DFI 2026Q1 法說會簡報
Company Overview
DFI (友通) is a company focused on AI edge computing infrastructure and application-oriented edge AI platforms. Slogan: Desire for Innovation
Financial Highlights
2026年第一季財務結果及業務摘要 (2026 Q1 Financial Results & Business Summary)
合併綜合損益表摘要 (Consolidated Comprehensive Income Statement Summary) 單位: 新台幣千元 (Unit: NT$ Thousand)
| 項目 (Item) | 2025年第四季 (2025 Q4) | 2026年第一季 (2026 Q1) | 2025年第一季 (2025 Q1) |
|---|---|---|---|
| 銷貨淨額 (Net Sales) | 2,862,049 (100.0%) | 3,030,612 (100.0%) | 2,556,705 (100.0%) |
| 營業成本 (Cost of Goods Sold) | (2,201,665) | (2,276,204) | (1,817,754) |
| 營業毛利 (Gross Profit) | 660,384 (23.1%) | 754,408 (24.9%) | 738,951 (28.9%) |
| 營業費用 (Operating Expenses) | (709,199) (-24.8%) | (585,648) (-19.3%) | (539,546) (-21.1%) |
| 營業淨利 (Operating Income) | (48,815) (-1.7%) | 168,760 (5.6%) | 199,405 (7.8%) |
| 營業外收支及費用 (Non-operating Income and Expenses) | (6,183) | (8,171) | (19,716) |
| 稅前淨利 (Income Before Tax) | (54,998) (-1.9%) | 160,589 (5.3%) | 179,689 (7.0%) |
| 本期淨利 (Net Income) | (55,713) (-1.9%) | 120,365 (4.0%) | 138,713 (5.4%) |
| 本期淨利歸屬於母公司業主 (Net Income Attributable to Owners of the Parent) | 1,953 (0.1%) | 86,809 (2.9%) | 106,558 (4.2%) |
| 基本每股盈餘(NT$)(a) (Basic EPS (NT$)(a)) | $0.01 | $0.76 | $0.93 |
| (a)基本每股盈餘以加權平均流通在外股數計算(千股) ((a) Basic EPS is calculated based on weighted average outstanding shares (in thousands)) | 114,488 | 114,488 | 114,488 |
合併資產負債表摘要 (Consolidated Balance Sheet Summary) 單位: 新台幣千元 (Unit: NT$ Thousand)
| 項目 (Item) | 2026.03.31 | 2025.12.31 | 2025.03.31 |
|---|---|---|---|
| 現金及約當現金 (Cash and Cash Equivalents) | 2,502,436 (19%) | 2,403,301 (19%) | 2,243,515 (19%) |
| 應收票據及帳款(含關係人) (Notes and Accounts Receivable (including related parties)) | 2,140,183 (16%) | 2,044,914 (16%) | 2,012,826 (17%) |
| 存貨 (Inventories) | 2,954,877 (23%) | 2,517,513 (21%) | 2,285,510 (19%) |
| 不動產、廠房及設備 (Property, Plant and Equipment) | 2,282,621 (17%) | 2,173,157 (18%) | 2,275,844 (19%) |
| 總資產 (Total Assets) | 13,261,955 (100%) | 12,356,077 (100%) | 11,975,167 (100%) |
| 流動負債 (Current Liabilities) | 5,564,770 (42%) | 4,635,956 (38%) | 4,314,384 (36%) |
| 非流動負債 (Non-current Liabilities) | 2,140,548 (16%) | 2,018,181 (16%) | 2,077,067 (17%) |
| 權益總計 (Total Equity) | 5,556,637 (42%) | 5,701,940 (46%) | 5,583,716 (47%) |
| 每股淨值 (NT$) (Net Asset Value Per Share (NT$)) | 28.20 | 29.72 | 28.52 |
| 每股淨值以流通在外股數計算(千股) (Net Asset Value Per Share is calculated based on outstanding shares (in thousands)) | 114,488 | 114,488 | 114,488 |
重要財務指標 (Important Financial Indicators)
| 項目 (Item) | 2026.03.31 | 2025.12.31 | 2025.03.31 |
|---|---|---|---|
| 應收帳款週轉天數 (Days Sales Outstanding (DSO)) | 63 | 74 | 77 |
| 存貨週轉天數 (Days Inventory Outstanding (DIO)) | 110 | 121 | 110 |
| 應付帳款週轉天數 (Days Payable Outstanding (DPO)) | 80 | 78 | 76 |
| 營運資金週轉天數 (Cash Conversion Cycle (CCC)) | 93 | 117 | 111 |
| 權益報酬率(年化)(a) (Return on Equity (Annualized)(a)) | 8.6% | 5.7% | 9.7% |
| 流動比率 (Current Ratio) | 145% | 159% | 159% |
| (a)採年化稅後損益/平均權益總額 ((a) Calculated as annualized net income after tax / average total equity) |
Business Segments
DFI's business is segmented by applications, regions, and products.
