錸恩帕斯科技股份有限公司 (股票代號: 7907) 業績說明會
Company Overview
- 公司名稱 (Company Name): 錸恩帕斯科技股份有限公司 (LAIENPARTS TECHNOLOGY)
- 股票代號 (Stock Code): 7907
- 公司標語 (Company Slogan): SOLUTIONS TAILORED TO YOUR NEEDS (We are always ready to provide our customers best solutions.)
- 核心價值 (Core Values): 安全第一 品質至上 服務超前 真誠相待 合群負責 專業卓越 快樂工作
- 成立時間 (Established): 2009年11月 (November 2009)
- 資本額 (Capital): 新台幣393,930千元 (NTD 393,930 thousand)
- 董事長兼總經理 (Chairman & General Manager): 陳俊尹
- 員工人數 (Employees): 169人 (截至115年4月底, as of end of April 2026)
- 公開發行 (Public Offering): 2026年1月16日 (January 16, 2026)
- 興櫃交易 (Emerging Stock Market Trading): 2026年4月22日 (April 22, 2026)
- 相關認證 (Certifications): ISO9001 & ISO45001
業務發展里程碑 (Business Development Milestones)
- 2009: 金融海嘯期間創立 (Established during the financial crisis)
- 2010~2015:
- 自動化超音波清洗機通過半導體大廠合格廠商 (Automated ultrasonic cleaning machines approved by major semiconductor manufacturers)
- 跨入晶圓廠、太陽能廠配管工程 (Entered wafer fab and solar power plant piping engineering)
- 2012/11通過半導體大廠技術審議委員會認可 Gas Hook up合格廠商 (Nov 2012: Gas Hook up approved by major semiconductor manufacturer's technical review committee)
- 2012/12取得 OHSAS 18001 & ISO 9001 認證 (Dec 2012: Obtained OHSAS 18001 & ISO 9001 certifications)
- 2016~2020:
- 2016/10成立南科分公司 (Oct 2016: Established Southern Taiwan Science Park branch)
- 2016/06通過半導體大廠技術審議委員會認可 CAD Design 合格廠商 (June 2016: CAD Design approved by major semiconductor manufacturer's technical review committee)
- 2017/08成立匯聚光能子公司 (Aug 2017: Established Huiju Guangneng subsidiary)
- 2017/09成立南京子公司 (Sep 2017: Established Nanjing subsidiary)
- 2019/12取得半導體廠 Gas Hook up合格廠商 (Dec 2019: Gas Hook up approved by semiconductor manufacturers)
- 2019/12通過半導體大廠技術審議委員會認可 PCW Hook Up 合格廠商 (Dec 2019: PCW Hook Up approved by major semiconductor manufacturer's technical review committee)
- 2020/03首次取得記憶體大廠認可合格廠商 (Mar 2020: First time approved as qualified vendor by major memory manufacturer)
- 2021~迄今 (Present):
- 2021/10取得記憶體廠 CAD Design & Gas Hook up合格廠商 (Oct 2021: CAD Design & Gas Hook up approved by memory manufacturers)
- 2022/06取得美國半導體大廠訂單 (June 2022: Obtained orders from major US semiconductor manufacturers)
- 2022/10首次發行員工認股權 (Oct 2022: First issuance of employee stock options)
- 2022/11首次取得日本半導體大廠訂單 (Nov 2022: First time obtained orders from major Japanese semiconductor manufacturers)
- 2023/03成立日本子公司LPsT株式会社 (Mar 2023: Established Japanese subsidiary LPsT Co., Ltd.)
