鈦昇科技股份有限公司 (8027) 2026Q3 法說會簡報

Company Overview

公司簡介 (Brief Introduction)

• 公司名稱: 鈦昇科技股份有限公司 (E&R ENGINEERING CORPORATION)
• 股票代號: 8027
• 成立時間 (Establish): 1994.10
• 上市時間 (IPO): 2015.6 (8027)
• 資本額 (Capital): NT$ 1.097B (2026/06)
• 員工人數 (Employee): 310
• 全球據點 (Worldwide center): 10
• 總部 (Headquarter): Kaohsiung (高雄)

發展沿革 (E&R Milestone)

• 1994: Founded in Kaohsiung (於高雄成立)
• 1995: Start Laser Marker Develop (開始研發雷射打標機)
• 1996: Ink Marker Develop (研發墨水打標機)
• 1998: Embossed Carrier Tape On Tray Laser Marker Plasma Cleaner (研發載帶盤式雷射打標電漿清洗機)
• 2002: E&R-DG Founded (鈦昇科技(東莞)有限公司成立)
• 2004: E&R-Wuxi Founded (鈦昇科技(無錫)有限公司成立)
• 2007: E&R-SH (鈦昇科技(上海)有限公司)
• 2015: IPO in Taipei Exchange (於台北證券交易所上市)
• 2016: Laser develop Micromachine (研發雷射微加工機)
• 2022: POPLP Develop (研發扇出型面板級封裝設備)
• 2024: E&R-Nantong Founded Plasma Dicing (鈦昇科技(南通)有限公司成立電漿切割設備)
• 2026: YOU ARE HERE (目前)

核心技術 (E&R Core Technology)

• Plasma (RF and Microwave)
  • RF / Microwave
  • Clean & Etching & Desmear
  • Wafer Plasma De-flash
  • Wafer Plasma Dicing
• Laser Solution (Nano, Pico, Femto IR,SHG,UV)
  • Laser Marking
  • Laser Cutting
  • Laser Drilling
  • Laser Scribing
  • Laser Grooving
  • Laser Ablation
  • Laser De-bond
  • Laser Trench
• Inspection
  • Inspection for inner stress
• Carrier Tape
• Automation (S2/S8, Gem-300, SECS/GEM)
  • Semiconductor
  • uLED Industry
  • FPC/Substrate Industry

競爭優勢 (Competitive advantages)

• 客製化能力 (Customization)
  • 提供客戶硬體和軟體上的客製化需求，在各式製程上提供多樣的應用解決方案。
• 研發技術經驗 (R&D Technology)
  • 擁有二十年以上的中、後段封測研發經驗，並提供整體解決方案與新產品開發的服務。
• 全球據點即時服務 (Global Service)
  • 全球技術服務支援，跨越距離，在第一時間提供服務。
• 品質優先 (Quality First)
  • 提供卓越的產品，在地化生產，充分滿足客戶需求。

全球服務據點 (E&R Global support)

• 台灣 (Taiwan)
  • 高雄總公司 (Kaohsiung City (Headquarter))
  • 楠梓加工區服務處 (NEPZ Office)
  • 台中服務處 (Taichung Office)
• 中國 (Mainland China)
  • 上海辰鈦分公司 (Chen Tai Trading CO.LTD, ShangHai)
  • 華東、華南、華北服務處 (East, South, and North China Office)
  • 成都 (Chengdu Office)
• 東南亞 (South East Asia)
  • 菲律賓大馬尼拉地區 (Metro Manila, Philippines)
  • 馬來西亞 吉隆坡 (Kuala Lumpur, Malaysia)
  • 馬來西亞檳城 (Penang, Malaysia)
  • 越南胡志明市 (Ho Chi Minh City, Vietnam)
  • 越南海防市 (Haiphong, Vietnam)
  • 泰國 曼谷 (Bangkok, Thailand)
• 歐美 (Europe and America)
  • 愛爾蘭都柏林 (Dublin, Ireland)
  • 北美波特蘭 (Portland, USA)
  • 北美亞利桑那 (Arizona, USA)
  • 北美新墨西哥 (New Mexico, USA)
  • 哥斯大黎加 (Costa Rica)
  • E&R-USA

Financial Highlights

Finance status 2021-2025 (E&R (KNTD))

Finance status 2026~ (E&R (KNTD))

Products & Technologies

產品分類 (Products)

• 雷射設備 (Laser Equipment)
  • 半導體雷射打印、雷射鑽孔、SIP切割晶圓切割、晶圓劃線、晶圓開槽等。
• 電漿設備 (Plasma Equipment)
  • 電子微接點有機物清除、氧化物清除、氧化矽沉積以及電漿切割等。
• 檢測設備 (Inspection Equipment)
  • 材料表面缺陷檢查、晶圓材料缺陷檢查、先進製程材料分布分析。
• 其他設備 (Other Equipment)
  • 高精度SIP雷射打印、乾冰清洗、軟板雷射切割，乾式清潔設備。