2026 Q1 Business Mix (Total NT$M: 3,031)
應用 (Applications):
- Automation: 46%
- Embedded: 36%
- Security: 18%
區域 (Regions):
- Asia Pacific: 51%
- EMEA: 26%
- America: 23%
產品 (Products):
- OT Service: 45%
- Computer on Module: 24%
- AI Security: 18%
- Computer in Box: 8%
- Computer with Panel: 5%
2025 Q1 Business Mix (Total NT$M: 2,557)
應用 (Applications):
- Automation: 41%
- Embedded: 39%
- Security: 20%
區域 (Regions):
- Asia Pacific: 48%
- America: 28%
- EMEA: 24%
產品 (Products):
- OT Service: 42%
- Computer on Module: 26%
- AI Security: 20%
- Computer in Box: 8%
- Computer with Panel: 4%
Products & Technologies
友通應用導向邊緣AI平台加速AI規模化落地 (DFI Application-Oriented Edge AI Platform Accelerates AI Scalable Deployment)
Key Applications:
- Factory Automation: Increased Factory Productivity
- Gaming: Immersive Gaming Experience
- Defense / Marine: Reliable & Swift Response
- Smart Medical: Enhance Diagnostic Quality
- Smart Transportation: Real-Time Safety Analytics
- Gas / Oil / Energy: Energy AIoT Connectivity
Product Offering Portfolio:
- Motherboards
- Single Board Computers
- System on Modules
- Systems
- Edge Servers
- Panel PCs/Displays
- KIOSKS
- Peripherals
- FW/BIOS/Driver/OS
DFI AI 邊緣運算基礎架構實現AI場域化部署 (DFI AI Edge Computing Infrastructure for AI Field Deployment)
Regional Deployments & Products:
- USA: Factory Automation Control Board
- Product: ADN553 (3.5"SBC)
- Singapore: Defense AI Computing Technology
- Product: BTS610 (ATX)
- India: Gas Station Edge Data Integration System
- Product: EC700-BT (Ultra Compact System)
- Denmark: Robotic / Logistic for AMR
- Product: ASL600 (SMARC)
DFI 邊緣AI平台: NVIDIA Jetson x GMSL-解鎖高速、長距離 AI 視覺應用 (DFI Edge AI Platform: NVIDIA Jetson x GMSL - Unlocking High-Speed, Long-Distance AI Vision)
Key Technology & Products:
- Unlocking High-Speed, Long-Distance AI Vision
- Powered by the NVIDIA Jetson Orin platform.
- Delivers up to 275 TOPS of AI performance.
- Features comprehensive GMSL2 support.
- Enables low-latency, long-distance (up to 15m), and anti-interference high-resolution video transmission for critical industrial applications.
- 2025 Q4 - 2026 Q1: DFI x Nvidia Jetson Orin-based Edge AI Platforms
- X6 Series: X6-ORN-GMSL, X6X-ORN, and X6a-AGX
- System Supports GMSL2
- Up to 275 TOPS
- Rugged IP67
- X6 Series: X6-ORN-GMSL, X6X-ORN, and X6a-AGX
DFI x Mobilint Co-MKT: High-Performance Edge AI Solution
- Showcase @ 2026 Computex
- Vision AI + VLM
- Weapon Detection for Public Safety
- Mobilint PCIe Card + WM130-RPS
- Product: MOBILINT MLA100 Vision & VLM Powered by ARIES
Outlook & Strategy
營運展望 (Operational Outlook)
MIT 製造擴展:實現高效率邊緣AI部署 (MIT Manufacturing Expansion: Achieving High-Efficiency Edge AI Deployment)
PCBA Capacity:
- Target 45% Increase in 2026
- 5 SMT mass production lines, 1 prototype line, and 2 MI testing lines
System Assembly:
- Target 4.75% Growth in 2026
- Robust system assembly and integration capabilities to support diverse product and project requirements.
- Server assembly and testing capabilities to support various form factors and application scenarios.
- AI Vision Solution to minimize rework costs, boost productivity, and ensure production traceability.
Global Manufacturing Capability With Local Service Agility:
- VIETNAM - Hanoi: PCB Assembly (✔), System Assembly (✔)
- CHINA - Suzhou: PCB Assembly (✔), System Assembly (✔)
- TAIWAN - Taoyuan: PCB Assembly (⬆), System Assembly (⬆)
Global Supply Chain:
- Global Sourcing
- Customer's Consignment
Additional Data
免責聲明 (Disclaimer)
本次法說會提供之簡報包含前瞻性陳述,內容包含本公司財務狀況、未來擴張計劃及公司策略等訊息。此前瞻性陳述係基於本公司目前可得資訊對未來事件的期望和預測,儘管本公司認為該期望和預測具合理性,但此類前瞻性聲明仍涉及風險及不確定性。
鑒於這些風險、不確定性及假設,前瞻性事件可能不會發生,且本公司實際結果可能與這些前瞻性聲明中的預期存在重大差異。若因未來實際結果與預期狀況有重大差異,須公開更新或修改任何前瞻性陳述,本公司將不承擔此責任。