- 2024/12成立美國子公司LPsT USA INC (Dec 2024: Established US subsidiary LPsT USA INC)
- 2025/10美國子公司取得美國半導體大廠合格廠商 (Oct 2025: US subsidiary obtained qualification as a vendor for major US semiconductor manufacturers)
集團組織 (Group Organization)
- 錸恩帕斯科技 (Laienparts Technology)
- 新能源事業 (New Energy Business)
- 匯聚光能公司 (Huiju Guangneng Co.) (100% owned)
- 太陽能電廠SPV (Solar Power Plant SPV) (100% owned)
- 半導體廠務工程 (Semiconductor Fab Engineering)
- LPST USA INC. (100% owned)
- LPST 株式会社 (LPST Co., Ltd. Japan) (100% owned)
- 錸恩帕斯(南京) (Laienparts (Nanjing)) (100% owned)
- 新能源事業 (New Energy Business)
全球布局 (Global Layout)
- 美國 (USA): LPST USA INC. (Arizona, USA) - LPST美國子公司
- 中國 (China): 中國南京 (Nanjing, China)
- 日本 (Japan): 日本熊本 (Kumamoto, Japan) - LPST 株式会社
- 台灣 (Taiwan) - Head Office in Tainan:
- Linkou Office
- HsinChu Office
- Taichung Office
- Tainan Branch in STSP
- Kaohsiung Office
團隊介紹 (Team Introduction)
- 董事長兼總經理 (Board Chairman & General Manager): 陳俊尹
- 學經歷 (Education & Experience): 中山大學公共事務管理研究所碩士, 高雄捷運PMO專案工程師
- 執行副總經理 (Executive Vice General Manager): 蔡育宗
- 學經歷 (Education & Experience): 建國科技大學機械系, 聯亞科技(股)工程師, 漢科系統(股)公司工程主任
- 副總經理 (Vice General Manager): 林惠真
- 學經歷 (Education & Experience): 僑光科技大學會計資訊系, 裕元花園酒店市場行銷協理, 桂田酒店資深財務經理兼行銷協理
- 會計主管 (Accounting Manager): 高金蘭
- 學經歷 (Education & Experience): 美國舊金山金門大學財務金融碩士, 亞洲航空(股)財務副總經理
- 研發處長 (R&D Director): 施姬妃
- 學經歷 (Education & Experience): 成功大學國際經營研究所碩士, 明安國際企業股份有限公司 專案開發, 智遊科技服務股份有限公司 營運長
- 工程處副總經理 (Engineering Department Vice General Manager): 蔡家丞
- 學經歷 (Education & Experience): 吳鳳技術學院財金系, 譜榮系統科技股份有限公司 專案經理
- 設計規劃處副總經理 (Design & Planning Department Vice General Manager): 林冠華
- 學經歷 (Education & Experience): 南台科大機械系
Products & Services
核心服務 (Core Services)
- 廠務系統工程 (Engineering)
- Engineering Consultant
- Gas Distribution System
- Hook-up Design & Construction
- Chemical / GAS / DIW / Drain Piping / PCW Piping / Exhaust / Vacuum Piping
- Manufacturing Tool Relocation
- 設計繪圖 (CAD)
- CAD Team
- MAIN PIPE System
- SUB-FAB Layout
- Merge
- 太陽 (Solar System)
- Maintenance Service
- Solar Power Sale
- 設備 (Equipment)
- Ultrasonic Cleaner
- Oven
- Parts storage / Working station
競爭優勢 (Competitive Advantages)
- 承攬經驗及施工品質管理深獲客戶信賴 (Extensive contracting experience and quality construction management earn deep customer trust)
- 提供在地化與即時化服務能力 (Ability to provide localized and real-time services)
- 經驗豐富的團隊與彈性調度能力 (Experienced team and flexible deployment capability)
- 專業技術人才認證 (Professional technical talent certification)
- 海外布局完整 (Complete overseas layout)
Clients & Markets
客戶實績 (Client Performance)
- 半導體產業 (Semiconductor Industry): AWSC, AccuDEVICE, BRILLIANT, MIC, EBARA, DAIFUKU, micron, KLA, ASML, EDWARDS, TSMC, tPC, CTCI, jasm, muRata, winbond, UMC, RORZE, Hermes Epitek.
Financial Highlights
營收及稅後淨利 (Revenue & Net Income After Tax)
- 個體營收及稅後淨利 (Individual Revenue & Net Income After Tax)
- 營收成長 (Revenue Growth): 18%
- 獲利成長 (Profit Growth): 17%
- | 年度 | 營業收入 (Revenue) | 稅後淨利 (Net Income After Tax) | | :--- | :----------------- | :------------------------------ | | 2022 | 1,214,050 | 268,676 | | 2023 | 1,079,750 | 279,307 | | 2024 | 1,202,384 | 284,053 | | 2025 | 1,424,148 | 331,616 |
- 合併營收及稅後淨利 (Consolidated Revenue & Net Income After Tax)
- 營收成長 (Revenue Growth): 10%
- 獲利成長 (Profit Growth): 20%
- | 年度 | 營業收入 (Revenue) | 稅後淨利 (Net Income After Tax) | | :--- | :----------------- | :------------------------------ | | 2022 | 1,485,251 | 257,225 | | 2023 | 1,318,311 | 277,628 | | 2024 | 1,418,843 | 275,778 | | 2025 | 1,554,405 | 331,193 |
產業分布 (Industry Distribution)
- 2024年 產業分布比例 (Industry Distribution Ratio)
- 晶圓代工 (Foundry): 64%
- 太陽能 (Solar): 17%
- 記憶體 (Memory): 19%
- 2025年 產業分布比例 (Industry Distribution Ratio)
- 晶圓代工 (Foundry): 55%
- 太陽能 (Solar): 8%
- 記憶體 (Memory): 37%
股利發放 (Dividend Distribution)
- 註: EPS為追朔調整 (EPS is retrospectively adjusted)
-
年度 EPS(註) 現金股利 (Cash Dividend) 股票股利 (Stock Dividend) 分配率 (Payout Ratio) 114年度 (2025) 8.42 7.5 - 89% 113年度 (2024) 7.80 6.5 - 83% 112年度 (2023) 7.67 8.5 - 100% 111年度 (2022) 7.37 4.0 1.5 75%
Outlook & Strategy
市場趨勢 (Market Trends)
- 全球半導體市場趨勢 (依終端應用別) (Global Semiconductor Market Trends (by End Application))
- 2024-2029 CAGR 10.5%
- 半導體市場持續高度成長,運算用電子產品為未來半導體成長的主要動能,2029年全球半導體營收預估成長至10,812億美元。 (The semiconductor market continues to grow at a high rate, with computing electronics being the main driver for future semiconductor growth. Global semiconductor revenue is estimated to grow to US$1,081.2 billion in 2029.)
