EZconn (6442.TW) 2025Q1 法說會簡報

Company Overview

EZconn Overview Innovating for a sustainable future

公司簡介

Established in 1977
2025 revenue US$ 300+ million;
2026 revenue expected to continue to grow.
Listed on Taiwan stock market in 2015 (Stock symbol: 6442.TW)
1400+ employees
Headquarters: Taiwan
Oversea presence: USA, the Philippines, the Czech Republic, the People Republic of China

Global Sites

Trutnov, Czech Republic
- Research and Development
- ISO 9001, ISO-14001
- Wafer Level Packaging
New Taipei City, Taiwan
- Headquarters
- ISO-9001, ISO-14001
- Low-volume Production
Ningbo, China
- Research and Development
- ISO-9001, ISO-14001
- High-volume Production
Lipa, Philippines
- Research and Development
- ISO-9001, ISO-14001
- High-volume Production
(Additional site image, likely in Taiwan or China, with Research and Development, ISO-9001, ISO-14001, High-volume Production)

Core Competency

Customized Design
- Customized designs of optical, mechanical, and electronic packaging.
Precision Machinery
- Maintaining micro level precision machining capabilities in mass production.
Miniaturization
- Experienced in miniaturizing modules/components in various applications.
Quality Production
- Attained quality recognition from 1st tier customers.
Intellectual Property
- With over 180+ active issued patents and thousands of interconnect designs in its library.

Financial Highlights

經營績效-營收與獲利 單位: 新台幣仟元; %

營業收入

年度	營業收入 (仟元)
112年度	2,617,385
113年度	6,410,405
114年度	10,527,227

稅前利益

年度	稅前利益 (仟元)
112年度	247,753
113年度	1,422,286
114年度	2,378,298

每股盈餘 單位: 新台幣元

年度	每股盈餘 (元)
112年度	2.53
113年度	14.30
114年度	23.46

毛利率

年度	毛利率 (%)
112年度	35.55%
113年度	55.62%
114年度	57.74%

經營績效-115年第一季營運狀況 單位: 新台幣仟元; %

項目	114年第一季	115年第一季
營業收入	2,104,723	2,705,681
稅前淨利	440,791	815,767
毛利率(%)	49.42%	55.41%
營業淨利	382,280	714,267
每股盈餘(元)	4.26	7.82

經營績效-財務分析

項目	2026.3.31	2025.12.31	2025.3.31
財務結構
負債占資產比率(%)	53.24	49.04	56.03
償債能力
流動比率(%)	215.86	268.62	173.95
獲利能力
權益報酬率(%)	34.94	33.76	35.38
每股淨值(元)	90.52	87.90	46.95

Business Segments

Market Sectors

Broadband Networks – Access (Last-Mile)
- Optical engines for “Fiber to the Home" (FTTH) for Telcos
- RF interconnects for cable service providers
AI infrastructure – Hyperscalers (large-scale data centers)
- Scale-out: high-density fiber deployment connecting data centers' physical structures
- Scale-up: active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026)
- * CPO-ELS stands for "co-packaging optics with external laser source” - essential chip packaging for AI processing at server level in data centers.
Biomedical & Scientific
- Miniaturized optical units for testing and probing instruments using OCT, PCR, Raman technologies, and for quantum-computing testing
Aerospace & Defense
- Replacement components for fighter jets
- High-frequency RF interconnects

Products & Technologies

Product Portfolio

CATV Connector /Components
- F Connector
- BNC Connector
- IEC Connector
- Hardline Connector
- Filter/Attenuator /Isolator
- Surge Arrester
- Cable Assembly
Microwave Connector / Dipole Antenna
- SMA Connector
- SMB Connector
- MCX Connector
- Dipole Antenna
- EP & Cable Assembly
Automobile Connection System
- HDMI-E
- FAKRA-Connector
Active Components (OSA)
- TOSA / ROSA / TRI-DI
- GPON / EPON BOSA
- 10G /25G BOSA
- Combo ONU/OLT BOSA
- Special Application BOSA
Passive Components
- SC/LC/MU Series
- MPO Series
- MT-RJ Series
- FC/ST Series
- Torpedo Cable Series
- Patch Panel Series
MEMS /Aerospace
- MEMS Scanning Module
- AOC cable
Base Station Connector / Arrester
- N Connector
- 7/16 Connector
- Surge Arrester
- Low PIM series
LAB Adaptor
- 50 OHM/75 OHM Adaptor
Transceiver
- Dual Mode TRX
- SFP/SFP+/XFP
- XGS PON Stick
- XGS-PON Triplexes
- XGS-PON OLT Combo /TRX
Medical
- Intravenous laser module
- OCT Laser Module
- 3D inspection module
- Skin-OCT

