innovative Memory Technology Awards:
- 2025 CXL 記憶體模組 (Memory Module)
- 2022 極寬溫 DDR4 記憶體模組 (Extreme Wide Temp DDR4 Memory Module)
- BEST IN SHOW AWARDS Embedded COMPUTING DESIGN GTC:
- 2024 USB 嵌入式相機模組 (USB Embedded Camera Module)
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