- 2024-2029 CAGR by Application:
- 工業/軍事/航空用電子 (Industrial/Military/Aerospace Electronics): 10.0%
- 儲存用電子 (Storage Electronics): 5.9%
- 運算用電子 (Computing Electronics): 17.2%
- 消費性電子 (Consumer Electronics): 6.1%
- 車用電子 (Automotive Electronics): 7.0%
- 通訊用電子 (Communication Electronics): 4.0%
- 全球半導體市場年成長率 (Global Semiconductor Market Annual Growth Rate):
- 2024: 21.0%
- 2025: 17.8%
- 2026: 11.9%
- 2027: 10.4%
- 2028: 3.7%
- 2029: 9.3%
- 半導體營收 (Semiconductor Revenue) (百萬美元 - Million USD):
- 2024: 655,882
- 2025: 772,597
- 2026: 864,290
- 2027: 954,203
- 2028: 989,554
- 2029: 1,081,218
- 資料來源 (Data Source): 工研院產科國際所 (ITRI Industrial Economics and Knowledge Center)
產業資本支出趨勢 (Industry Capital Expenditure Trends)
- Global Semiconductor Fab Equipment Spending Forecast (2024-2027) (Spending (USD Billion))
- 2024: $115.7B
- 2025: $133.0B
- 2026: $150.0B
- 2027: $156.0B
- 台積電 (TSMC): 2026 資本支出,預估挑戰 520 - 560 億美元的新紀錄。 (2026 capital expenditure is estimated to challenge a new record of US$52-56 billion.)
- 美光 (Micron): 2026年資本支出上修至 200 億美元。 (2026 capital expenditure revised upwards to US$20 billion.)
- 資料來源 (Data Source): SEMI
導入AI輔助管理工程 (Introduction of AI-Assisted Management Engineering)
- 目標 (Goal):
- 藉由AI技術,將工程生命週期轉為智慧流程,降低人為錯誤與重工風險,提升整體效益。(By leveraging AI technology, transform the engineering lifecycle into intelligent processes, reduce human errors and rework risks, and enhance overall efficiency.)
- 建置屬於LPsT的AI大腦。(Establish LPsT's AI brain.)
- AI應用流程 (AI Application Workflow): 手稿 (Manuscript) -> PID圖 (PID Diagram) -> BOM表 (BOM List) -> 請款表 (Payment Request Form)
- 效益 (Benefits): 利用AI智慧,辨識,彙整,分析,產出,目標節省人工作業時間,約每月600工時。(Utilize AI intelligence to identify, consolidate, analyze, and generate, aiming to save approximately 600 man-hours per month.)
