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佳必琪 2026Q2 法人說明會
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佳必琪 2026Q2 法說會簡報重點與營運摘要

JPC connectivity 2026 Q2 法說會簡報

Company Overview

  • 公司名稱: JPC connectivity
  • 活動: 2026 Q2 Institutional Investor Conference 法說會
  • JPC Value Statement:
    • Technology Exchange (技術交流)
    • Project Management (專案管理)
    • Integrated Solutions (整合解決方案)
    • Time to Market (上市時間)
    • Quality Driven (品質導向)
    • Supply Assurance (供應保證)
    • Serving Diverse Markets (服務多元市場)
    • Integrity and Respect (誠信與尊重)
  • Slogan: Together We Connect

Financial Highlights

  • 北美 CSP 需求強勁,帶動JPC營收成長 (Strong demand from North American CSPs driving JPC's revenue growth)
    • 北美市場營收佔比 (North America Revenue Share): >60%
      • 其中50%為大型CSP針對AI資料中心的大規模建置,北美躍升為最大成長引擊。(Approximately 50% is driven by large-scale AI data center deployments by major CSPs, with North America emerging as the primary growth driver.)
    • 營收動能 (Revenue Momentum):
      • 26Q1 Revenue: NT$20.26 E
      • 產品: 1.6T/800G、AEC、ORV3
    • 2025營業利益率 (Operating Margin): 20%
      • 隨 AI 客戶需求成長,PCIe Gen6 與液冷專案有助於產品組合優化,支撐毛利率維持35%以上水準。(Driven by growing AI customer demand, PCIe Gen6 and liquid cooling projects support product mix optimization and sustain gross margin above 35%.)

Business Segments

  • 產品組合 (Product Portfolio):
    • 數據網路 (DNT): 65%
    • 類別:
      • High Speed (高速)
      • High Power (高功率)
      • Optics (光學)
    • AI與生態系獲利主力。(AI servers and ecosystem as the primary profit drivers.)

Products & Technologies

  • JPC光銅並進:AI基礎設施關鍵互連 (JPC: Optical & Copper Interconnects for AI Infrastructure)

    • 高速傳輸速率 High-Speed Data Transmission:
      • 強調 1.6T / 800G 超高速光與銅傳輸解決方案,徹底打通 AI 算力與資料瓶頸。(Delivering 1.6T/800G ultra-high-speed optical and copper interconnect solutions to address AI compute and data bottlenecks.)
    • 高功率連接 High-Power Connectivity:
      • 專注大電流高功率匯流排技術,滿足 AI cluster 倍增的嚴苛電力需求。(Focused on high-current, high-power busbar technologies to meet the increasing power demands of AI clusters.)
    • JPC AI Data Center Solutions Components:
      • AC Whip Cable
      • Power Shelf
      • BBU Shelf
      • Fiber Patch Unit
      • Rack Management Controller
      • Wedge400
      • 400G/800G Optical Transceiver
      • Compute Tray
      • 800G DAC
      • Switch Tray
      • Fiber
      • Management Switch
      • LAN Cable
      • Busbar
      • AALC
      • UQD Connector

  • AI供應鏈中的關鍵角色 (A Key Role in the AI Supply Chain)

    • 產品:
      • PCIe Gen6
      • MCIO Cable & Connector
      • Multi-trak Cable & Connector
      • 1.6T/800G
      • DAC
      • Transceiver
      • UQD Liquid Cooling Connector
      • ORV3 AC Whip Cable
      • GPU Power Cable

  • 光通訊 Optical (Presenter: Dr. Sun)

    • 三者交集 (核心):
      • OE Module (光電模組) → Optical Transceiver (光收發模組)
      • CPO (共封裝光學 Co-Packaged Optics)
      • WPG (波導光子 Waveguide Photonics)
    • 光學 × 電子:
      • Silicon Photonics (矽光子)
      • Compound Semiconductor (化合物半導體)
    • 光學 × 機械:
      • Optical Inspection (光學檢測)
      • Active / Passive Alignment (主動 / 被動對準)
      • CP, FT (晶圓測試 Chip Probing / 成品測試 Final Test)
    • 機械 × 電子:
      • Motion Control (運動控制)
      • Positioning (精密定位)
      • MEMS (微機電系統)

  • 矽光子研發團隊Roadmap (Silicon Photonics R&D Roadmap)

