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愛普* 2026Q2 法人說明會
6531上市
法人說明會
愛普* 2026Q2 法說會簡報重點與營運摘要

愛普科技股份有限公司 (apmemory) 2026年第一季法人說明會

Disclaimer

簡報中所提供對於產業及本公司前景之預測,係根據目前營運及公開資訊所做出之判斷,相關內容具風險與不確定性。任何外在環境的改變均可能影響公司實際營運與財務狀況,本簡報資料中所提供之資訊,不代表本公司對產業狀況或後續重大發展的完整論述,本公司亦不會因任何新的資訊或事件而更新相關資訊。

Company Overview

  • 專注領域: 提供全球客戶客製化記憶體設計及解決方案之IC設計公司
  • 總部: 台灣新竹台元科技園區
  • 研發: 美/中/台三地合作研發
  • 營運: 台灣營運
  • 集團人數: ~277人
  • 上市時間: 2016年於台灣證交所上市 (股票代號: 6531)
  • 已發行且流通在外股數: 1.62億股 (每股面額5元)

Key Milestones

  • 2011: AP Memory Founded
  • 2016: Listed on TWSE (6531)
  • 2017: Acquired Zentel Electronics; Started S-SiCap™ development
  • 2018: Started VHM™ 3D integration pilot project
  • 2020: Exited specialty DRAM business
  • 2021: VHM™ enters production; 2-for-1 Stock split
  • 2022: Issuance of GDR for US$190M
  • 2023: Kick-off on AI mainstream POC project
  • 2024: S-SiCap™ Interposer (IPC) enters production
  • 2025: S-SiCap™ (IPD) qualified for substrate embedding

Note on Acronyms:

  • VHM™: Very High-bandwidth Memory
  • VHMStack™: Very High-bandwidth Memory with multiple stacked layers
  • S-SiCap™: Stack Silicon Capacitor, AP Memory's SiCap technology which uses a stack capacitor
  • IPC: Capacitor in silicon Interposer
  • IPD: Silicon capacitor embedded in substrate

Financial Highlights

2026 Q1 合併損益表 (in NT$K)

項目 (in NT$K)1Q26%4Q25%1Q25 Note 1%QoQYoY
營業收入 (in US$K)66,26159,97829,68110%123%
平均匯率 (US$/NT$)31.6931.1532.852%(4%)
營業收入2,099,951100%1,868,104100%974,960100%12%115%
營業毛利969,86546%931,51150%453,13846%4%114%
銷管費用110,8655%85,9774%82,8728%29%34%
研發費用270,75113%273,23315%195,18920%(1%)39%
營業費用381,61618%359,21019%278,06128%6%37%
營業利益588,24928%572,30131%175,07718%3%236%
外幣兌換利益140,1456%251,14013%107,12211%(44%)31%
其他業外收入97,2975%85,2425%151,88615%14%(36%)
營業外收入237,44211%336,38218%259,00826%(29%)(8%)
稅前淨利825,69139%908,68349%434,08544%(9%)90%
所得稅費用165,7258%158,8119%88,7609%4%87%
本期淨利659,96631%749,87240%345,32535%(12%)91%
淨利歸屬於:
本公司業主676,21732%765,57741%331,18234%(12%)104%
非控制權益(16,251)(1%)(15,705)(1%)14,1431%(3%)(215%)
基本每股盈餘 (NT$)4.154.712.04(12%)103%
加權平均股數 (仟股)162,798162,687162,4430.07%0.22%
Note 1: 追溯調整因合併Onecent所產生之相關財務數據。

2026 Q1 擬制設算合併損益表:排除GDR未支用數之相關兌換影響 (in NT$K)

Note 1: 追溯調整因合併Onecent所產生之相關財務數據。 Note 2: 所呈現的數據是擬制推估而得,並不反映實際的財務報表資料。

項目 (in NT$K)1Q26%4Q25%1Q25 Note 1%QoQYoY
營業收入 (in US$K)66,26159,97829,68110%123%
平均匯率 (US$/NT$)31.6931.1532.852%(4%)
營業收入2,099,951100%1,868,104100%974,960100%12%115%
營業毛利969,86546%931,51150%453,13846%4%114%
銷管費用110,8655%85,9774%82,8728%29%34%
研發費用270,75113%273,23315%195,18920%(1%)39%
營業費用381,61618%359,21019%278,06128%6%37%
營業利益588,24928%572,30131%175,07718%3%236%
外幣兌換利益 Note 237,8792%72,8534%30,8913%(48%)23%
其他業外收入97,2974%85,2425%151,88616%14%(36%)
營業外收入 Note 2135,1766%158,0959%182,77719%(14%)(26%)
稅前淨利 Note 2723,42534%730,39640%357,85437%(1%)102%
所得稅費用 Note 2145,2727%123,1547%73,5148%18%98%
本期淨利 Note 2578,15327%607,24233%284,34029%(5%)103%
淨利歸屬於:
本公司業主 Note 2594,40428%622,94734%270,19728%(5%)120%
非控制權益(16,251)(1%)(15,705)(1%)14,1431%(3%)(215%)
基本每股盈餘 (NT$) Note 23.653.831.66(5%)120%
加權平均股數 (仟股)162,798162,687162,4430.07%0.22%

