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光聖 2026Q3 法人說明會
6442上市
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光聖 2026Q3 法說會簡報重點與營運摘要

EZconn (6442.TW) 2026Q2 法說會簡報

Company Overview

  • 公司名稱: EZconn
  • 標語: Innovating for a sustainable future
  • 成立時間: Established in 1977
  • 股票上市: Listed on Taiwan stock market in 2015 (Stock symbol: 6442.TW)
  • 員工人數: 1400+ employees
  • 總部: Headquarters: Taiwan
  • 海外據點 (Oversea presence): USA, the Philippines, the Czech Republic, the People Republic of China
  • 全球據點 (Global Sites):
    • Trutnov, Czech Republic:
      • Research and Development
      • ISO 9001, ISO-14001
      • Wafer Level Packaging
    • New Taipei City, Taiwan:
      • Headquarters
      • ISO-9001, ISO-14001
      • Low-volume Production
    • Ningbo, China:
      • Research and Development
      • ISO-9001, ISO-14001
      • High-volume Production
    • Lipa, Philippines:
      • Research and Development
      • ISO-9001, ISO-14001
      • High-volume Production
  • 核心競爭力 (Core Competency):
    • Customized Design: Customized designs of optical, mechanical, and electronic packaging.
    • Precision Machinery: Maintaining micro level precision machining capabilities in mass production.
    • Miniaturization: Experienced in miniaturizing modules/components in various applications.
    • Quality Production: Attained quality recognition from 1st tier customers.
    • Intellectual Property: With over 180+ active issued patents and thousands of interconnect designs in its library.

Financial Highlights

  • 單位: 新台幣仟元; %

經營績效-營收與獲利 (Operating Performance - Revenue and Profit)

項目112年度113年度114年度
營業收入2,617,3856,410,40510,527,227
稅前利益247,7531,422,2862,378,298
每股盈餘(元)2.5314.3023.46
毛利率(%)35.55%55.62%57.74%

經營績效-115年上半年度營運狀況 (Operating Performance - H1 2026 Operating Status)

項目114年上半年度115年上半年度
營業收入5,013,4976,386,649
稅前淨利737,5571,972,548
毛利率(%)56.53%59.50%
營業淨利1,176,2461,894,217
每股盈餘(元)6.8519.07

經營績效-財務分析 (Operating Performance - Financial Analysis)

項目2026.6.302025.12.312025.6.30
財務結構
負債占資產比率(%)31.9949.0459.31
償債能力
流動比率(%)217.81268.62163.45
獲利能力
權益報酬率(%)29.3133.7628.71
每股淨值(元)166.1187.9046.37

Business Segments

  • 市場領域 (Market Sectors):
    • Broadband Networks – Access (Last-Mile):
      • Optical engines for “Fiber to the Home" (FTTH) for Telcos
      • RF interconnects for cable service providers
    • AI infrastructure – Hyperscalers (large-scale data centers):
      • Scale-out: high-density fiber deployment connecting data centers' physical structures
      • Scale-up: active silicon photonic CPO-ELS* modules to increase speed and reduce power consumption for GPU's (expected 2026)
      • *CPO-ELS stands for "co-packaging optics with external laser source” - essential chip packaging for AI processing at server level in data centers.
    • Biomedical & Scientific:
      • Miniaturized optical units for testing and probing instruments using OCT, PCR, Raman technologies, and for quantum-computing testing
    • Aerospace & Defense:
      • Replacement components for fighter jets
      • High-frequency RF interconnects

Products & Technologies

  • 產品組合 (Product Portfolio):

    • CATV Connector /Components:
      • F Connector
      • BNC Connector
      • IEC Connector
      • Hardline Connector
      • Filter/Attenuator /Isolator
      • Surge Arrester
      • Cable Assembly
    • Microwave Connector / Dipole Antenna:
      • SMA Connector
      • SMB Connector
      • MCX Connector
      • Dipole Antenna
      • EP & Cable Assembly
    • Automobile Connection System:
      • HDMI-E
      • FAKRA-Connector
    • Active Components:
      • OSA:
        • TOSA/ROSA/ TRI-DI
        • GPON/EPON BOSA
        • 10G/25G BOSA
        • Combo ONU/OLT BOSA
        • Special Application BOSA
      • Transceiver:
        • Dual Mode TRX
        • SFP/SFP+/XFP
        • XGS PON Stick
        • XGS-PON Triplexes
        • XGS-PON OLT Combo /TRX
    • Passive Components:
      • SC/LC/MU Series
      • MPO Series
      • MT-RJ Series
      • FC/ST Series
      • Torpedo Cable Series
      • Patch Panel Series
    • MEMS /Aerospace:
      • MEMS Scanning Module
      • AOC cable
    • Medical:
      • Intravenous laser module
      • OCT Laser Module
      • 3D inspection module
      • Skin-OCT
    • Base Station Connector / Arrester:
      • N Connector
      • 7/16 Connector
      • Surge Arrester
      • Low PIM series
    • LAB Adaptor:
      • 50 OHM/75 OHM Adaptor