    • 2025 (April 800G 2xDR4):
      • 團隊成員 (Team capabilities)
      • 矽光量測平台建置 (Silicon photonics measurement platform established)
      • 高速傳輸驗證 (High-speed transmission validation)
      • 取得台灣與歐洲 矽光子相關專利 (Silicon photonics-related patents secured in Taiwan and Europe)
    • 2026 (April 1.6T 2xDR4):
      • 將雷射貼合在矽光晶片上 (Laser integration onto silicon photonics chips)
      • Shuffle Cable
      • 矽光子晶片開發啟動 (Initiation of silicon photonics chip development)
      • 取得台灣與美國 光模組散熱相關專利 (Patents secured in Taiwan and the U.S. for optical module thermal management)
    • 2027 (April 3.2T NPO):
      • 將雷射貼合在矽光晶片上 (Laser integration onto silicon photonics chips)
      • 八通道多波長耦合 (8-channel multi-wavelength coupling)
      • FAU開發 (FAU (Fiber Array Unit) development)
    • 2028 (April 6.4T):
      • 矽光子CPO產品 (Silicon photonics CPO products)
      • FAU 量產 (FAU mass production)

  • 1.6T高速傳輸光模組 (1.6T High-Speed Optical Modules)

    • 被動1.6T Loop back 取得兩家美系認證通過。(Passive 1.6T loopback products have been qualified by two U.S.-based customers.)
    • 主動1.6T Loop back (Active Loop Back)送樣美系客戶。(Active 1.6T loopback (Active Loopback) samples have been delivered to U.S. customer.)
    • 1.6T 光模組已送樣美系客戶認證中。(1.6T optical modules are currently under customer qualification.)

  • 1.6T AEC (Active Electrical Cable)

    • Data Rate & Application:
      • 1.6T to 1.6T: Switch to Switch
      • 1.6T to 2x800G: Switch to NIC
    • 產品名稱: OSFP-IHS, OSFP-RHS
    • 特性:
      • 適用於3.5 Meter機櫃內傳輸 (Suitable for up to 3.5 meters intra-rack transmission)
      • 低功耗 (Low power consumption)
      • 低誤碼率(BER) (Low bit error rate (BER))

  • 2026數據中心與EDA應用市場產品開發 (2026 Product Development for Data Center and EDA Applications)

    • 參與多個單通道100G (400G與800G) 專案。(Engaged in multiple single-lane 100G (400G and 800G) programs.)
    • 高速光纖線材打入美系與亞洲Tier 1客戶。(High-speed optical fiber cables adopted by Tier 1 customers in the U.S. and Asia.)
    • 800G ACC開始出貨給美系客戶。(800G ACC shipments have commenced to U.S. customers.)
    • 相關產品/技術 (From diagram): Router 10Gb SFP+, Firewall 10Gb SFP+, Mellanox SN4600 Ethernet 200Gb, Mellanox SN4600 Ethernet 200Gb/100Gb, OEM 2U/4U/8U HGX/GPU Cluster, InfiniBand UFM Server, K8s Node / Head Node, Mellanox MQM9700 InfiniBand OSFP 400Gb, Mellanox SN2201 MGT Switch.

  • Next generation high speed memory connector introduction (Presenter: YK)

    • SOCAMM Connector:
      • 參與AI領導公司下一世代記憶體高速傳輸介面開發。(Engaged in the development of next-generation high-speed memory interfaces with a leading AI company.)
      • SOCAMM Connector 完成量產準備並配合客戶需求進行驗證中。(SOCAMM connectors are ready for mass production and currently undergoing customer validation.)

  • Next generation high speed connectivity (Presenter: YK)

    • PCIE Gen 7 Connectivity:
      • 持續參與 AI GPU 公司下一世代高速傳輸架構設計驗證。(Continuously engaged in the design validation of next-generation high-speed interconnect architectures with leading AI GPU companies.)
      • 持續參與大型 CSP 公司及 AI 算力供應商下一世代高速傳輸架構設計驗證。(Continuously engaged with major CSPs and AI compute providers on next-generation high-speed interconnect architecture validation.)
      • 已取得下一世代 PCIE Gen 7高速傳輸架構 Genesis 授權。(Licensed for next-generation PCIe Gen7 high-speed interconnect architecture (Genesis).)

  • Multiple Platform (Presenter: YK)

    • 與多家 AI 晶片供應商共同進行互連客製化設計及驗證。(Collaborating with multiple AI chip suppliers on customized interconnect design and validation.)
    • 參與 AMD Platform。(Engaged in AMD platforms.)
    • 參與 AsteraLabs Platform。(Engaged in Astera Labs platforms.)
    • 參與其他多家 Platfrom。(Engaged in multiple other platforms.)

