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友通 2026Q3 法人說明會
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友通 2026Q3 法說會簡報重點與營運摘要

DFI 2026Q2 法說會簡報

Company Overview

  • 公司名稱: DFI (友通資訊)
  • 簡報日期: 2026年8月14日
  • 公司標語: Desire for Innovation

Financial Highlights

合併綜合損益表摘要 (單位: 新台幣千元)

項目2026年第二季2026年第一季2025年第二季YTD 2026年1-6月YTD 2025年1-6月
銷貨淨額 (Net Sales)3,707,7633,030,6122,805,9686,738,3755,362,673
營業成本 (Cost of Goods Sold)(2,774,781)(2,276,204)(2,047,640)(5,050,985)(3,865,394)
營業毛利 (Gross Profit)932,982754,408758,3281,687,3901,497,279
營業毛利率25.2%24.9%27.0%25.0%27.9%
營業費用 (Operating Expenses)(646,872)(585,648)(535,972)(1,232,520)(1,075,518)
營業費用率-17.4%-19.3%-19.1%-18.3%-20.1%
營業淨利 (Operating Income)286,110168,760222,356454,870421,761
營業淨利率7.7%5.6%7.9%6.8%7.9%
營業外收支及費用 (Non-operating Income/Expenses)(12,219)(8,171)(37,707)(20,390)(57,423)
稅前淨利 (Income Before Tax)273,891160,589184,649434,480364,338
稅前淨利率7.4%5.3%6.6%6.4%6.8%
本期淨利 (Net Income)206,388120,365139,785326,753278,498
本期淨利率5.6%4.0%5.0%4.8%5.2%
本期淨利歸屬於母公司業主 (Net Income Attributable to Owners of Parent)148,09386,809101,589234,902208,147
基本每股盈餘(NT$)(a) (Basic EPS (NT$)(a))$1.29$0.76$0.89$2.05$1.82
(a)基本每股盈餘以加權平均流通在外股數計算(千股)114,488114,488114,488114,488114,488

合併資產負債表摘要 (單位: 新台幣千元)

項目2026.06.302025.12.312025.06.30
現金及約當現金 (Cash and Cash Equivalents)2,676,131 (18%)2,403,301 (19%)2,213,479 (19%)
應收票據及帳款(含關係人) (Notes and Accounts Receivable (incl. related parties))2,439,175 (17%)2,044,914 (16%)1,962,963 (16%)
存貨 (Inventories)3,865,681 (26%)2,517,513 (21%)2,168,208 (19%)
不動產、廠房及設備 (Property, Plant and Equipment)2,251,445 (15%)2,173,157 (18%)2,220,585 (19%)
總資產 (Total Assets)14,680,102 (100%)12,356,077 (100%)11,717,771 (100%)
流動負債 (Current Liabilities)6,762,469 (46%)4,635,956 (38%)4,127,082 (35%)
非流動負債 (Non-current Liabilities)2,223,971 (15%)2,018,181 (16%)2,050,533 (18%)
權益總計 (Total Equity)5,693,662 (39%)5,701,940 (46%)5,540,156 (47%)
每股淨值 (NT$) (Net Asset Value Per Share (NT$))29.4529.7228.43
每股淨值以流通在外股數計算(千股)114,488114,488114,488

重要財務指標

項目2026.06.302025.12.312025.06.30
應收帳款週轉天數 (Days Sales Outstanding (DSO))617472
存貨週轉天數 (Days Inventory Outstanding (DIO))115121100
應付帳款週轉天數 (Days Payables Outstanding (DPO))797874
營運資金週轉天數 (Cash Conversion Cycle (CCC))9711798
權益報酬率(年化)(a) (Return on Equity (Annualized)(a))11.5%5.7%9.8%
流動比率 (Current Ratio)141%159%163%
(a)採年化稅後損益/平均權益總額 ((a) Annualized Net Income After Tax / Average Total Equity)

Business Segments

營收摘要 (NT$M)

類別2026年1-6月 (NT$M)佔比2025年1-6月 (NT$M)佔比
總計6,738100%5,363100%

應用別 (Application)

應用2026年1-6月佔比2025年1-6月佔比
Automation45%41%
Embedded35%37%
Security20%22%

區域別 (Region)

區域2026年1-6月佔比2025年1-6月佔比
Asia Pacific49%49%
EMEA26%23%
America25%28%

產品別 (Product)