2026.03.31 Consolidated Balance Sheet (in NT$K)

Note 1: 追溯調整因合併Onecent所產生之相關財務數據。

項目 (in NT$K)2026.03.31 AMT%2025.12.31 AMT%2025.03.31 Note 1 AMT%
資產總計15,567,366100%14,740,272100%13,691,245100%
現金及約當現金8,765,91556%7,263,19249%5,126,87737%
按攤銷後成本衡量之金融資產2,843,17018%3,755,81425%4,784,83835%
應收帳款743,7175%588,4904%536,3544%
存貨1,190,1758%1,144,7518%1,113,6698%
按公允價值衡量之金融資產247,9612%243,5832%645,6995%
採用權益法之投資956,0326%962,9146%802,6966%
其他資產820,3965%781,5286%681,1125%
負債總計3,557,92723%2,376,22616%2,423,70118%
短期借款50,0000%200,0001%50,0000%
合約負債948,6906%939,5606%274,2762%
應付帳款528,4964%505,2583%230,1842%
本期所得稅負債494,2613%371,7473%355,3743%
應付現金股利1,139,7027%00%1,137,1808%
其他負債396,7783%359,6613%376,6873%
權益總計12,009,43977%12,364,04684%11,267,54482%
歸屬於本公司業主之權益11,813,79876%12,242,59783%11,127,79581%
非控制權益195,6411%121,4491%139,7491%
每股淨值 (NT$)72.5575.2468.48

Products & Technologies

產品線說明 (IoT + AI = IoTRAM™ + S-SiCap™ + VHM™)

  • IoTRAM™: Best memory for IoT, Second to none.
  • S-SiCap™ (IPD + IPC): Integrated Passive Devices (“IPD”) and InterPosers with S-SiCap™ (“IPC”).
  • VHM™ (Including VHMStack™): Best memory solutions for AI/HPC.

Note on Acronyms:

  • VHM™: Very High-bandwidth Memory
  • VHMStack™: Very High-bandwidth Memory with multiple stacked layers
  • S-SiCap™: Stack Silicon Capacitor, AP Memory's SiCap technology which uses a stack capacitor
  • IPC: Capacitor in silicon Interposer
  • IPD: Silicon capacitor embedded in substrate

季度營收及毛利率趨勢 (NT$M)

QuarterIoTRAM (NT$M)VHM (NT$M)S-SiCap (NT$M)Gross Margin (%)
2Q231,00688340%
3Q231,20031941%
4Q231,125241444%
1Q24624408446%
2Q24836555451%
3Q249073234452%
4Q2487924310353%
1Q25855665446%
2Q251,0921716642%
3Q251,1043147746%
4Q251,13755817350%
1Q261,4745721346%

營業利益及業外收支 (NT$M)

  • Operating Profit (NT$M):
    • 1Q26: 588 (28% Operating Margin)
    • 4Q25: 572 (31% Operating Margin)
    • 3Q25: 366 (26% Operating Margin)
    • 2Q25: 389 (24% Operating Margin)
    • 1Q25: 271 (20% Operating Margin)
    • 4Q24: 348 (28% Operating Margin)
    • 3Q24: 381 (30% Operating Margin)
    • 2Q24: 228 (24% Operating Margin)
    • 1Q24: 106 (14% Operating Margin)
    • 4Q23: 284 (21% Operating Margin)
    • 3Q23: 261 (19% Operating Margin)
    • 2Q23: 206 (19% Operating Margin)
  • Non Operating Profit or Loss (NT$M):
    • 1Q26: 237 (11% Non Operating Profit or loss)
    • 4Q25: 336 (18% Non Operating Profit or loss)
    • 3Q25: 364 (26% Non Operating Profit or loss)
    • 2Q25: 214 (23% Non Operating Profit or loss)
    • 1Q25: 99 (9% Non Operating Profit or loss)
    • 4Q24: 259 (24% Non Operating Profit or loss)
    • 3Q24: 26 (2% Non Operating Profit or loss)
    • 2Q24: 381 (31% Non Operating Profit or loss)
    • 1Q24: 364 (49% Non Operating Profit or loss)
    • 4Q23: 389 (31% Non Operating Profit or loss)
    • 3Q23: 259 (19% Non Operating Profit or loss)
    • 2Q23: 206 (19% Non Operating Profit or loss)