  • New connector and cable introduction (Presenter: AMI)

    • 強化 AI GPU 與 HPC 大電流供電市場布局 (Strengthen strategic deployment in AI GPU and HPC high-current power supply markets.)
    • POWER 主力產品 (POWER Key Products):
      • ORV3 Series:
        • NVIDIA GTC 認定 (NVIDIA GTC Recognition)
        • OCP+UL817對應 (Compliance with OCP and UL817 Standards)
        • 30A60A100A~130A
      • Busflow & Busbar:
        • NVIDIA GTC 認定 (NVIDIA GTC Recognition)
        • OCP
        • 支援 1,200A 高電流設計 (Support for 1,200A High-Current Design)
    • 相關產品/技術 (From image): MGX Server Rack 1.2, Vera Rubin 100A Power Whip.
    • Power Shelf & IT Gear Connector Solutions: BusFlow 150, BusFlow 250, BusFlow 500, BusFlow 600, BusFlow 1200.

  • Power cable長期出貨實績 (Power cable Long-Term Shipment Track Record)

    • High Power & High Current Infrastructure Solution Provider
    • 關鍵領域:
      • Power Infrastructure
      • Power Delivery
      • High Current Interconnect
      • AI / Robotics / Smart Industry Ecosystem
    • 產品 (SAF-D-GRID® T-LATCH PLUG):
      • DOUBLE END 1.5mm² H05VV-F Multi-Country Rated (CB scheme) 16A, 300V
      • DOUBLE END ST 10AWG 30A, 400/600V
      • to IEC 320 C20 SJT Blue
      • to IEC 320 C20 SJT Red
      • to IEC 320 C14 Blue
      • to IEC 320 C14 Red

Clients & Markets

  • AI供應鏈中的關鍵角色 (A Key Role in the AI Supply Chain)

    • Proud to see JPC connectivity on the GTC ecosystem wall.
    • Deeply integrated with next-generation AI ecosystem architectures.
    • Partnering with Anderson Power to address the connectivity challenges of rapidly scaling AI infrastructure.

  • 北美 CSP 需求強勁,帶動JPC營收成長 (Strong demand from North American CSPs driving JPC's revenue growth)

    • 北美市場營收佔比 >60%，其中50%為大型CSP針對AI資料中心的大規模建置。

  • 2026數據中心與EDA應用市場產品開發 (2026 Product Development for Data Center and EDA Applications)

    • 高速光纖線材打入美系與亞洲Tier 1客戶。
    • 800G ACC開始出貨給美系客戶。

  • Next generation high speed memory connector introduction

    • 參與AI領導公司下一世代記憶體高速傳輸介面開發。

  • Next generation high speed connectivity

    • 持續參與 AI GPU 公司下一世代高速傳輸架構設計驗證。
    • 持續參與大型 CSP 公司及 AI 算力供應商下一世代高速傳輸架構設計驗證。

  • Multiple Platform

    • 與多家 AI 晶片供應商共同進行互連客製化設計及驗證。
    • 參與 AMD Platform。
    • 參與 AsteraLabs Platform。
    • 參與其他多家 Platfrom。

  • 攻下 AI GPU POWER目標客戶 (Secure target customers in AI GPU power solutions)

    • 除了各大CSP&ODM客戶順利交貨之外,攻下歐/美/日五家國際目標Power新客戶。(In addition to successful deliveries to major CSP and ODM customers, We have secured five new international target power customers in Europe, the United States, and Japan.)
    • 攻下國際半導體指標性大廠。(We have won business from a leading global semiconductor company.)
    • 合作夥伴/客戶 (From diagrams): Schneider Electric, Vertiv, Stulz, Rittal, Daikin, Mitsubishi Electric, Asetek, Johnson Controls, Nortek, Fujitsu, ABB, Eaton, Comfort Systems USA, Hubbell, Modubuild, Altron A.S., Innovit AG, Mavab.

  • 強強聯手/戰略合作 (Powering Growth Through Strategic Alliances)

    • 長期與國際品牌 Anderson Power攜手合作,出貨北美CSP大廠,因應市場動能高功率、大電流產品需求持續成長。(In long-term strategic collaboration with the international brand Anderson Power, we are shipping to major North American CSPs to meet the growing market demand for high-power, high-current products.)

  • Power cable長期出貨實績 (Power cable Long-Term Shipment Track Record)

    • AI GPU POWER只是起點,高功率與大電流需求,正快速延伸至 AI Robotics、自駕、AMR、智慧城市、能源等市場。(AI GPU power is only the starting point. The demand for high-power and high-current solutions is rapidly expanding into markets such as AI robotics, autonomous driving, AMR, smart cities, and energy.)