  • Broadband Networks – Access (Last-Mile):

    • FTTH (Fiber to the Home):
      • OLT (Optical Line Terminal)
      • ONT (Optical Network Terminal)
      • 10G BOSA (Bi-directional optical sub-assemblies), BOSA Combo (1G, 10G, 25G)
      • Optical Transceivers
    • Cable Network:
      • RF connectors, amplifiers, filters, cables, etc.
    • 5G mmWave (40 GHz~65 GHz):
      • Connectors: SMP, SMPM, 1.85mm, 2.4mm
      • Miniaturized components: 3.95mm, 3.15mm, 2.85mm
    • Wireless Communications:
      • Introducing millimeter wave band between base stations
      • LTE, 5G, Mobile base stations, Satellite communications

  • AI infrastructure: Scale-out:

    • High density optical fiber interconnects linking data center structures or rooms for AI infrastructure.
    • Torpedo cable contains up to 6912 fiber cores.
    • Components: Cassette, LC Cassette, Torpedo cable.
    • System elements: Remote extension, Fire resistant device (EZ Path), Busways, UPS & STS solutions, High power busbars, Cast Resin transformers, Switchgears, Overhead cable management, Server rooms.

  • AI infrastructure: Scale-up:

    • CPO ELS modules expected 2026
    • Components: CPO substrate, External laser sources, CPO optical modules, Switch IC, XSR AUI, XSR CZM interface, XSR DSP, TIA/DRV, Optics PKG, Fiber, Socket, Package substrate, Host PCB.

  • Bio Medical & Scientific: OCT and PCR:

    • EZconn provides optical components for PCR (Polymerase chain reaction) machines.
    • Used as light source module in OCT (Optical Coherence Tomography) products examining under-skin, eyes, teeth, etc.
    • Size: 11x 6 x 4.5 cm
    • OCT image examples: 3D, 2D, Surface, 200 µm, 400 µm, 600 µm, 800 µm.

  • Bio Medical: Miniaturized Raman Spectrometers:

    • Application: Currently mainly used by the law enforcement to detect drugs and medicines.
    • Components: Laser Beam Path, Raman Signal Path, Focusing Lens, Image Sensor.

  • Biomedical & Scientific: Quantum-computing testing:

    • Superconducting Nanowire Single-Photon Detector
    • Photon counting in detective mode with very low dark count
    • Working Temp: 4°K (-269°C)
    • Technology components: Silicon Dioxide, Gold Contact, Silicon, Super conductor, Non super conductor, Photon absorption, Photon Detected.

  • Aerospace & Defense: Replacement components for fighter jets:

    • High frequency jumper for aerospace (BMA SEMI-RIGID)
    • RF relays for aerospace
    • Micro-D to HDMI for aerospace

  • Aerospace & Defense: High-frequency RF interconnects:

    • 5G mmWave (40 GHz~65 GHz) connectors: SMP, SMPM, 1.85mm, 2.4mm
    • Miniaturized components: 3.95mm, 3.15mm, 2.85mm
    • Wireless Communications context: millimeter wave band, LTE, 5G, Mobile base stations, Satellite communications.

Outlook & Strategy

  • 2025年營收預期: US$ 300+ million
  • 2026年營收預期: expected to continue to grow.
  • AI基礎設施 - 擴展 (AI infrastructure - Scale-up): active silicon photonic CPO-ELS modules to increase speed and reduce power consumption for GPU's (expected 2026).

Additional Data

  • 免責聲明 (Disclaimer):
    • 本次法說會所提供之簡報內容包括對於未來狀況之預測及評估，這些關於未來狀況之陳述乃基於公司目前可得資料所做的預測，涉及風險及不確定性，並可能發生實際結果與預期狀況有重大差異的情形，提醒各位不要過度依賴這些資訊，另除非法律要求，本公司將不負責更新或公告這些預測的結果。
  • 專利概覽 (Patents overview):
    • Total Patents: 179
    • Patents by year:
      • 2014: 10
      • 2015: 9
      • 2016: 13
      • 2017: 13
      • 2018: 13
      • 2019: 10
      • 2020: 22
      • 2021: 18
      • 2022~2024: 51

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