歸屬於母公司之稅後淨利 (NT$M)

QuarterNet Income attributable to shareholders of the parent (NT$M)% Net Margin
1Q2667632%
4Q2576641%
3Q2570647%
2Q25-546-41%
1Q2533134%
4Q2450241%
3Q2433726%
2Q2437039%
1Q2436849%
4Q2337032%
3Q2353043%
2Q2348344%

IoTRAM™ 季營收-應用別 (NT$M)

QuarterConnectivity (%)Wearable (%)Video/Audio/Others (%)Total (NT$M)
1Q2642%27%31%1,474
4Q2540%33%27%1,137
3Q2545%31%24%1,104
2Q2547%29%24%1,092
1Q2552%26%22%855
4Q2437%40%23%879
3Q2440%31%29%907
2Q2442%30%28%836
1Q2437%36%27%624
4Q2355%23%22%1,125
3Q2359%20%21%1,200
2Q2357%20%23%1,006

S-SiCap™ 季營收 (NT$M)

QuarterRevenue (NT$M)
1Q26572
4Q25558
3Q25314
2Q25171
1Q2566
4Q24103
3Q2444
2Q2455
1Q2440
4Q2314
3Q239
2Q233

VHM™ 季營收 (NT$M)

QuarterNRE/Licensing/Royalty (NT$M)Wafer Sales (NT$M)Total (NT$M)
1Q26134154
4Q256167173
3Q257777154
2Q2546266
1Q25233154
4Q2493150243
3Q2427296323
2Q24351954
1Q24325284
4Q2342024
3Q2322931
2Q2318788

Products, Services & Technology

IoTRAM™ 產品線近況更新

  • Very Strong Market Demand:
    • Growth came from all applications, especially display (ISP and home security camera) and connectivity (Cellular and Wi-Fi).
    • New applications continue to emerge.
  • ApSRAM™ MP continues:
    • More projects entering MP, 10+ design-in.
    • High density ApSRAM is starting design-in in Q2.
  • IoTRAM™ Market Position Stronger:
    • The comprehensive and well-developed product lineup effectively meets the diverse needs of the market.
    • Commodity long term shortage is driving customers towards IoTRAM™.

先進封裝領域之 IPC/IPD 產品佈局

  1. IPC - Silicon Interposer (“-S”): ≤ 4 reticles
    • Capacitors embedded in silicon interposer.
    • MP started in 2025, ramp continues.
  2. IPD in Substrate (IPD):
    • Capacitors embedded in substrate (For all varieties of 2.5D/3D HPC packages).
    • Qualified, MP in 2Q'26.
  3. Landside Capacitor (LSC/IPD):
    • Capacitor placed on landside of package substrate (Mainly mobile applications).
    • Qualified, MP in 2Q'26.

Note on Acronyms:

  • VHM™: Very High-bandwidth Memory
  • VHMStack™: Very High-bandwidth Memory with multiple stacked layers
  • S-SiCap™: Stack Silicon Capacitor, AP Memory's SiCap technology which uses a stack capacitor
  • IPC: Capacitor in silicon Interposer
  • IPD: Silicon capacitor embedded in substrate

VHM™ 與 VHMStack™ 導入時間軸

  • 4Q'18 - 4Q'21: Early Adopter/ETH Miner Developing
    • VHM™ introduction
    • ETH as an early adopter
    • VHM™ (1+1) supply chain development
  • 4Q'21 - 4Q'24: ETH/ETC MP/AI/HPC POC Developing
    • ETH/ETC MP >20Kpcs wafers shipped
    • AI/HPC POC projects development (VHM™/VHMStack™)
  • 4Q'24 - 1Q'26: AI/HPC Product Developing
    • 1+8Hi VHMStack™ functional silicon demonstration
    • Datacenter and edge AI product discussion
    • Multiple POC ongoing
  • 4Q'27: AI/HPC Product MP

Note: Ethereum (ETH) and Ethereum Classic (ETC) are crypto currencies with Proof-of-Work consensus mechanism.

Outlook & Strategy

未來展望

  • IoTRAM™:
    • Very strong market demand, partly related to shortage in wider DRAM market.
  • S-SiCap™:
    • IPC: Growth continues with minor tool relocation impact.
    • IPD: MP starts in Q2'26. Strong demand driving rapid ramp-up in 2027.
  • VHM™ / VHMStack™ Adoption Continues:
    • VHM™-enabled AI Accelerator product design ongoing.

Note on Acronyms:

  • VHM™: Very High-bandwidth Memory
  • VHMStack™: Very High-bandwidth Memory with multiple stacked layers
  • S-SiCap™: Stack Silicon Capacitor, AP Memory's SiCap technology which uses a stack capacitor
  • IPC: Capacitor in silicon Interposer
  • IPD: Silicon capacitor embedded in substrate

Additional Data

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