Outlook & Strategy

  • Agenda:

    • Current Status and New Business Opportunities Overview (以創新互聯技術,光銅並進,高速驅動AI世代的連結與未來 / Innovative High-Speed Interconnection Solutions for AI Data Centers)
    • Q & A

  • JPC光銅並進:AI基礎設施關鍵互連 (JPC: Optical & Copper Interconnects for AI Infrastructure)

    • 高速傳輸速率 High-Speed Data Transmission: 徹底打通 AI 算力與資料瓶頸。
    • 高功率連接 High-Power Connectivity: 滿足 AI cluster 倍增的嚴苛電力需求。

  • AI供應鏈中的關鍵角色 (A Key Role in the AI Supply Chain)

    • Deeply integrated with next-generation AI ecosystem architectures.
    • Partnering with Anderson Power to address the connectivity challenges of rapidly scaling AI infrastructure.

  • 北美 CSP 需求強勁,帶動JPC營收成長 (Strong demand from North American CSPs driving JPC's revenue growth)

    • 隨 AI 客戶需求成長,PCIe Gen6 與液冷專案有助於產品組合優化,支撐毛利率維持35%以上水準。

  • 矽光子研發團隊Roadmap (Silicon Photonics R&D Roadmap)

    • 加大軟硬體設備投資。(Increased investment in hardware and software infrastructure.)
    • 充實人才目前已擴充3倍技術研發人力。(Expanded R&D workforce by 3x to strengthen technical capabilities.)
    • 未來產品/技術里程碑: 1.6T 2xDR4 (2026), 3.2T NPO (2027), 6.4T (2028), Silicon photonics CPO products, FAU mass production.

  • 2026數據中心與EDA應用市場產品開發 (2026 Product Development for Data Center and EDA Applications)

    • 參與多個單通道100G (400G與800G) 專案。

  • Next generation high speed connectivity

    • PCIE Gen 6 產品將在 2026/H2 開始顯著貢獻營收。(PCIe Gen6 products are expected to begin making meaningful revenue contributions in 2H 2026.)

  • 強化 AI GPU 與 HPC 大電流供電市場布局 (Strengthen strategic deployment in AI GPU and HPC high-current power supply markets.)

    • AI GPU 與 HPC 架構升級,帶動高功率大電流需求成長。(AI GPU and HPC architecture upgrades are driving growth in high-power, high-current demand.)
    • ORV3 等主力產品順利切入各大CSP 與主要ODM 供應鏈。(Core products such as ORV3 have successfully penetrated major CSPs and leading ODM supply chains.)
    • 穩定開始量產出貨,將成為下半年主要成長動能之一。(Stable mass production shipments have commenced and are expected to become one of the key growth drivers in the second half of the year.)

  • 攻下 AI GPU POWER目標客戶 (Secure target customers in AI GPU power solutions)

    • 中國/越南皆可調度分配產能&出貨中。(Both China and Vietnam facilities are capable of flexible capacity allocation and are currently shipping.)

  • Power cable長期出貨實績 (Power cable Long-Term Shipment Track Record)

    • JPC將同步以高功率、大電流與高可靠度技術,持續加強擴張開發設計與製造團隊,拓展下一代智慧基礎建設與市場。(JPC will continue to strengthen and expand its design and manufacturing teams with high-power, high-current, and high-reliability technologies, driving the development of next-generation intelligent infrastructure and markets.)

Additional Data

  • 前瞻性聲明/免責聲明 (Disclaimer on Forward-Looking Statements)
    • 本簡報所載之前瞻性聲明,係基於本公司目前之營運狀況、財務情形與預期,並參考內部資料及外部經濟趨勢所作出。
    • 相關聲明涉及已知及未知之風險與不確定性,實際結果可能與所述或隱含內容存在重大差異,其影響因素包括但不限於市場需求、政策與法規、經濟環境及其他非本公司所能控制之因素。
    • 前瞻性聲明僅反映本簡報發佈當日之觀點,本公司不負有於未來情勢變動時更新或修正相關聲明之義務。
    • This presentation contains forward-looking statements based on the Company's current operational results, financial condition, and expectations, derived from internal data and external economic trends.
    • These statements involve known and unknown risks and uncertainties that may cause actual results to differ materially from those expressed or implied. Such risks include, but are not limited to, changes in market demand, policies and regulations, economic conditions, and other factors beyond the Company's control.
    • The forward-looking statements reflect the Company's views as of the date of this presentation. The Company undertakes no obligation to update or revise these statements should conditions change in the future.

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