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光頡 2026Q4 法人說明會
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法人說明會
光頡 2026Q4 法說會簡報重點與營運摘要

光頡科技股份有限公司 Viking Tech Corp. 法說會簡報

Company Overview

  • 公司名稱: 光頡科技股份有限公司 (Viking Tech Corp.)
  • 成立日期: 1997年10月
  • 資本額: 11.73億元
  • 上櫃時間: 2011年
  • 營運總部: 台灣 新竹
  • 工廠:
    • 新竹一廠
    • 新竹二廠
    • 高雄廠
    • 無錫廠
  • 標語: Your Reliable Partner

Products & Technologies

  • 核心技術:
    • 薄膜技術 (Thin Film Technology)
    • 厚膜技術 (Thick Film Technology)
    • 合金技術 (Alloy Technology)
    • RF
  • 主要產品類別 (依技術):
    • Precision Resistor
    • MELF Resistor
    • Current Sensing
    • MLCC Capacitor
    • RF Inductor
    • Ferrite Inductor
    • Power Inductor
    • Functional Resistor
    • General Resistor
    • (內部技術分類: Thin Film, Thick Film, Wirewound, Multilayer, Metal)
  • 產品簡介:
    • 電阻系列:
      • 薄膜精密電阻 (Thin Film Precision Resistor)
      • 厚膜電阻 (Thick Film Resistor)
      • 高阻值電阻 (High Ohmic Resistor)
      • 高壓電阻 (High Voltage Resistor)
      • 微電阻 (Micro Resistor)
      • 金屬膜精密電阻 (Metal Film Precision Resistor)
      • 功率電阻 (Power Resistor)
      • 汽車級 (Automotive Grade)
      • 抗硫化精密電阻 (Anti-Sulfur Precision Resistor)
      • 超低電阻(合金)貼片電阻 (Ultra Low Resistance (Alloy) Chip Resistor)
      • 排阻 (Resistor Array)
      • 其他特殊電阻 (Other Special Resistors)
    • 電感系列:
      • 薄膜高頻電感 (Thin Film High Frequency Inductor)
      • 繞線高頻電感 (Wirewound High Frequency Inductor)
      • 積層高頻電感 (Multilayer High Frequency Inductor)
      • 一般晶片電感 (General Chip Inductor)
      • SMD功率電感 (SMD Power Inductor)
      • EMI濾波器 (EMI Filter)
    • 電容系列:
      • 積層陶瓷電容 (Multilayer Ceramic Capacitor)
      • 高Q值和低ESR (High Q and Low ESR)
      • 超高Q值和低ESR (Ultra High Q and Low ESR)

Clients & Markets

  • 主要應用市場 (市場佔比):
    • 汽車工業 (Automotive Industry): 44%
    • 工業用 (Industrial Use): 21%
    • AI: 13%
    • 代工 (OEM/ODM): 9%
    • 航空/軍用 (Aerospace/Military): 8%
    • 醫學用 (Medical Use): 5%
  • 詳細應用領域:
    • AI: Sever (Server), GPU, SWITCHING, DATACENTER, SEVER POWER。
    • 工業性: 智能儀器儀表 (Smart Instrumentation), 電源供應器 (Power Supplies), 光纖 (Fiber Optics), 工業機器人 (Industrial Robots)…
    • 醫療性: AED(電擊器) (AED (Defibrillator)), 個人健康電子儀器 (Personal Health Electronic Devices), 血壓計 (Blood Pressure Monitors), 心電圖顯示 (ECG Displays), 配藥機 (Medication Dispensers)…
    • 車用性: BMS, ADAS, ESU(車身穩定控制) (ESU (Electronic Stability Unit)), ECU, 充電樁 (Charging Piles), 車燈 (Car Lights), 娛樂設備 (Infotainment Systems), 電子鎖 (Electronic Locks), 後視感應 (Rearview Sensors)…
    • 航空/軍用: 通信系統 (Communication Systems), 衛星系統 (Satellite Systems)…
  • 主要客戶:
    • Industrial / Medical: PEPPERL+FUCHS, Great Wall (長城), Danfoss, MW MEAN WELL, ABB, SMA, Tyco Electronics, OMRON, SIEMENS, Roche, UNI-T, ADVANTECH, mindray 迈瑞 (Mindray), Johnson & Johnson, Rossmax®, 国家电网 STATE GRID (State Grid), 南瑞集团公司 NARI GROUP CORPORATION (NARI Group Corporation), LARSEN & TOUBRO, Agilent Technologies
    • Automotives: BOSCH, HELLA, MARELLI, KIA, MARQUARDT, HYUNDAI MOBIS, CASCO, Hyundai, BMW
    • Aerospace / Military: AAI AeroVision Avionics, Inc. 利翔航太電子股份有限公司

Business Segments

  • 主要產品之銷售比重:
    • 精密電阻 (Precision Resistor): 57%
    • 一般電阻 (General Resistor): 36%
    • 高頻電感 (High Frequency Inductor): 5%
    • 其他 (Others): 2%

