Actron Technology (8255.TT) 2026Q1 法說會簡報
Company Overview
- 公司名稱: Actron Technology
- 股票代號: 8255.TT
- 會議名稱: Investor Conference
- 日期: May 26, 2026
- 發言人/與會者:
- 吳憲忠 George Wu: President / Spokesperson
- 黃錫欽 Jason Huang: VP of Sales & Marketing / Deputy Spokesperson
- 鍾曉瑩 Mia Chung: Special assistance / Investor Relations
- 版權: Copyright© Actron. All Rights Reserved
Financial Highlights
Statements of Comprehensive Income
(Amount: NT$ Million)
| Metric | 1Q2026 Amount | 1Q2026 % | 4Q2025 Amount | 4Q2025 % | 1Q2025 Amount | 1Q2025 % | 1Q26 Over 4Q25 % | 1Q26 Over 1Q25 % |
|---|---|---|---|---|---|---|---|---|
| Net operating revenue | 2,037 | 100.00 | 1,840 | 100.00 | 2,116 | 100.00 | 10.71 | -3.73 |
| Operating costs | 1,488 | 73.05 | 1,352 | 73.48 | 1,507 | 71.22 | 10.06 | -1.26 |
| Gross profit | 549 | 26.95 | 488 | 26.52 | 609 | 28.78 | 12.50 | -9.85 |
| Operating expenses | 419 | 20.57 | 428 | 23.26 | 370 | 17.49 | -2.10 | 13.24 |
| Operating income | 130 | 6.38 | 60 | 3.26 | 239 | 11.29 | 116.67 | -45.61 |
| Non-operating income and expenses | 40 | 1.96 | 66 | 3.59 | 69 | 3.26 | -160.61 | -42.03 |
| Profit before tax | 170 | 8.35 | 126 | 6.85 | 308 | 14.56 | 34.92 | -44.81 |
| Net profit attributable to: Owners of the parent company | 173 | 8.49 | 170 | 9.24 | 236 | 11.15 | 1.76 | -26.69 |
| EPS(NT$) | 1.70 | 1.67 | 2.32 | 1.80 | -26.72 |
Quarterly Revenue
(Unit: NT$M)
- 1Q2025: 2,116
- 2Q2025: 2,163
- 3Q2025: 1,987
- 4Q2025: 1,840
- 1Q2026: 2,037
Quarterly EPS
- 1Q2025: 2.32
- 2Q2025: 0.38
- 3Q2025: 1.95
- 4Q2025: 1.67
- 1Q2026: 1.70
Sales Contribution by Products
- 2025:
- DIODE: 29%
- LLD: 28%
- ULLD: 21%
- xEV: 22%
- 2026(F):
- DIODE: 18%
- LLD: 29%
- ULLD: 21%
- xEV: 32%
Products & Technologies
Actron AI 電源戰略: 掌握 HVDC / SST 長期成長商機 (Actron AI Power Strategy: Seizing Long-term Growth Opportunities in HVDC / SST)
1. 架構演進趨勢 (Architectural Evolution Trends)
- Stage 1 (2024~2026): AC + 48V 分散架構 (Distributed Architecture)
- 技術: SI MOSFET / Diode
- 需求趨勢: 逐步成長 (Gradual Growth)
- Stage 2 (2027~2030): HVDC (800V) 集中化 (Centralization)
- 技術: SiC + GaN + Si
- 需求趨勢: 穩健成長 (Steady Growth)
- Stage 3 (2031~2035): HVDC + SST 超集中化 (Ultra-Centralization)
- 技術: SiC / GaN
- 需求趨勢: 長期成長 (Long-term Growth)
2. 功率元件策略 (Power Component Strategy)
- PSU / BBU (AI 資料中心):
- 目前: Discrete 為主 (Mainly Discrete)
- 封裝: TO-220, TO-247, TO-263
- 未來: 小型化封裝趨勢 (Miniaturized Packaging Trend)
- 封裝: TOLL, TOLT, QDPAK
- 挑戰: 體積限制 → Module 非最佳解 (Volume Limitation → Module is not the optimal solution)
- 目前: Discrete 為主 (Mainly Discrete)
- SST / HVDC (下一代架構):
- 主流技術: SiC (高電壓) (High Voltage)
- 解決方案: Module 為主 (Mainly Module)
- 優勢: 高電壓 / 大功率 / 高可靠度 → Module 為核心解決方案 (High Voltage / High Power / High Reliability → Module as core solution)
Complete Power Semiconductor Portfolio
- Power Module-Focused Solutions for AI-HVDC, PSU & Industrial Systems
- POWER DISCRETE Si / SiC / GaN:
- Standard & Advanced Packages:
- TO-247
- TOLL
- TOLT* (*In Development)
- QDPAK* (*In Development)
- 優化: Optimized for efficiency, thermal performance & compact design
- Standard & Advanced Packages:
- POWER MODULE – CORE FOR AI & HVDC SYSTEMS:
- INDUSTRIAL PLATFORMS:
- AEA (Easy 1B): Cost-effective, reliable
- AEB (Easy 2B): High performance, low inductance
- A62 (62mm): High power / high current
- ADP (ED3): Compact, standard platform
- AUTOMOTIVE PLATFORMS:
- AEP (HPD): High power density
- ATS: Compact, thermal optimized
- Optimized for AI Power Systems:
- High Efficiency × High Power Density × High Reliability
- 應用領域: AI-HVDC, PSU, BBU, SST, ESS, Motor Drive
- INDUSTRIAL PLATFORMS:
- INTEGRATED POWER MODULE (IPM):
- SD DIP (Super Mini DIP): Compact integrated solution
- MD DIP (Mini DIP): For motor & industrial control, Compact integrated solution for motor & industrial control
- 關鍵能力/特色:
- Wide Voltage Coverage: 650V → 3300V+
- Power Module Focus for AI-HVDC & PSU
- Discrete + Module Complete Solution
- Automotive-Grade Reliability
Clients & Markets
4. 關鍵驅動力與主要應用 (Key Drivers and Main Applications)
- 關鍵驅動力:
- AI 伺服器電源需求 (AI Server Power Demand)
- HVDC 基礎建設 (HVDC Infrastructure)
- ESS 需求擴大 (ESS Demand Expansion)
- 馬達驅動效率提升 (Motor Drive Efficiency Improvement)
- SST 與電網現代化 (SST and Grid Modernization)
- 主要應用:
- AI 資料中心 (AI Data Centers)
- 電動車充電樁 (EV Charging Stations)
- 再生能源 (Renewable Energy)
- 工業自動化 (Industrial Automation)
- UPS / ESS
Outlook & Strategy
3. 預期商機 (中長期) (Expected Business Opportunities (Mid-to-Long Term))
- AI 資料中心、HVDC、SST 與 ESS 等應用帶動市場需求成長 (AI data centers, HVDC, SST, and ESS applications drive market demand growth)
- 我們的機會 (Our Opportunities):
- 從 Discrete 延伸至高價值 Module (Extend from Discrete to high-value Modules)
- 聚焦高電壓 / 大功率與高可靠度應用 (Focus on high-voltage / high-power and high-reliability applications)
- 掌握下一波架構升級所帶來的成長機會 (Seize growth opportunities from the next wave of architectural upgrades)
- 總結: Actron IEBU 將持續布局 SiC 技術與高電壓應用,掌握 AI 與 HVDC 帶來的長期成長機會 (Actron IEBU will continue to deploy SiC technology and high-voltage applications, seizing long-term growth opportunities brought by AI and HVDC).
Additional Data
- Agenda Items (without detailed content in slides):
- Global Automobile Sales
- Q & A