E&R All Products & Solution IC ASSY & TEST

• Laser tech
  • Lead Frame Substrate 2DID Marking
  • EOL Package Lead Frame Substrate Marking
  • EOL Package Boat type Substrate Marking
  • Test Line Tray type Marking
  • CO2 Snow Dry Ice Clean
  • COF/TIF Laser Marking
  • SIP Package Laser Marking trench, cutting
  • Laser Cutting
• Plasma tech
  • RF Batch Plasma Clean
  • RF In-line Plasma Clean
  • Microwave Batch Plasma Clean
  • Microwave In-line Plasma Clean

E&R All Products & Solution Wafer Level

• Laser tech
  • Wafer 2D ID Marking
  • Wafer Topside Marking
  • Wafer Backside Marking
  • Wafer Grooving Wafer Backside Scribing
  • Wafer Dicing Cutting
  • Wafer Drilling
  • Glass Drilling
• Plasma tech
  • Wafer RF Plasma Clean
  • Wafer Microwave Plasma Clean/Descum/Etch
  • Wafer Microwave Plasma Dicing
• Others
  • Si/SiC/GaN/Wafer Raman & PL Tools
  • Wafer AI+AOI Tools

E&R All Products & Solution Panel Level

• Laser tech
  • Panel 2D ID Laser marker
  • Panel Laser Marking & Cutting + sorter
  • Defect mark & Sorter
  • Glass Panel Laser Modification
  • Panel Laser Applications x 6 Apps
• Plasma tech
  • 600/700mm Microwave Plasma Clean/Descum/Etch
• Others
  • Panel AI+AOI Tools
  • Panel Lamination

Outlook & Strategy

Fan Out PLP (扇出型面板級封裝)

• Wafer Process Equipment
  • Wafer Plasma R-300R
  • Wafer Laser Via WLV-300A
  • Wafer with Ring Plasma CL-1000
• Panel (700x700mm) Process Equipment
  • Panel Plasma Descum Before Plating Plasma Before Dry Film (DF) MW-700C-SS / MW-700C
  • Panel Laser Cut Rapid Cut 700
• Q-Panel (212x216mm) Process Equipment
  • Laser Marker B-3700
• Key Process Steps
  • Wafer Sorter, ABF Laminator, Wafer Cu Sputter, Wafer Laser Via, Die Bond, Molding, Grinding, Panel Release and Transfer, Sputter, Photo Resist, Plating, Ball Mount, Reflow, Cu Mask Etch and Via Clean, AOI, Backside Grinding, Wafer Saw, Strip (PR remove), Etching (Sputter), Molding, Grinding, Panel Release and Transfer, Panel Cut, Laser Mark, Package Singulation.

E&R Technology for AI Product

• 2.5D CoWoS/EMIB-T Architecture
  • Components: RF, MEMS, Memory, Logic, Optical Chiplet, Interposer, Package Substrate or PCB.
  • Key Technologies: Laser Marking, Plasma clean before molding, Through Glass Via (TGV) Cavity Solution.
• 3D Info/Foveros Architecture
  • Components: HBM, Optical Chiplet, Package Substrate or PCB.
  • Key Technologies: Laser glass marking, ABF grooving, Laser glass cutting, AOI after Etching, ABF Laser Via, ABF Plasma Descum.

Glass substrate - TGV (玻璃基板 - 矽穿孔)

• Glass Core Process
  • Glass, TGV, Wet etching, AOI, Cu seed Sputter, Cu seed Dip coating, Cu Platting.
• SAP layer Process
  • ABF Lamination, Laser VIA Drill, Desmear / PTH, CF Lam / Exp/ Dev, Cu Plating, CF SE (Strip & Etching), AOI.
• SM layer Process
  • SM RC/ Exp + cure / Dev + UV cure, Surface finish, Solder Paste Printing / Reflow, ABF Remove, Singulation, AEI/AVI/FVI, Packing (Aluminum bag).

Plasma Dicing (電漿切割)

• Process Steps
  • Step 1: Wafer incoming
  • Laser grooving
  • Plasma etching

CPO (共同封裝光學元件 Co-Packaged Optics)

• CPO Architecture
  • Components: CPO 基板 (CPO Substrate), CPO 光引擎模組 (CPO Optical Engine Module), 電子積體電路 (EIC), 光纖陣列單元 (FAU), 雷射二極管 (LD), 光子積體電路 (PIC).
  • Data Rates: 3.2T/1.6T
  • Source: gmtglobal

Additional Data

Contact Information

• Website: www.enr.com.tw