Patents overview

Total Patents: 179
Patents by year:
- 2014: 10
- 2015: 9
- 2016: 13
- 2017: 13
- 2018: 13
- 2019: 10
- 2020: 22
- 2021: 18
- 2022~2024: 51

Broadband Networks – Access (Last-Mile)

FTTH (Fiber to the Home)
- Components:
  - 10G BOSA (Bi-directional optical sub-assemblies)
  - BOSA Combo (1G, 10G, 25G)
  - Optical Transceivers
Cable Network
- Components:
  - RF connectors
  - amplifiers
  - filters
  - cables, etc.
5G mmWave (40 GHz~65 GHz)
- Connectors: SMP, SMPM, 1.85mm, 2.4mm
- Dimensions: 3.95mm, 3.15mm, 2.85mm (referring to connector sizes)
- Application: Wireless Communications (Satellite communications, Between base stations introducing millimeter wave band, 5G, LTE, Mobile base stations)

AI infrastructure: Scale-out

High density optical fiber interconnects linking data center structures or rooms for AI infrastructure.
Torpedo cable: Contains up to 6912 fiber cores.
System components: Remote extension, Overhead cable management, Fire resistant device (EZ Path), Busways, UPS & STS solutions, High power busbars, Cast Resin transformers, Switchgears, Server rooms, Cassette, LC Cassette.

AI infrastructure: Scale-up

CPO ELS modules expected 2026
- Top view components: CPO substrate, External laser sources, CPO optical modules, Switch IC.
- Side view components: XSR AUI, XSR CZM interface, XSR DSP, TIA/DRV, Optics, Optics PKG, Fiber, Socket, Switch DIE XSR, Package substrate, Host PCB.

Bio Medical & Scientific: OCT and PCR

EZconn provides optical components for PCR (Polymerase chain reaction) machines.
Used as light source module in OCT (Optical Coherence Tomography) products examining under-skin, eyes, teeth, etc.
Module Size: 11x 6 x 4.5 cm
Technologies: OCT, PCR, Raman

Bio Medical: Miniaturized Raman Spectrometers

Application: Currently mainly used by the law enforcement to detect drugs and medicines.
Components: Laser Beam Path, Raman Signal Path, Focusing Lens, Image Sensor.

Biomedical & Scientific: Quantum-computing testing

Superconducting Nanowire Single-Photon Detector
- Function: Photon counting in detective mode with very low dark count.
- Working Temp: 4°K (-269°C)
- Mechanism: Photon absorption in a superconducting nanowire leads to a detected photon event.

Aerospace & Defense: Replacement components for fighter jets

Item: High frequency jumper for aerospace (BMA SEMI-RIGID)
Item: RF relays for aerospace
Item: Micro-D to HDMI for aerospace

Aerospace & Defense: High-frequency RF interconnects

5G mmWave (40 GHz~65 GHz)
- Connectors: SMP, SMPM, 1.85mm, 2.4mm
- Dimensions: 3.95mm, 3.15mm, 2.85mm (referring to connector sizes)
- Application: Wireless Communications (Satellite communications, Between base stations introducing millimeter wave band, 5G, LTE, Mobile base stations)

Outlook & Strategy

2025 revenue US$ 300+ million;
2026 revenue expected to continue to grow.
CPO-ELS modules for AI infrastructure expected 2026.

Additional Data

免責聲明 本次法說會所提供之簡報內容包括對於未來狀況之預測及評估,這些關於未來狀況之陳述乃基於公司目前可得資料所做的預測,涉及風險及不確定性,並可能發生實際結果與預期狀況有重大差異的情形,提醒各位不要過度依賴這些資訊,另除非法律要求,本公司將不負責更新或公告這些預測的結果。

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