產品2026年1-6月佔比2025年1-6月佔比
OT Service45%41%
Computer on Module23%25%
AI Security20%21%
Computer in Box8%9%
Computer with Panel4%4%

Products & Technologies

Future-Ready Industrial Edge AI Computing

  • TOPS: Trillions of Operations Per Second

輕量級 AI (Lightweight AI)

  • TOPS: <30 TOPS, <40 TOPS
  • 應用: Traffic Monitoring, Object Detection, LPR (License Plate Recognition), LLM (Large Language Model)
  • 產品類別:
    • Pure CPU
      • NXP Nano SBC
    • Entry-Level NPU
      • Qualcomm Mini Box PC
      • Intel + M.2 AI Mini Box PC
      • Intel AI Mini Box PC
      • Qualcomm Nano SBC
      • Intel + M.2 AI Mini Box PC
    • Mainstream NPU
      • Intel Mini AI Box
      • Intel Mini SBC
      • Intel Mini SOM

中階 AI (Mid-range AI)

  • TOPS: ~275+ TOPS
  • 應用: Smart City, Traffic Control
  • 產品類別:
    • High-End NPU
      • Intel + MXM AI Compact Box PC
      • Intel + MXM AI Compact Box
    • MXM GPU
      • Intel + MXM AI Box PC
      • Intel + MXM AI Railway Box PC
      • Intel + MXM AI Vehicle Box PC
    • Jetson Orin
      • Intel + NVIDIA Compact AI Box
      • NVIDIA Compact AI Box

高效能 AI (High-performance AI)

  • TOPS: 300+~1500 TOPS
  • 產品類別:
    • PEG GPU
      • Intel Server + GPU Edge Server

友通推進工業AI規模化部署 (DFI Advancing Industrial AI Large-Scale Deployment)

  • 策略聚焦領域: AI 視覺與智慧感知、即時決策與控制,以及機器人與自主系統等多面向應用場景。
  • 核心能力:
    • 聚焦可規模化的AI 商機 (Focus on scalable AI business opportunities)
      • High-Value Applications
      • Large-Scale Deployment
      • Repeatable Solutions
    • 最適算力 (Optimal computing power)
      • Match CPU, GPU, and NPU capabilities to workload, power, and cost requirements.
    • 板卡到系統雙成長引擎 (Dual growth engine from boards to systems)
      • Expand AI computing boards market while accelerating system-level deployment.
    • 工業級量產就緒能力 (Industrial-grade mass production readiness)
      • Rugged Reliability
      • Long-Term Availability
      • Production-Ready Design
  • 應用場景: Machine Vision / AOI, Robotic Arm / Cobot, AGV / AMR, Service Robot

完整邊緣運算佈局,驅動工業 AI 從感知到行動 (Complete Edge Computing Layout, Driving Industrial AI from Perception to Action)

  • SENSE 感知 | 無縫連接 (SENSE Perception | Seamless Connectivity)
    • High-speed sensor connectivity for real-time perception
    • Diverse SBCs (Single Board Computers) · SoMs (System on Modules) · GMSL2 platforms for multi-sensor robotics
  • THINK 決策 | 邊緣AI運算 (THINK Decision | Edge AI Computing)
    • Accelerated AI inference for vision and intelligent workloads
    • Edge AI computers with heterogeneous CPU/GPU/NPU acceleration
    • 合作夥伴: Intel, AMD, NVIDIA, mobilint, DEEPX, HAILO
  • ACT 行動 | 即時精準執行 (ACT Action | Real-time Precise Execution)
    • Deterministic processing for motion control and industrial operations
    • Embedded systems & expansion modules for motor, I/O & fieldbus

Outlook & Strategy

  • 營運展望: (Section title, details not provided in the slides beyond the product strategy)

Additional Data

免責聲明 (Disclaimer)

  • 本次法說會提供之簡報包含前瞻性陳述,內容包含本公司財務狀況、未來擴張計劃及公司策略等訊息。
  • 此前瞻性陳述係基於本公司目前可得資訊對未來事件的期望和預測,儘管本公司認為該期望和預測具合理性,但此類前瞻性聲明仍涉及風險及不確定性。
  • 鑒於這些風險、不確定性及假設,前瞻性事件可能不會發生,且本公司實際結果可能與這些前瞻性聲明中的預期存在重大差異。
  • 若因未來實際結果與預期狀況有重大差異,須公開更新或修改任何前瞻性陳述,本公司將不承擔此責任。

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