- 現狀痛點 (Current Pain Point): 流程冗長 高度仰賴人力 (Lengthy process, highly reliant on human labor)
ESG / Sustainability
企業捐贈 (Corporate Donations)
- 捐贈台南市復康巴士 (Donated a rehabilitation bus to Tainan City)
- 贊助第二屆錸恩帕斯科技盃羽球賽 (Sponsored the 2nd Laienparts Technology Badminton Tournament)
- 設立錸恩帕斯獎助學金 (Established Laienparts Technology Scholarship)
- 舉辦捐血活動 (Organized blood donation events)
節能減碳 (Energy Saving & Carbon Reduction)
- 1 節能措施 (Energy Saving Measures)
- 總公司屋頂與車棚上方建置太陽能板(251KWp) (Solar panels (251KWp) installed on the headquarters' rooftop and carport)
- 濁幹線建置太陽能(12MWp) (Solar power (12MWp) installed along the Zhuoshui River main canal)
- 2 節能改善成果 (Energy Saving Improvement Results)
- 可自發自用+躉售及屋頂降溫 (Can generate for self-use + sell surplus power and cool rooftops)
- 監控系統異常分析 (Monitoring system for anomaly analysis)
- 3 整體效益 (Overall Benefits)
- 總公司太陽能建置: 251KWp (Headquarters solar installation: 251KWp)
- 濁幹線: 12MWp (Zhuoshui River main canal: 12MWp)
- 其他: 2.7MWp (Others: 2.7MWp)
- 太陽能電廠設置明細 (Solar Power Plant Installation Details)
- | 項目 | 永科一期 | 永科二期 | 永科三期 | 永科車棚 | Total | | :--------- | :--------- | :--------- | :------------- | :------------- | :------ | | 上線日期 | 102/12/17 | 106/9/22 | 113/3/15 | 114/4/24 | | | 容量(KWP) | 29.5 | 63.8 | 135.7 | 22.8 | 251.8 | | 用途 | 全躉售 | 全躉售 | 自用自發多餘躉售 | 自用自發多餘躉售 | (41) |
Additional Data
獲獎肯定 (Awards & Recognition)
- 第三十四屆國家磐石獎 (34th National Outstanding SME Award (磐石獎))
- 從台灣出發,走向國際,獲得第三十四屆國家磐石獎肯定。(Starting from Taiwan, going global, recognized with the 34th National Outstanding SME Award.)
- 專注半導體與光電高科技工程,結合 AI 管理與 CAD 模組化,提供設計與工程整合服務,打造高品質、低風險的智慧工程解決方案。(Specializing in semiconductor and optoelectronic high-tech engineering, integrating AI management and CAD modularization, providing integrated design and engineering services, creating high-quality, low-risk intelligent engineering solutions.)
院長拜訪 (President's Visit)
- 從傳統工程管理到AI 管理工程 錸恩帕斯科技的產業升級實踐 (From traditional engineering management to AI-managed engineering: Laienparts Technology's industry upgrade practice)
- 由製程設計、配管、工程施工到管理服務等各階段,具備整合能力,並提供一站式解決方案,落實政府對於產業的期待。(Possessing integrated capabilities from process design, piping, engineering construction to management services, and providing one-stop solutions, fulfilling the government's expectations for the industry.)
品質保證 (Quality Assurance) - Honors
- 2026.03月協助緊急應變,積極支援復原工作 (March 2026: Assisted in emergency response, actively supported recovery efforts)
- 2025.12月卓越支援CAD Layout,表現優異 (Dec 2025: Excellent support for CAD Layout, outstanding performance)
- 2025.10月主動預警風險,有效預防事故發生 (Oct 2025: Proactive risk warning, effectively prevented accidents)
- 2025.8月GAS團隊緊急搶修裝機工程協助進度如期完工感謝狀 (Aug 2025: GAS team emergency repair and installation engineering assistance, completed on schedule, letter of appreciation)
- 2025.5月發現現場異常並協助改善,表現優異感謝狀 (May 2025: Discovered on-site anomalies and assisted in improvements, outstanding performance, letter of appreciation)
- 2024年度獎優良監工/優良工安專業技能優異高效的執行力獎狀 (2024 Annual Award for Excellent Supervisor/Excellent Industrial Safety Professional Skills, outstanding and efficient execution award)
- 2024年優良監工協助F23 GAS測試功率提升30% (2024 Excellent Supervisor assisted in F23 GAS test power increase by 30%)
- 2022.12月半導體大廠優良承攬商獎 (Dec 2022: Major Semiconductor Manufacturer Excellent Contractor Award)
- 2018.4月F15BN10改機期間落實督導查核及進度掌握感謝狀 (Apr 2018: Implemented supervision and inspection during F15BN10 modification and grasped progress, letter of appreciation)
- 2016.1月全力支援APM GAS模組裝機工程高度貢獻獎 (Jan 2016: Fully supported APM GAS module installation engineering, highly contributing award)
- 2016.1月F12P7N10裝機時程掌握感謝狀 (Jan 2016: Grasped F12P7N10 installation schedule, letter of appreciation)
- 2015.4月F14A裝機工程獎勵獎狀 (Apr 2015: F14A installation engineering commendation award)
- 2014 Q4南科Hookup Award (2014 Q4 Southern Taiwan Science Park Hookup Award)
- 2014.11月獲得Highly Performance Award (Nov 2014: Received Highly Performance Award)
- 2014 Q3半導體大廠傑出貢獻獎 (2014 Q3 Major Semiconductor Manufacturer Outstanding Contribution Award)
- 2012 P4 HCDA/IO2管路緊急搶修獲得半導體大廠部經理獎 (2012 P4 HCDA/IO2 piping emergency repair received Major Semiconductor Manufacturer Department Manager Award)