Financial Highlights

合併綜合損益表 (Consolidated Income Statement)

單位: 新台幣仟元 (NT$ Thousand)

項目 (Item)2023年 (2023)2024年 (2024)2025年 (2025)2026年1~8月 (Jan-Aug 2026)
營業收入 (Operating Revenue)2,553,243 (100.0%)2,581,140 (100.0%)2,675,360 (100.0%)2,341,622 (100.0%)
營業成本 (Operating Costs)(1,845,306) (72.3%)(1,913,189) (74.1%)(1,998,731) (74.7%)(1,580,716) (67.5%)
營業毛利 (Gross Profit)707,937 (27.7%)667,951 (25.9%)676,629 (25.3%)760,906 (32.5%)
營業費用 (Operating Expenses)(399,343) (15.6%)(421,653) (16.3%)(416,931) (15.6%)(335,272) (14.3%)
營業利益 (Operating Income)308,594 (12.2%)246,298 (9.6%)259,698 (9.7%)425,634 (18.2%)
營業外收入及支出 (Non-operating Income and Expenses)16,753 (0.7%)52,816 (2.0%)20,190 (0.8%)31,675 (1.4%)
稅前淨利 (Profit Before Tax)325,347 (12.7%)299,114 (11.6%)279,888 (10.5%)457,309 (19.5%)
所得稅費用 (Income Tax Expense)(63,151) (2.5%)(54,536) (2.1%)(58,088) (2.2%)(110,082) (4.7%)
本期淨利 (Net Profit for the Period)262,196 (10.3%)244,578 (9.5%)221,800 (8.3%)347,227 (14.8%)
本期淨利(歸屬於母公司) (Net Profit Attributable to Parent Company)261,813 (10.3%)242,120 (9.4%)218,179 (8.2%)344,611 (14.7%)
每股盈餘(新台幣元) (EPS (NT$))2.232.061.862.94

近期表現與結果 (Recent Performance and Results)

單位: 新台幣仟元 (NT$ Thousand)

項目 (Item)2026年第二季 (Q2 2026)2026年第一季 (Q1 2026)季成長 (QoQ Change(%))2025年第二季 (Q2 2025)年成長 (YoY Change(%))
營業收入 (Operating Revenue)894,919 (100.0%)727,980 (100.0%)22.9705,655 (100.0%)26.8
營業成本 (Operating Costs)(601,435) (67.2%)(520,091) (71.4%)15.6(500,473) (70.9%)20.2
營業毛利 (Gross Profit)293,484 (32.8%)207,889 (28.6%)41.2205,182 (29.1%)43.0
營業費用 (Operating Expenses)(127,850) (14.3%)(111,461) (15.3%)14.7(95,813) (13.6%)33.4
營業利益 (Operating Income)165,634 (18.5%)96,428 (13.2%)71.8109,369 (15.5%)51.4
營業外收入及支出 (Non-operating Income and Expenses)8,572 (0.9%)21,966 (3.0%)61.0(93,607) (13.3%)109.2
稅前淨利 (Profit Before Tax)174,206 (19.5%)118,394 (16.3%)47.115,762 (2.2%)1005.2
所得稅費用 (Income Tax Expense)(42,825) (4.8%)(29,414) (4.0%)45.6(16,713) (2.4%)156.2
本期淨利 (Net Profit for the Period)131,381 (14.7%)88,980 (12.2%)47.7(951) (0.1%)13915.0
本期淨利(歸屬於母公司) (Net Profit Attributable to Parent Company)130,556 (14.6%)87,930 (12.1%)48.5(1,720) (0.2%)7690.5
每股盈餘(新台幣元) (EPS (NT$))1.110.75(0.01)
項目 (Item)2026年H1 (H1 2026)2025年H1 (H1 2025)年成長 (YoY Change(%))
營業收入 (Operating Revenue)1,622,899 (100.0%)1,324,650 (100.0%)22.5
營業成本 (Operating Costs)(1,121,525) (69.1%)(955,056) (72.1%)17.4
營業毛利 (Gross Profit)501,374 (30.9%)369,594 (27.9%)35.7
營業費用 (Operating Expenses)(239,311) (14.7%)(199,744) (15.1%)19.8
營業利益 (Operating Income)262,063 (16.2%)169,850 (12.8%)54.3
營業外收入及支出 (Non-operating Income and Expenses)30,538 (1.9%)(73,104) (5.6%)(141.8)
稅前淨利 (Profit Before Tax)292,601 (18.0%)96,746 (7.3%)202.4
所得稅費用 (Income Tax Expense)(72,240) (4.5%)(33,781) (2.6%)113.8
本期淨利 (Net Profit for the Period)220,361 (13.6%)62,965 (4.8%)250.0
本期淨利(歸屬於母公司) (Net Profit Attributable to Parent Company)218,486 (13.5%)61,539 (4.6%)255.0
每股盈餘(新台幣元) (EPS (NT$))1.860.52

合併資產負債表 (Consolidated Balance Sheet)

單位: 新台幣仟元 (NT$ Thousand)

項目 (Item)2023年 (2023)2024年 (2024)2025年 (2025)2026年8月31日 (Aug 31, 2026)
現金及約當現金 (Cash and Cash Equivalents)792,389 (20.6%)681,702 (17.2%)637,438 (15.6%)819,452 (17.7%)
應收票據及應收帳款 (Notes and Accounts Receivable)507,039 (13.2%)496,243 (12.6%)568,613 (13.9%)851,563 (18.4%)
存貨 (Inventories)795,666 (20.7%)696,023 (17.6%)747,320 (18.2%)967,780 (20.9%)
不動產、廠房及設備 (Property, Plant and Equipment)1,278,070 (33.2%)1,226,708 (31.0%)1,193,298 (29.1%)1,125,570 (24.3%)
總資產 (Total Assets)3,850,385 (100.0%)3,953,387 (100.0%)4,096,171 (100.0%)4,640,046 (100.0%)
短期借款 (Short-term Borrowings)0 (0.0%)0 (0.0%)0 (0.0%)0 (0.0%)
應付票據及應付帳款 (Notes and Accounts Payable)192,479 (5.0%)175,675 (4.4%)219,759 (5.4%)393,927 (8.5%)
流動負債 (Current Liabilities)484,325 (12.6%)493,086 (12.5%)567,608 (13.9%)861,703 (18.6%)
非流動負債 (Non-current Liabilities)75,331 (2.0%)50,081 (1.3%)39,128 (1.0%)51,875 (1.1%)
總負債 (Total Liabilities)559,656 (14.5%)543,167 (13.7%)606,736 (14.8%)913,578 (19.7%)
總權益 (Total Equity)3,290,729 (85.5%)3,410,220 (86.3%)3,489,435 (85.2%)3,726,468 (80.3%)
項目 (Item)2026年6月30日 (June 30, 2026)2026年3月31日 (Mar 31, 2026)季成長 (QoQ Change(%))2025年6月30日 (June 30, 2025)年成長 (YoY Change(%))
現金及約當現金 (Cash and Cash Equivalents)701,616 (15.4%)585,209 (13.6%)19.9720,532 (17.8%)(2.6)
應收票據及應收帳款 (Notes and Accounts Receivable)756,587 (16.6%)629,645 (14.6%)20.2573,652 (14.2%)31.9
存貨 (Inventories)966,478 (21.3%)840,925 (19.5%)14.9700,705 (17.3%)37.9
不動產、廠房及設備 (Property, Plant and Equipment)1,162,913 (25.6%)1,179,192 (27.3%)(1.4)1,202,957 (29.7%)(3.3)
總資產 (Total Assets)4,547,308 (100.0%)4,315,394 (100.0%)5.44,053,185 (100.0%)12.2
短期借款 (Short-term Borrowings)0 (0.0%)0 (0.0%)0 (0.0%)
應付票據及應付帳款 (Notes and Accounts Payable)364,556 (8.0%)304,537 (7.1%)19.7230,165 (5.7%)58.4
流動負債 (Current Liabilities)919,635 (20.2%)690,966 (16.0%)33.1722,005 (17.8%)27.4
非流動負債 (Non-current Liabilities)29,944 (0.7%)34,233 (0.8%)(12.5)41,938 (1.0%)(28.6)
總負債 (Total Liabilities)949,579 (20.9%)725,199 (16.8%)30.9763,943 (18.8%)24.3
總權益 (Total Equity)3,597,729 (79.1%)3,590,195 (83.2%)0.23,289,242 (81.2%)9.4

Strategic Initiatives and Plans

  • 未來公司發展策略:
    • 專注發展核心技術,提升製程能力,滿足第三代半導體規格需求(高壓、高頻、高功率、高溫)。
    • 持續開發與行銷車用/醫療/工業設備應用領域。
    • 開發與行銷高階電子元件,滿足智能產品應用領域。
    • 持續提升顧客滿意度,強化供應關係。

Additional Data

  • 光頡的被動元件優勢 (Viking's Passive Component Advantages):
    • 先進薄膜製程,精密規格 (Advanced Thin Film Process, Precision Specifications)
    • ERP/APS系統管理,有效控制成本 (ERP/APS System Management, Effective Cost Control)
    • 完整尺寸規格,面對各類市場需求 (Complete Range of Sizes and Specifications, Meeting Diverse Market Demands)
    • IATF16949/ISO13485汽車及醫療產業各類認證齊全 (IATF16949/ISO13485 Certifications for Automotive and Medical Industries)
    • 快速反應客製服務 (Fast Response to Customized Services)
    • 高良率,自主材料研發團隊 (High Yield Rate, Independent Material R&D Team)
    • 交期快速,庫存完整,樣品齊全 (Fast Delivery, Complete Inventory, Full Range of Samples)
    • 優秀研發團隊,持續創新 (Excellent R&D Team, Continuous Innovation)

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